
CHINA WAFER LEVEL CSP CO.,LTD. — Investor Relations & Filings
China Wafer Level CSP Co., Ltd. specializes in advanced semiconductor packaging and testing services, focusing on Wafer Level Chip Scale Packaging (WLCSP), Fan-out Wafer Level Packaging (FOWLP), and System-in-Package (SiP) solutions. The company provides a comprehensive suite of services including bumping, redistribution layer (RDL) fabrication, and integrated circuit testing. These technologies facilitate the miniaturization and performance enhancement of semiconductor devices across diverse sectors such as mobile communications, consumer electronics, automotive electronics, and the Internet of Things (IoT). By utilizing high-density integration and advanced thermal management, the company delivers high-reliability solutions for image sensors, biometric sensors, and power management ICs. Its technical capabilities support the production of compact, high-speed, and energy-efficient electronic components for a global client base.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶方科技股票交易异常波动公告 | 2026-05-26 | Chinese | |
| 晶方科技2026年第一次临时股东会通知 | 2026-05-26 | Chinese | |
| 晶方科技关于对外投资进展以及增加投资额度的公告 | 2026-05-26 | Chinese | |
| 晶方科技2026年第一次临时股东会材料 | 2026-05-26 | Chinese | |
| 晶方科技:国信证券股份有限公司关于晶方科技分拆所属子公司AnteryonInternationalB.V.至阿姆斯特丹交易所上市之独立财务顾问核查意见 | 2026-05-26 | Chinese | |
| 晶方科技关于2026年第一季度业绩说明会召开情况的公告 | 2026-05-18 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 47077385 | 晶方科技股票交易异常波动公告 | 2026-05-26 | Chinese | ||
| 47077348 | 晶方科技2026年第一次临时股东会通知 | 2026-05-26 | Chinese | ||
| 47077347 | 晶方科技关于对外投资进展以及增加投资额度的公告 | 2026-05-26 | Chinese | ||
| 47076805 | 晶方科技2026年第一次临时股东会材料 | 2026-05-26 | Chinese | ||
| 47076804 | 晶方科技:国信证券股份有限公司关于晶方科技分拆所属子公司AnteryonInternationalB.V.至阿姆斯特丹交易所上市之独立财务顾问核查意见 | 2026-05-26 | Chinese | ||
| 46513379 | 晶方科技关于2026年第一季度业绩说明会召开情况的公告 | 2026-05-18 | Chinese | ||
| 45016678 | 晶方科技2025年年度权益分派实施公告 | 2026-05-11 | Chinese | ||
| 44488206 | 晶方科技关于召开2026年第一季度业绩说明会的公告 | 2026-05-08 | Chinese | ||
| 36909699 | 晶方科技2025年内部控制审计报告 | 2026-02-27 | Chinese | ||
| 36909539 | 晶方科技2025年度审计报告 | 2026-02-27 | Chinese | ||
| 36909532 | 晶方科技董事会审计委员会2025年度履职情况报告 | 2026-02-27 | Chinese | ||
| 36909514 | 晶方科技独立董事2025年度述职报告(王义乾) | 2026-02-27 | Chinese | ||
| 36909506 | 晶方科技关于2025年度计提资产减值准备的公告 | 2026-02-27 | Chinese | ||
| 36909491 | 晶方科技2025年年度股东会材料 | 2026-02-27 | Chinese | ||
| 36909473 | 晶方科技关于会计师事务所2025年度履职情况评估报告 | 2026-02-27 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
BCC Fuba India Ltd.
Manufactures high-precision single-sided, double-sided, and…
|
890235 | IN | Manufacturing |
|
BCnC Co., Ltd.
A specialized manufacturer of parts and materials for semic…
|
146320 | KR | Manufacturing |
|
BeammWave AB
Specializes in digital beamforming solutions for 5G and 6G …
|
BEAMMW | SE | Manufacturing |
|
BEIJING ONMICRO ELECTRONICS CO., LTD.
Fabless designer of RF front-end components and mixed-signa…
|
688790 | CN | Manufacturing |
|
Beijing Relpow Technology Co., Ltd
Manufacturer of high-performance power modules for telecom …
|
300593 | CN | Manufacturing |
|
BEIJING YANDONG MICROELECTRONIC CO., LTD.
IDM specializing in integrated circuit design, wafer fabric…
|
688172 | CN | Manufacturing |
|
Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd.
Produces high-reliability MLCCs and EMI filters for aerospa…
|
603267 | CN | Manufacturing |
|
Beken Corporation
Fabless designer of wireless communication ICs for IoT and …
|
603068 | CN | Manufacturing |
|
BEL FUSE INC /NJ
Designs and manufactures products that power, protect, and …
|
BELFA | US | Manufacturing |
|
BENCHMARK ELECTRONICS INC
Provider of design, manufacturing, and lifecycle services f…
|
BHE | US | Manufacturing |
CHINA WAFER LEVEL CSP CO.,LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57340/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57340 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57340 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57340 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57340}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for CHINA WAFER LEVEL CSP CO.,LTD. (id: 57340)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.