
Honor Device Co. Ltd. — Investor Relations & Filings
Honor Device Co. Ltd. is a global provider of smart devices. Its product portfolio includes smartphones, laptops, tablets, and wearable technology. The company is focused on developing an interconnected ecosystem of AI-powered devices, aiming to revolutionize human-to-device interactions. Through significant investment in artificial intelligence, Honor seeks to create a seamless and intelligent user experience across its entire product range. The company's stated goal is to become an iconic global technology brand.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于延长公司向不特定对象发行可转换公司债券股东大会决议有效期及相关授权有效期的公告 | 2024-04-23 | Chinese | |
| 2023年度独立董事述职报告——杨林安 | 2024-04-23 | Chinese | |
| 开展外汇套期保值业务可行性分析报告 | 2024-04-23 | Chinese | |
| 天职业字[2024]21294-2号--深圳欧陆通2023年度内控鉴证报告 | 2024-04-23 | Chinese | |
| 2023年度独立董事述职报告——李天明 | 2024-04-23 | Chinese | |
| 国金证券股份有限公司关于深圳欧陆通电子股份有限公司首次公开发行股票并在创业板上市持续督导之保荐总结报告书 | 2024-04-23 | Chinese |
Browse filings by year
7 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39173718 | 关于延长公司向不特定对象发行可转换公司债券股东大会决议有效期及相关授权有效期的公告 | 2024-04-23 | Chinese | ||
| 39173708 | 2023年度独立董事述职报告——杨林安 | 2024-04-23 | Chinese | ||
| 39173699 | 开展外汇套期保值业务可行性分析报告 | 2024-04-23 | Chinese | ||
| 39173685 | 天职业字[2024]21294-2号--深圳欧陆通2023年度内控鉴证报告 | 2024-04-23 | Chinese | ||
| 39173674 | 2023年度独立董事述职报告——李天明 | 2024-04-23 | Chinese | ||
| 39173664 | 国金证券股份有限公司关于深圳欧陆通电子股份有限公司首次公开发行股票并在创业板上市持续督导之保荐总结报告书 | 2024-04-23 | Chinese | ||
| 39173650 | 2023年度独立董事述职报告——初大智 | 2024-04-23 | Chinese | ||
| 39173643 | 关于2023年度计提信用减值准备和资产减值准备的公告 | 2024-04-23 | Chinese | ||
| 39173637 | 国金证券股份有限公司关于深圳欧陆通电子股份有限公司开展外汇套期保值业务的核查意见 | 2024-04-23 | Chinese | ||
| 39173629 | 2023年度监事会工作报告 | 2024-04-23 | Chinese | ||
| 39173623 | 董事会决议公告 | 2024-04-23 | Chinese | ||
| 39173610 | 天职业字[2024]21294-3号--深圳欧陆通2023年度募集资金存放与使用情况鉴证报告 | 2024-04-23 | Chinese | ||
| 39173601 | 董事会对独董独立性评估的专项意见 | 2024-04-23 | Chinese | ||
| 39173593 | 关于2023年度利润分配预案的公告 | 2024-04-23 | Chinese | ||
| 39173583 | 2023年度内部控制自我评价报告 | 2024-04-23 | Chinese | ||
Market data
Market data not available
Price history
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Honor Device Co. Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/17834/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=17834 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=17834 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=17834 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 17834}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Honor Device Co. Ltd. (id: 17834)"
Report missing filing
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