
HEBEI SINOPACK ELECTRONIC TECHNOLOGY CO., LTD. — Investor Relations & Filings
Hebei Sinopack Electronic Technology Co., Ltd. specializes in the research, development, and manufacturing of high-reliability electronic packaging solutions. The company focuses on advanced ceramic packaging technologies, particularly High-Temperature Co-fired Ceramic (HTCC) products. Its portfolio includes ceramic shells, metal packages, glass-to-metal seals, and specialized packaging for microwave, radio frequency (RF), and power electronics. These products are designed to provide critical protection and electrical interconnectivity for integrated circuits and discrete components. Sinopack serves diverse high-tech sectors such as telecommunications, aerospace, automotive electronics, and industrial control systems. By leveraging precision manufacturing and material science, the company provides customized packaging solutions that meet stringent thermal management and hermeticity requirements for complex electronic systems.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2023年第三次临时股东大会决议公告 | 2023-10-11 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理到期赎回公告 | 2023-10-11 | Chinese | |
| 2023年第三次临时股东大会法律意见书 | 2023-10-11 | Chinese | |
| 关于部分募集资金专户完成销户的公告 | 2023-10-11 | Chinese | |
| 关于召开2023年第三次临时股东大会的通知 | 2023-09-25 | Chinese | |
| 关于发行股份购买资产并募集配套资金暨关联交易之标的资产过渡期间损益情况的公告 | 2023-09-25 | Chinese |
Browse filings by year
7 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 39255423 | 2023年第三次临时股东大会决议公告 | 2023-10-11 | Chinese | ||
| 39255406 | 关于使用部分闲置募集资金进行现金管理到期赎回公告 | 2023-10-11 | Chinese | ||
| 39255402 | 2023年第三次临时股东大会法律意见书 | 2023-10-11 | Chinese | ||
| 39255390 | 关于部分募集资金专户完成销户的公告 | 2023-10-11 | Chinese | ||
| 39255384 | 关于召开2023年第三次临时股东大会的通知 | 2023-09-25 | Chinese | ||
| 39255378 | 关于发行股份购买资产并募集配套资金暨关联交易之标的资产过渡期间损益情况的公告 | 2023-09-25 | Chinese | ||
| 39255372 | 关于新增2023年度日常关联交易预计的公告 | 2023-09-25 | Chinese | ||
| 39255364 | 关于河北博威集成电路有限公司资产重组过渡期损益情况的专项审计报告(大华核字[2023]0014263号) | 2023-09-25 | Chinese | ||
| 39255319 | 关于延长公司发行股份购买资产并募集配套资金暨关联交易股东大会决议有效期的公告 | 2023-09-25 | Chinese | ||
| 39255309 | 第二届监事会第十四次会议决议公告 | 2023-09-25 | Chinese | ||
| 39255299 | 关于中国电子科技集团公司第十三研究所氮化镓通信基站射频芯片业务资产重组过渡期损益情况的专项审计报告(大华核字[2023]0014264号) | 2023-09-25 | Chinese | ||
| 39255222 | 关于北京国联万众半导体科技有限公司资产重组过渡期损益情况的专项审计报告(大华核字[2023]0014262号) | 2023-09-25 | Chinese | ||
| 39255176 | 关于设立募集资金专用账户的公告 | 2023-09-25 | Chinese | ||
| 39255161 | 第二届董事会第十六次会议决议公告 | 2023-09-25 | Chinese | ||
| 39255147 | 关于变更公司注册资本及修改公司章程的公告 | 2023-09-25 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
Acbel
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
|
ACTIONS TECHNOLOGY CO., LTD.
Designs low-power wireless and multimedia SoCs for audio an…
|
688049 | CN | Manufacturing |
HEBEI SINOPACK ELECTRONIC TECHNOLOGY CO., LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55015/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55015 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55015 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55015 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55015}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HEBEI SINOPACK ELECTRONIC TECHNOLOGY CO., LTD. (id: 55015)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.