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DOSILICON CO., LTD. — Investor Relations & Filings

Ticker · 688110 ISIN · CNE1000055X6 Shanghai Stock Exchange Manufacturing
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Filings indexed 634 across all filing types
Latest filing 2021-11-28 Capital/Financing Update
Country CN China
Listing Shanghai Stock Exchange 688110

About DOSILICON CO., LTD.

https://www.dosilicon.com/

DOSILICON CO., LTD. is a fabless enterprise specializing in the design, development, and sales of high-performance memory chips. The company's product portfolio primarily includes SLC NAND Flash, NOR Flash, and DRAM solutions, such as DDR3 and LPDDR series. It also provides Multi-Chip Package (MCP) solutions that integrate multiple memory types into a single package. These products are engineered for low power consumption and high reliability, catering to diverse applications including Internet of Things (IoT) devices, consumer electronics, industrial automation, telecommunications infrastructure, and automotive systems. The company focuses on independent research and development to provide scalable memory storage solutions designed to meet the technical requirements of modern embedded systems and smart hardware.

Recent filings

Filing Released Lang Actions
东芯股份首次公开发行股票并在科创板上市网上路演公告
Capital/Financing Update Classification · 95% confidence The document is an announcement regarding the initial public offering (IPO) of Dongxin Semiconductor Co., Ltd. on the STAR Market (科创板). It details the issuance of new shares, the allocation methods (strategic placement, offline and online issuance), and the schedule for an online roadshow to present the offering to investors. The document does not contain financial statements or detailed financial analysis but serves as a notice to investors about the IPO process and the upcoming investor presentation event. Given the content and the short length (1257 characters), this is not a full financial report or earnings release but an announcement related to capital raising and financing activities. Therefore, the most appropriate classification is Capital/Financing Update (CAP).
2021-11-28 Chinese
东芯股份首次公开发行股票并在科创板上市招股意向书
Capital/Financing Update Classification · 95% confidence The document is titled as a "招股意向书" which translates to "Prospectus" or "Offering Intention Document" related to an initial public offering (IPO) and listing on the Shanghai Stock Exchange STAR Market (科创板). It contains detailed information about the stock issuance, risk factors, financial data, company background, and other disclosures typical of an IPO prospectus. It is not an annual report, earnings release, or any other type of periodic financial report. It is a detailed offering document related to capital raising and stock issuance. Therefore, the most appropriate classification is Capital/Financing Update (CAP). The document length is substantial (15,000 characters), indicating it is the full prospectus, not just an announcement or summary.
2021-11-22 Chinese
东芯股份首次公开发行股票并在科创板上市招股意向书附录
Regulatory Filings
2021-11-22 Chinese
东芯股份首次公开发行股票并在科创板上市发行安排及初步询价公告
Capital/Financing Update Classification · 95% confidence The document is a detailed announcement regarding the initial public offering (IPO) of Dongxin Semiconductor Co., Ltd. on the STAR Market (科创板) of the Shanghai Stock Exchange. It includes extensive information about the issuance arrangement, preliminary inquiry, strategic placement, offline and online issuance, pricing methods, lock-up periods, investor qualifications, timetable, and legal compliance. The document references regulatory approvals from the China Securities Regulatory Commission (CSRC) and Shanghai Stock Exchange rules. It is not a financial report, earnings release, or management discussion but rather a comprehensive IPO issuance and pricing announcement. This type of document fits best under the category of Capital/Financing Update (CAP), as it provides updates on the company's fundraising and capital structure changes through the IPO process.
2021-11-22 Chinese

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