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KINSUS — Investor Relations & Filings

Ticker · 3189 ISIN · TW0003189007 TW Manufacturing
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Filings indexed 2,550 across all filing types
Latest filing 2018-07-30 Interim / Quarterly Rep…
Country TW Taiwan
Listing TW 3189

About KINSUS

www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
公告本公司董事會通過107年第2季合併財務報表
Interim / Quarterly Report Classification · 95% confidence The document is a public announcement from company 3189 景碩 regarding the approval of the consolidated financial statements for the second quarter of fiscal year 107 (which corresponds to 2018 in the Gregorian calendar). It includes summarized financial data such as total assets, liabilities, equity, revenue, net income, comprehensive income, and earnings per share for the half-year and the second quarter. The document is relatively short (1744 characters) and is structured as a formal announcement of the board's approval of the quarterly financial report, rather than the full detailed report itself. There is no indication that this is a full interim report with detailed financial statements and analysis, but rather a notification of the board's approval and summary financial figures. This fits the definition of an Interim / Quarterly Report (IR) as it contains substantive financial data for a period shorter than a full fiscal year (the second quarter). Therefore, the appropriate classification is IR with high confidence. Q2 2018
2018-07-30 Chinese
公告本公司董事會決議107年發行限制員工權利新股之 增資基準日
Share Issue/Capital Change Classification · 95% confidence The document is a company announcement regarding a board resolution on the issuance of restricted employee stock rights and the capital increase base date. It includes details about the board meeting date, approval by regulatory authority, number of shares, and issuance price. The content is about a capital increase and share issuance, not a full financial report or earnings release. The document length is short (787 characters) and it is an announcement of a capital change event. Therefore, the appropriate classification is Share Issue/Capital Change (SHA).
2018-07-30 Chinese
公告本公司董事會決議配息基準日
Notice of Dividend Amount Classification · 100% confidence The document is a short announcement from a company regarding the board resolution on the dividend distribution date, including details such as dividend amount, ex-dividend date, and record dates. It does not contain financial statements or detailed financial analysis. The content matches the description of a Notice of Dividend Amount filing, which announces dividend amounts and payment details to shareholders.
2018-07-30 Chinese
107年7月公開說明書 — 202601_3189_B04.pdf
Regulatory Filings
2018-07-12 Chinese
107年7月公開說明書 — 202512_3189_B011.pdf
Regulatory Filings
2018-07-12 Chinese
107年7月公開說明書 — 202407_3189_B1g.pdf
Regulatory Filings
2018-07-12 Chinese

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