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HEFEI CHIPMORE TECHNOLOGY CO., LTD. — Investor Relations & Filings

Ticker · 688352 ISIN · CNE1000060H9 Shanghai Stock Exchange Manufacturing
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Filings indexed 426 across all filing types
Latest filing 2025-03-31 Governance Information
Country CN China
Listing Shanghai Stock Exchange 688352

About HEFEI CHIPMORE TECHNOLOGY CO., LTD.

https://www.chipmore.com.cn/

HEFEI CHIPMORE TECHNOLOGY CO., LTD. specializes in advanced integrated circuit packaging and testing services, with a primary focus on display driver IC (DDIC) solutions. The company provides a full-process service chain encompassing gold bumping, wafer probing, and assembly techniques such as Chip on Film (COF) and Chip on Glass (COG). Its technical portfolio supports high-resolution display requirements for OLED and LCD panels used in mobile devices, televisions, and wearable electronics. By leveraging high-precision interconnect technologies and advanced material processing, the company delivers specialized backend manufacturing solutions for high-performance display semiconductors.

Recent filings

Filing Released Lang Actions
合肥颀中科技股份有限公司董事会对独立董事独立性自查情况的专项报告
Governance Information Classification · 95% confidence The document is a special report from the board of directors regarding the independence of the company's independent directors. It references compliance with regulatory rules and internal governance standards but does not contain financial data, audit results, or management discussion of financial performance. It is a governance-related disclosure focused on board independence assessment. The document length is short (480 characters), and it is a standalone report on director independence, which fits best under Governance Information (CGR).
2025-03-31 Chinese
合肥颀中科技股份有限公司第二届监事会第三次会议决议公告
Capital/Financing Update Classification · 95% confidence The document is a detailed announcement of resolutions passed by the Supervisory Board of Hefei Qizhong Technology Co., Ltd. It includes approvals related to the 2024 Annual Report, financial statements, profit distribution plans, and importantly, extensive details on the proposal and plan for issuing convertible bonds to unspecified investors. The document contains detailed terms of the convertible bonds issuance, including bond type, quantity, pricing, interest, conversion terms, redemption, and use of proceeds. It also references the need for shareholder approval and regulatory approvals from the Shanghai Stock Exchange and China Securities Regulatory Commission. The document is lengthy (15,000 characters) and contains substantive content about the financing activity, specifically the issuance of convertible bonds, which is a capital raising event. Therefore, the document is best classified as a Capital/Financing Update (CAP).
2025-03-31 Chinese
合肥颀中科技股份有限公司关于续聘公司2025年度会计师事务所的公告
Audit Report / Information Classification · 95% confidence The document is an announcement regarding the reappointment of the company's accounting firm for the 2025 fiscal year. It details the qualifications, experience, and independence of the auditing firm, the audit fees, and the approval process by the board and audit committee. It does not contain any financial statements or audit results but is a formal notice about the auditor appointment for the upcoming year. This fits the category of Audit Report / Information (AR) as it relates to audit firm appointment and audit-related information but is not a full annual report or audit report itself. The document length is 3316 characters, which is relatively short but contains substantive information about audit firm reappointment rather than just a brief announcement or report publication notice. Therefore, the best classification is AR with high confidence.
2025-03-31 Chinese
合肥颀中科技股份有限公司2024年内部控制评价报告
Regulatory Filings
2025-03-31 Chinese
合肥颀中科技股份有限公司前次募集资金使用情况鉴证报告
Regulatory Filings
2025-03-31 Chinese
合肥颀中科技股份有限公司关于本次募集资金投向属于科技创新领域的说明
Capital/Financing Update Classification · 95% confidence The document is a detailed explanation from Hefei Chipmore Technology Co., Ltd. regarding the use of funds raised from a convertible bond issuance. It extensively discusses the company's business in integrated circuit advanced packaging and testing, the specific projects to be funded, their necessity, feasibility, and alignment with technology innovation fields. The document references regulatory frameworks related to securities issuance and fund usage, and it is dated March 2025. The content focuses on the allocation and justification of raised capital towards technology innovation projects, which aligns with a Capital/Financing Update rather than a full financial report or earnings release. The document is lengthy (over 12,000 characters) and contains substantive information about the capital raising and investment plans, not merely an announcement or a brief summary. Therefore, the most appropriate classification is Capital/Financing Update (CAP).
2025-03-31 Chinese

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