ILJIN DISPLAY CO.,LTD.
020760 | KO
Overview
Corporate Details
- ISIN(s):
- KR7020760005
- LEI:
- Country:
- South Korea
- Address:
- 충청북도 음성군 대소면 대금로 157, 음성군
- Website:
- http://www.iljindisplay.co.kr
- Sector:
- Manufacturing
- Industry:
- Manufacture of electronic components and boards
Description
No description available.
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Bulk Actions:
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-09-11 00:00 |
Regulatory Filings
생산중단
|
Korean | 7.7 KB | ||
| 2025-09-11 00:00 |
Regulatory Filings
[기재정정]생산중단
|
Korean | 11.9 KB | ||
| 2025-09-11 00:00 |
Delisting Announcement
기타시장안내 (상장적격성 실질심사 사유 발생)
|
Korean | 5.3 KB | ||
| 2025-09-08 00:00 |
Pre-Annual General Meeting Information
주주총회소집공고
|
Korean | 41.2 KB | ||
| 2025-09-08 00:00 |
Proxy Solicitation & Information Statement
의결권대리행사권유참고서류
|
Korean | 42.3 KB | ||
| 2025-08-14 00:00 |
Interim / Quarterly Report
반기보고서 (2025.06)
|
Korean | 1.1 MB | ||
| 2025-08-14 00:00 |
Pre-Annual General Meeting Information
주주명부폐쇄기간또는기준일설정
|
Korean | 3.8 KB | ||
| 2025-08-14 00:00 |
Pre-Annual General Meeting Information
주주총회소집결의
|
Korean | 7.9 KB | ||
| 2025-07-14 00:00 |
Share Issue/Capital Change
전환가액ㆍ신주인수권행사가액ㆍ교환가액의조정(안내공시)
|
Korean | 12.9 KB | ||
| 2025-05-15 00:00 |
Quarterly Report
분기보고서 (2025.03)
|
Korean | 1.1 MB | ||
| 2025-04-14 00:00 |
Share Issue/Capital Change
전환가액ㆍ신주인수권행사가액ㆍ교환가액의조정(안내공시)
|
Korean | 12.0 KB | ||
| 2025-03-31 00:00 |
Capital/Financing Update
타인에대한채무보증결정
|
Korean | 15.5 KB | ||
| 2025-03-31 00:00 |
Related Party Transaction
[기재정정]타인에대한채무보증결정
|
Korean | 19.3 KB | ||
| 2025-03-28 00:00 |
Board/Management Information
사외이사의선임ㆍ해임또는중도퇴임에관한신고
|
Korean | 10.3 KB | ||
| 2025-03-28 00:00 |
AGM Information
정기주주총회결과
|
Korean | 31.2 KB |
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Market Data
Market Data Not Available
Last Price
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Market Cap
N/A
Volume
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
Company
Country
Ticker
View
Designs & makes interconnect, sensor & antenna solutions for automotive, aerospace, IT & mobile markets.
United States of America
APH
United States of America
APH
Designs optical solutions like LEDs and sensors for automotive, medical, and industrial markets.
Austria
AMS
Austria
AMS
Designs high-performance analog and mixed-signal ICs for industrial, auto, and comms markets.
United States of America
ADI
United States of America
ADI
Fabless chip designer of TCONs and SoCs for the global high-resolution display market.
South Korea
123860
South Korea
123860
Provider of outsourced semiconductor packaging and testing (OSAT) for various electronic components.
Japan
6832
Japan
6832
Back-end semiconductor services, including packaging, testing, and inspection equipment.
South Korea
200470
South Korea
200470
Global provider of outsourced semiconductor assembly, testing (OSAT) & manufacturing services.
United States of America
ASX
United States of America
ASX
Supplies advanced high-tech PCBs and lifecycle services to the global electronics industry.
Finland
ACG1V
Finland
ACG1V
Manufactures sanitation products, complex molded parts, and protective semiconductor materials.
Japan
4241
Japan
4241
Manufactures high-end PCBs and IC substrates for mobile, auto, industrial, and medical devices.
Austria
ATS
Austria
ATS