DAEDUCK Co.,LTD Logo

DAEDUCK Co.,LTD

Specialized maker of advanced PCBs & IC substrates for AI, 5G, and autonomous driving.

008060 | KO

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
South Korea
Address:
경기도 안산시 단원구 강촌로 230 (목내동), 안산시
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

Daeduck Co., Ltd. is a specialized manufacturer of advanced Printed Circuit Boards (PCBs). A pioneer in the electronics industry, the company focuses on cutting-edge technology for high-value applications. Its core products include ultra-thin PCBs for semiconductor packaging (IC substrates), such as FC-BGA and FC-CSP, which are essential for delicate and high-density circuits. Daeduck also produces thick, high-multilayer PCBs using specialized raw materials for high-speed and high-frequency network equipment, including 5G communication systems. The company serves global markets, providing critical components for sectors like artificial intelligence, autonomous driving, and consumer electronics.

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Filings

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Date Filing Language Size Actions
2025-08-14 00:00
Interim Report
반기보고서 (2025.06)
Korean 2.4 MB
2025-07-11 00:00
Major Shareholding Notification
신탁계약에의한취득상황보고서
Korean 61.9 KB
2025-07-10 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(약식)
Korean 135.7 KB
2025-05-30 00:00
Governance Information
기업지배구조보고서공시
Korean 847.5 KB
2025-05-15 00:00
Quarterly Report
분기보고서 (2025.03)
Korean 1.6 MB
2025-04-18 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(약식)
Korean 69.4 KB
2025-04-16 00:00
Transaction in Own Shares
주요사항보고서(자기주식취득신탁계약체결결정)(자회사의 주요경영사항)
Korean 30.6 KB
2025-04-16 00:00
Share Issue/Capital Change
주식소각결정(자회사의 주요경영사항)
Korean 10.4 KB
2025-03-28 00:00
Transaction in Own Shares
주요사항보고서(자기주식취득신탁계약체결결정)
Korean 33.5 KB
2025-03-28 00:00
Share Issue/Capital Change
주식소각결정
Korean 9.8 KB
2025-03-28 00:00
Post-Annual General Meeting Information
정기주주총회결과
Korean 22.9 KB
2025-03-28 00:00
Board/Management Information
사외이사의선임ㆍ해임또는중도퇴임에관한신고
Korean 9.7 KB
2025-03-20 00:00
Audit Report / Information
사업보고서 (2024.12)
Korean 415.6 KB
2025-03-18 00:00
Audit Report / Information
감사보고서제출
Korean 19.7 KB
2025-03-17 00:00
Audit Report / Information
감사보고서제출(자회사의 주요경영사항)
Korean 27.2 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
DAP Co., Ltd Logo
Manufacturer of High-Density Interconnect (HDI) PCBs for mobile, wearable, and automotive systems.
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DENSAN CO.,LTD. Logo
One-stop electronic board solutions for medical, defense, and semiconductor industries.
Japan 3640
Dexerials Corporation Logo
Manufacturer of advanced materials like films and adhesives for electronics and automotive sectors.
Japan 4980
Di-Nikko Engineering Co.,Ltd. Logo
Full-service EMS/ODM for electronics in automotive, medical, and industrial sectors.
Japan 6635
Discoverie Group PLC Logo
Designs & manufactures custom electronic components for OEMs in renewable, transport & medical markets.
United Kingdom DSCV
DK TECH CO.,LTD Logo
Manufactures and supplies FPCA modules for the smart device and consumer electronics industries.
South Korea 290550
DongilTechnology Logo
Manufactures EMC, ESD, Piezo, and industrial solutions for global electronics manufacturers.
South Korea 032960
DONGWOON ANATECH CO.,LTD. Logo
Designs analog ICs like AF/OIS and haptic drivers for smartphone and automotive markets.
South Korea 094170

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