DISCO CORPORATION
Precision cutting, grinding & polishing equipment for the semiconductor and electronics industries.
6146 | T
Overview
Corporate Details
- ISIN(s):
- N/A
- LEI:
- Country:
- Japan
- Address:
- 大田区大森北二丁目１３番１１号
- Website:
- https://www.disco.co.jp/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
DISCO Corporation is a leading manufacturer of precision processing equipment and tools for the semiconductor and electronics industries. The company's core competency is its advanced 'Kiru, Kezuru, Migaku' (cutting, grinding, polishing) technologies. Its product portfolio includes dicing saws, laser saws, grinders, and polishers essential for processing semiconductor wafers and other electronic materials. In addition to equipment sales, DISCO provides comprehensive solutions, including application support with test cuts, dicing and grinding services for prototyping and low-volume production, and customer training for equipment operation and maintenance.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-08-01 08:30 |
Share Issue/Capital Change
訂正臨時報告書
|
Japanese | 53.1 KB | ||
| 2025-07-17 09:00 |
Share Issue/Capital Change
臨時報告書
|
Japanese | 55.6 KB | ||
| 2025-07-17 09:00 |
Share Issue/Capital Change
臨時報告書
|
Japanese | 30.9 KB | ||
| 2025-06-25 02:53 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 24.4 KB | ||
| 2025-06-24 09:35 |
Regulatory News Service
内部統制報告書－第86期(2024/04/01－2025/03/31)
|
Japanese | 22.6 KB | ||
| 2025-06-24 09:34 |
Regulatory News Service
確認書
|
Japanese | 8.2 KB | ||
| 2025-06-24 09:33 |
Annual Report
有価証券報告書－第86期(2024/04/01－2025/03/31)
|
Japanese | 2.1 MB | ||
| 2024-10-31 07:58 |
Report Publication Announcement
確認書
|
Japanese | 8.5 KB | ||
| 2024-10-31 07:57 |
Interim Report
半期報告書－第86期(2024/04/01－2025/03/31)
|
Japanese | 170.2 KB | ||
| 2024-08-02 08:00 |
Share Issue/Capital Change
訂正臨時報告書
|
Japanese | 53.2 KB | ||
| 2024-07-18 09:02 |
Share Issue/Capital Change
臨時報告書
|
Japanese | 55.7 KB | ||
| 2024-07-18 09:00 |
Share Issue/Capital Change
臨時報告書
|
Japanese | 31.1 KB | ||
| 2024-06-24 03:33 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 25.4 KB | ||
| 2024-06-21 09:22 |
Registration Form
確認書
|
Japanese | 8.2 KB | ||
| 2024-06-21 09:20 |
Governance Information
内部統制報告書－第85期(2023/04/01－2024/03/31)
|
Japanese | 22.3 KB |
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Market Data
Market Data Not Available
Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
