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ChipMOS TECHNOLOGIES INC. — Investor Relations & Filings

Ticker · 8150 ISIN · TW0008150004 TW Manufacturing
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Filings indexed 16 across all filing types
Latest filing 2026-05-12 Interim / Quarterly Rep…
Country TW Taiwan
Listing TW 8150

About ChipMOS TECHNOLOGIES INC.

https://www.chipmos.com

ChipMOS TECHNOLOGIES INC. is a global provider of outsourced semiconductor assembly and test services, specializing in back-end manufacturing solutions for high-density memory, liquid crystal display (LCD) driver ICs, and mixed-signal semiconductors. The company maintains a significant market position, notably ranking as the world's second-largest provider of LCD driver IC assembly and testing capacity. Its core service portfolio encompasses wafer bumping, diverse packaging technologies—including leadframe and organic substrate-based assembly—and comprehensive testing for a broad spectrum of integrated circuits. ChipMOS serves a global clientele of fabless companies, integrated device manufacturers, and foundries. Its technical expertise supports applications in personal computing, communications, and consumer electronics, focusing on high-frequency and high-density memory products to meet advanced performance requirements.

Recent filings

Filing Released Lang Actions
115年第1季財務報告書 — 202601_8150_AIA.pdf
Interim / Quarterly Report Classification · 95% confidence The document is a complete set of consolidated financial statements for ChipMOS Technologies Inc. and subsidiaries, covering the three months ended March 31, 2026 and 2025. It includes a review report by independent accountants, balance sheets, statements of comprehensive income, cash flows, and extensive notes, consistent with an interim/quarterly financial report under IFRS (IAS 34) rather than a mere announcement. Therefore, it is classified as an Interim/Quarterly Report. Q1 2026
2026-05-12 English
115年第1季財務報告書 — 202601_8150_AI1.pdf
Interim / Quarterly Report Classification · 95% confidence The document is a consolidated interim financial report for the first quarter (Q1) of fiscal years 114 and 115, including unaudited/ reviewed financial statements (balance sheet, income statement, cash flows) and detailed notes. It explicitly references IFRS 34 “Interim Financial Reporting” and contains substantive financial data for a period shorter than a full year. This matches the definition of an Interim/Quarterly Report. Q1 115
2026-05-12 Chinese
公告本公司民國115年第一季合併財務報告董事會預計召開 日期為115年05月12日
Regulatory Filings
2026-05-04 Chinese
115年年報及股東會資料 — 2026_8150_20260526F02.pdf
AGM Information Classification · 95% confidence The document is titled “115年股東常會議事手冊” (Shareholders’ Annual General Meeting Handbook) for ChipMOS Technologies Inc., and contains the AGM agenda, procedures, resolutions, business report, audit committee report, financial statements, dividend proposals, and other attachments used during the Annual General Meeting. This matches the definition of “AGM Information (AGM-R)” — materials shared at an AGM. It is not merely an announcement or a separate full annual report but the meeting materials themselves.
2026-04-24 Chinese
115年年報及股東會資料 — 2026_8150_20260526F13.pdf
AGM Information Classification · 90% confidence The document is the comprehensive proceedings manual (議事手冊) for the company’s 115th Annual General Meeting of shareholders, including agenda, meeting procedures, and attachments (operating report, audit reports, financial statements, dividend distribution tables, company charter, etc.) to be presented at the AGM. This matches the definition of AGM Information (AGM-R).
2026-04-24 Chinese
115年年報及股東會資料 — 2026_8150_20260526FE1.pdf
AGM Information Classification · 90% confidence The document is a notice convening the company’s 2026 Annual Shareholders’ Meeting, listing the date, venue, agenda items (report items, matters for ratification, discussion items, etc.), and related procedural details. This is clearly an AGM meeting notice and agenda, which falls under AGM Information.
2026-04-24 English

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