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KINSUS — Investor Relations & Filings

Ticker · 3189 ISIN · TW0003189007 TW Manufacturing
Open in API
Filings indexed 2,545 across all filing types
Latest filing 2025-11-11 Investor Presentation
Country TW Taiwan
Listing TW 3189

About KINSUS

www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
114年11月法人說明會簡報 — 318920251111M002.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company locations, product mix, competition landscape, and monthly consolidated revenue. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The content and format strongly indicate it is an investor presentation aimed at providing comprehensive information about the company's technology, market position, and business overview. There is no indication that this is an annual report, earnings release, or regulatory filing. The document length (9414 characters) and the presence of multiple slides with charts and company data support classification as an Investor Presentation.
2025-11-11 Chinese
114年11月法人說明會簡報 — 318920251111E001.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, product mix, competition landscape, and monthly consolidated revenue. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The document length is about 9,414 characters, which is consistent with a presentation rather than a full annual or quarterly report. There is no indication of it being an earnings release, audit report, or legal filing. The content and format strongly suggest it is an investor presentation focused on technology, market position, and company overview.
2025-11-11 Chinese
114年11月法人說明會簡報 — 318920251111M001.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company locations, product mix, competition landscape, and monthly consolidated revenue. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The content and format strongly indicate it is an investor presentation aimed at providing strategic and operational insights to investors. There is no indication that this is an annual report, earnings release, or regulatory filing. The document length (9414 characters) and the presence of multiple slides with charts and company information further support this classification.
2025-11-11 Chinese
114年11月法人說明會簡報
Investor Presentation Classification · 95% confidence The document is a tabular listing of dates, times, locations, and links to presentations for corporate investor meetings, specifically labeled as '法人說明會' which translates to 'investor presentations' or 'institutional investor meetings'. The content includes multiple entries for a company named 景碩 with dates and links to presentation materials. There is no financial data, no regulatory filings, no voting results, no audit information, or other report types. The document is essentially a schedule and summary of investor presentations. According to the filing definitions, this matches the category 'Investor Presentation (IP)', which covers detailed presentations for investors focusing on financials, strategy, and market position. The document length is short and it contains direct links to presentation files, consistent with an investor presentation listing rather than an announcement or a report publication notice. Therefore, the classification is IP with high confidence.
2025-11-11 Chinese
114年第3季財務報告書 — 202504_3189_AIC.pdf
Regulatory Filings
2025-11-07 Chinese
114年第3季財務報告書 — 202504_3189_AIA.pdf
Regulatory Filings
2025-11-07 Chinese

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