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KINSUS — Investor Relations & Filings

Ticker · 3189 ISIN · TW0003189007 TW Manufacturing
Open in API
Filings indexed 2,545 across all filing types
Latest filing 2024-06-03 Investor Presentation
Country TW Taiwan
Listing TW 3189

About KINSUS

www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
113年06月法人說明會簡報 — 318920240531M003.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, product mix, company locations, monthly revenue, and basic company information. It includes multiple slides with technical and business information but does not contain financial statements, audit results, voting results, or legal proceedings. The content is educational and strategic in nature, typical of an investor presentation. The document length is 7752 characters, which is consistent with a presentation rather than a full annual or quarterly report. There is no indication that this is a regulatory filing, earnings release, or management report. Therefore, the most appropriate classification is Investor Presentation (IP).
2024-06-03 Chinese
113年06月法人說明會簡報 — 318920240531E002.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, product mix, company locations, monthly revenue, and basic company information. It includes multiple slides with technical and business information but does not contain financial statements, audit results, voting results, or legal proceedings. The content is educational and strategic in nature, typical of an investor presentation. The document length is 7752 characters, which is consistent with a presentation rather than a full annual or quarterly report. There is no indication that this is a regulatory filing, earnings release, or management report. Therefore, the most appropriate classification is Investor Presentation (IP).
2024-06-03 Chinese
113年06月法人說明會簡報 — 318920240531M002.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, product mix, company locations, monthly revenue, and basic company information. It includes multiple slides with technical and business information but does not contain financial statements, audit information, or regulatory disclosures. The content is educational and promotional in nature, typical of an investor or corporate presentation. There is no indication that this is an annual report, earnings release, or regulatory filing. The length (7752 characters) and the structure with multiple slides and images omitted suggest it is a presentation document. Therefore, the most appropriate classification is Investor Presentation (IP).
2024-06-03 Chinese
113年06月法人說明會簡報 — 318920240531E001.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, monthly revenue, and product mix. It contains multiple slides with technical and business information but does not include financial statements, regulatory disclosures, or formal report structures typical of annual or interim reports. The content is educational and promotional in nature, aimed at explaining the company's technology and business overview. The length is about 7,752 characters, which is consistent with a presentation document rather than a full financial report. There is no indication of earnings release, audit report, or regulatory filing. Therefore, the document best fits the category of an Investor Presentation (IP).
2024-06-03 Chinese
113年06月法人說明會簡報 — 318920240531M001.pdf
Investor Presentation Classification · 95% confidence The document is a detailed presentation about Kinsus Interconnect Technology Corp., covering topics such as IC packaging technology, company basic information, locations, monthly revenue, and product mix. It contains multiple slides with technical and business information but does not include financial statements, regulatory disclosures, or voting results. The content is educational and promotional in nature, typical of an investor presentation. The document length is 7,752 characters, which is consistent with a presentation rather than a full annual or quarterly report. There is no indication of audit information, legal proceedings, or management changes. Therefore, the document best fits the category of an Investor Presentation (IP).
2024-06-03 Chinese
113年06月法人說明會簡報
Investor Presentation Classification · 95% confidence The document is a listing of scheduled dates and details for corporate investor presentations (法人說明會) including times, locations, and links to presentation materials. The content focuses on presentations to institutional investors about industry conditions and company performance, which aligns with investor presentations. The document length is short and it is not a full report or financial statement. Therefore, it is classified as an Investor Presentation (IP).
2024-06-03 Chinese

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