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KINSUS — Investor Relations & Filings

Ticker · 3189 ISIN · TW0003189007 TW Manufacturing
Open in API
Filings indexed 2,550 across all filing types
Latest filing 2022-11-07 Investor Presentation
Country TW Taiwan
Listing TW 3189

About KINSUS

www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
111年11月法人說明會簡報 — 318920221104M003.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, monthly revenue, and product mix. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The content and format strongly indicate it is an investor presentation aimed at providing an overview of the company's technology, operations, and market position. There is no indication that this is an annual or quarterly report, audit report, earnings release, or any regulatory filing. The length (8146 characters) and the presence of multiple slides with technical and business content support classification as an Investor Presentation (IP).
2022-11-07 Chinese
111年11月法人說明會簡報 — 318920221104E002.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, monthly revenue, and product mix. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The content and format strongly indicate it is an investor presentation aimed at providing an overview of the company's technology, operations, and market position. There is no indication that this is an annual report, earnings release, or regulatory filing. The length (8146 characters) and detailed content support classification as an Investor Presentation rather than a brief factsheet or announcement.
2022-11-07 Chinese
111年11月法人說明會簡報 — 318920221104M002.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, monthly revenue, and product mix. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The content is consistent with an investor or corporate presentation aimed at providing an overview of the company's technology, operations, and market position. There is no indication that this is an annual report, earnings release, or regulatory filing. The length (8146 characters) and the nature of the content suggest it is a comprehensive presentation rather than a brief factsheet or a report publication announcement. Therefore, the most appropriate classification is Investor Presentation (IP).
2022-11-07 Chinese
111年11月法人說明會簡報 — 318920221104E001.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, monthly revenue, and product mix. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The content and format strongly indicate it is an investor-focused presentation rather than a formal report or regulatory filing. The document length (8146 characters) and the presence of multiple slides with charts and company data support classification as an Investor Presentation (IP).
2022-11-07 Chinese
111年11月法人說明會簡報 — 318920221104M001.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, monthly revenue, and product mix. It includes multiple slides with technical and business information but does not contain formal financial statements, regulatory disclosures, or voting results. The content is educational and strategic in nature, typical of an investor or corporate presentation. The document length is 8146 characters, which is consistent with a presentation rather than a full annual or quarterly report. There is no indication of audit information, legal proceedings, or capital changes. Therefore, the document best fits the category of an Investor Presentation (IP).
2022-11-07 Chinese
111年11月法人說明會簡報
Investor Presentation Classification · 95% confidence The document is a listing of dates and details for multiple corporate presentations to institutional investors, including locations, times, and links to presentation materials. The content focuses on '法人說明會' which translates to 'investor presentations' or 'institutional investor briefings.' There is no indication of full financial reports, audit information, or regulatory filings. The document is essentially a schedule and summary of investor presentations, matching the definition of an Investor Presentation (IP). The document length is short and does not contain detailed financial statements or analysis, but it is not merely an announcement of a report; it provides direct links to presentation materials, consistent with Investor Presentation filings.
2022-11-07 Chinese

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