Di-Nikko Engineering Co.,Ltd. Logo

Di-Nikko Engineering Co.,Ltd.

Full-service EMS/ODM for electronics in automotive, medical, and industrial sectors.

6635 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
日光市根室697−1
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

Di-Nikko Engineering Co., Ltd. is an electronics manufacturing services (EMS) and original design manufacturer (ODM) provider. The company offers a comprehensive suite of solutions for electronic products, encompassing circuit design, electronic component mounting, finished product assembly, testing, and distribution. Its products and modules are utilized across various sectors, including automotive, medical devices, semiconductors, public infrastructure, and industrial equipment. Operating under its 'Monozukuri' manufacturing philosophy, the company provides contract manufacturing primarily for major electronic equipment makers. Di-Nikko Engineering maintains a global production network with multiple manufacturing facilities in Japan, China, Thailand, and Vietnam.

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Date Filing Language Size Actions
2025-08-13 05:02
Report Publication Announcement
確認書
Japanese 8.2 KB
2025-08-13 05:01
Interim Report
半期報告書-第47期(2025/01/01-2025/12/31)
Japanese 209.2 KB
2025-04-04 09:46
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.9 KB
2025-03-28 07:42
Post-Annual General Meeting Information
臨時報告書
Japanese 23.1 KB
2025-03-28 07:41
Registration Form
確認書
Japanese 8.2 KB
2025-03-28 07:40
Governance Information
内部統制報告書-第46期(2024/01/01-2024/12/31)
Japanese 22.2 KB
2025-03-28 07:38
Annual Report
有価証券報告書-第46期(2024/01/01-2024/12/31)
Japanese 1.3 MB
2025-03-12 05:04
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.9 KB
2024-09-09 10:03
Board/Management Information
臨時報告書
Japanese 18.3 KB
2024-08-14 08:05
Report Publication Announcement
確認書
Japanese 8.2 KB
2024-08-14 08:03
Interim Report
半期報告書-第46期(2024/01/01-2024/12/31)
Japanese 206.2 KB
2024-05-15 08:01
Report Publication Announcement
確認書
Japanese 8.2 KB
2024-05-15 08:00
Quarterly Report
四半期報告書-第46期第1四半期(2024/01/01-2024/03/31)
Japanese 169.6 KB
2024-03-28 07:02
Post-Annual General Meeting Information
臨時報告書
Japanese 23.2 KB
2024-03-28 07:01
Governance Information
内部統制報告書-第45期(2023/01/01-2023/12/31)
Japanese 22.3 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

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HIROSE ELECTRIC CO.,LTD. Logo
Global manufacturer of high-performance connectors for auto, mobile, & industrial markets.
Japan 6806
HLB innoVation Co.,Ltd. Logo
Manufactures semiconductor lead frames for global markets and develops biotech treatments.
South Korea 024850
Manufactures LED packages and modules for automotive and general lighting applications.
South Korea 036170
HOKURIKU ELECTRIC INDUSTRY CO., LTD. Logo
Global manufacturer of electronic components, specializing in high-precision sensors.
Japan 6989

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