HPSP Co., Ltd. Logo

HPSP Co., Ltd.

Provides high-pressure annealing systems for advanced semiconductor manufacturing.

403870 | KO

Overview

Corporate Details

ISIN(s):
KR7403870009
LEI:
Country:
South Korea
Address:
경기도 화성시 삼성1로1길 26 석우동, 화성시

Description

HPSP Co., Ltd. is a global semiconductor equipment company specializing in the development, manufacturing, and servicing of high-pressure hydrogen annealing systems. Its proprietary High Pressure Anneal Process (HPAP) technology is a critical component in the production of cutting-edge semiconductors, providing atomic-scale precision control for ultra-fine manufacturing processes. The company's equipment is utilized by leading global semiconductor manufacturers to produce the advanced chips found in electronics such as smartphones, computers, and smart cars. HPSP also offers dedicated customer support to maximize productivity, improve throughput, and optimize system uptime for its clients.

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Date Filing Language Size Actions
2025-03-28 00:00
사외이사의선임ㆍ해임또는중도퇴임에관한신고
Korean 11.4 KB
2025-03-28 00:00
정기주주총회결과
Korean 37.8 KB
2025-03-20 00:00
감사보고서제출
Korean 17.7 KB
2025-03-20 00:00
사업보고서 (2024.12)
Korean 395.9 KB
2025-03-13 00:00
주주총회소집공고
Korean 124.5 KB
2025-03-13 00:00
주주총회집중일개최사유신고
Korean 5.4 KB
2025-02-13 00:00
주주총회소집결의
Korean 19.7 KB
2025-02-13 00:00
현금ㆍ현물배당결정
Korean 8.8 KB
2025-02-13 00:00
주요사항보고서(자기주식처분결정)
Korean 29.1 KB
2025-02-10 00:00
신탁계약해지결과보고서
Korean 38.2 KB
2025-01-31 00:00
임원ㆍ주요주주특정증권등소유상황보고서
Korean 21.5 KB
2025-01-24 00:00
임원ㆍ주요주주특정증권등소유상황보고서
Korean 21.5 KB
2025-01-17 00:00
주식등의대량보유상황보고서(약식)
Korean 72.1 KB
2025-01-10 00:00
임원ㆍ주요주주특정증권등소유상황보고서
Korean 22.3 KB
2025-01-10 00:00
임원ㆍ주요주주특정증권등소유상황보고서
Korean 21.5 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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