ChipMOS TECHNOLOGIES INC. — Investor Relations & Filings
ChipMOS TECHNOLOGIES INC. is a global provider of outsourced semiconductor assembly and test services, specializing in back-end manufacturing solutions for high-density memory, liquid crystal display (LCD) driver ICs, and mixed-signal semiconductors. The company maintains a significant market position, notably ranking as the world's second-largest provider of LCD driver IC assembly and testing capacity. Its core service portfolio encompasses wafer bumping, diverse packaging technologies—including leadframe and organic substrate-based assembly—and comprehensive testing for a broad spectrum of integrated circuits. ChipMOS serves a global clientele of fabless companies, integrated device manufacturers, and foundries. Its technical expertise supports applications in personal computing, communications, and consumer electronics, focusing on high-frequency and high-density memory products to meet advanced performance requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公告本公司民國115年第一季合併財務報告董事會預計召開 日期為115年05月12日 | 2026-05-04 | Chinese | |
| 115年年報及股東會資料 — 2026_8150_20260526F02.pdf | 2026-04-24 | Chinese | |
| 115年年報及股東會資料 — 2026_8150_20260526F13.pdf | 2026-04-24 | Chinese | |
| 115年年報及股東會資料 — 2026_8150_20260526FE1.pdf | 2026-04-24 | English | |
| 115年年報及股東會資料 — 2026_8150_20260526F01.pdf | 2026-04-24 | Chinese | |
| 係因本公司有價證券於集中交易市場達公布注意交易資訊 標準,故公布相關財務業務等重大訊息,以利投資人區別 瞭解。 | 2026-04-23 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
14 filings
| |||||
| 40863454 | 公告本公司民國115年第一季合併財務報告董事會預計召開 日期為115年05月12日 | 2026-05-04 | Chinese | ||
| 36193102 | 115年年報及股東會資料 — 2026_8150_20260526F02.pdf | 2026-04-24 | Chinese | ||
| 36193067 | 115年年報及股東會資料 — 2026_8150_20260526F13.pdf | 2026-04-24 | Chinese | ||
| 36193015 | 115年年報及股東會資料 — 2026_8150_20260526FE1.pdf | 2026-04-24 | English | ||
| 36192994 | 115年年報及股東會資料 — 2026_8150_20260526F01.pdf | 2026-04-24 | Chinese | ||
| 35637519 | 係因本公司有價證券於集中交易市場達公布注意交易資訊 標準,故公布相關財務業務等重大訊息,以利投資人區別 瞭解。 | 2026-04-23 | Chinese | ||
| 35085789 | 澄清媒體報導事由 | 2026-04-22 | Chinese | ||
| 34479067 | 公告本公司民國114年度海外合併財務報告因適用兩地會計 原則不一致之差異內容說明 | 2026-04-14 | Chinese | ||
| 33993124 | 115年3月背書保證與資金貸與 | 2026-04-10 | Chinese | ||
| 33990429 | 115年3月營業收入 | 2026-04-10 | Chinese | ||
| 33787483 | 115年03月內部人持股異動(事後) | 2026-04-08 | Chinese | ||
| 33787482 | 115年03月董事會成員及持股 | 2026-04-08 | Chinese | ||
| 33700834 | 115年03月內部人持股異動(事後) | 2026-04-07 | Chinese | ||
| 33700599 | 115年03月董事會成員及持股 | 2026-04-07 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
BioSmart Co., Ltd.
A diversified company manufacturing smart cards, surgical d…
|
038460 | KR | Manufacturing |
|
BizLink Holding Inc.
Global provider of interconnect solutions, wire harnesses, …
|
3665 | TW | Manufacturing |
|
BLUETOP CO.,LTD.
Manufactures PCBs for network/communication devices and ele…
|
191600 | KR | Manufacturing |
|
BLUGLASS LIMITED
Develops and manufactures GaN laser diodes using proprietar…
|
BLG | AU | Manufacturing |
|
BOE HC SemiTek Corporation
Develops LED epitaxial wafers and chips for advanced displa…
|
300323 | CN | Manufacturing |
|
BOE TECHNOLOGY GROUP CO., LTD
Global provider of semiconductor display technologies and I…
|
000725 | CN | Manufacturing |
|
BOE Varitronix Limited
Global provider of small-to-medium-sized LCDs and comprehen…
|
710 | BM | Manufacturing |
|
Bomin Electronics Co.,Ltd.
Designs and manufactures high-precision PCBs and advanced i…
|
603936 | CN | Manufacturing |
|
BRAINCHIP HOLDINGS LTD
Develops neuromorphic computing for ultra-low power AI proc…
|
BRN | AU | Manufacturing |
|
Brainhole Technology Limited
Manufactures discrete semiconductors and offers smart techn…
|
2203 | HK | Manufacturing |
ChipMOS TECHNOLOGIES INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52724/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52724 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52724 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52724 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52724}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for ChipMOS TECHNOLOGIES INC. (id: 52724)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.