
CHINA WAFER LEVEL CSP CO.,LTD. — Investor Relations & Filings
China Wafer Level CSP Co., Ltd. specializes in advanced semiconductor packaging and testing services, focusing on Wafer Level Chip Scale Packaging (WLCSP), Fan-out Wafer Level Packaging (FOWLP), and System-in-Package (SiP) solutions. The company provides a comprehensive suite of services including bumping, redistribution layer (RDL) fabrication, and integrated circuit testing. These technologies facilitate the miniaturization and performance enhancement of semiconductor devices across diverse sectors such as mobile communications, consumer electronics, automotive electronics, and the Internet of Things (IoT). By utilizing high-density integration and advanced thermal management, the company delivers high-reliability solutions for image sensors, biometric sensors, and power management ICs. Its technical capabilities support the production of compact, high-speed, and energy-efficient electronic components for a global client base.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶方科技股权激励限制性股票回购注销实施公告 | 2024-07-11 | Chinese | |
| 晶方科技:北京观韬中茂(上海)律师事务所关于晶方科技2021年限制性股票激励计划部分限制性股票回购注销实施的法律意见书 | 2024-07-11 | Chinese | |
| 晶方科技2024年半年度业绩预告 | 2024-07-08 | Chinese | |
| 晶方科技关于股份回购进展公告 | 2024-07-02 | Chinese | |
| 晶方科技第五届监事会第十四次临时会议决议公告 | 2024-06-27 | Chinese | |
| 晶方科技关于投资设立全资孙公司的公告 | 2024-06-27 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 36907929 | 晶方科技股权激励限制性股票回购注销实施公告 | 2024-07-11 | Chinese | ||
| 36907923 | 晶方科技:北京观韬中茂(上海)律师事务所关于晶方科技2021年限制性股票激励计划部分限制性股票回购注销实施的法律意见书 | 2024-07-11 | Chinese | ||
| 36907916 | 晶方科技2024年半年度业绩预告 | 2024-07-08 | Chinese | ||
| 36907905 | 晶方科技关于股份回购进展公告 | 2024-07-02 | Chinese | ||
| 36907890 | 晶方科技第五届监事会第十四次临时会议决议公告 | 2024-06-27 | Chinese | ||
| 36907883 | 晶方科技关于投资设立全资孙公司的公告 | 2024-06-27 | Chinese | ||
| 36907866 | 晶方科技第五届董事会第十四次临时会议决议公告 | 2024-06-27 | Chinese | ||
| 36907854 | 晶方科技关于公司高级管理人员辞职的公告 | 2024-06-25 | Chinese | ||
| 36907839 | 晶方科技关于2023年度业绩暨现金分红说明会召开情况的公告 | 2024-06-14 | Chinese | ||
| 36907831 | 晶方科技关于召开2023年度业绩暨现金分红说明会的公告 | 2024-06-04 | Chinese | ||
| 36907823 | 晶方科技关于股份回购进展公告 | 2024-06-03 | Chinese | ||
| 36907821 | 晶方科技2023年年度权益分派实施公告 | 2024-05-17 | Chinese | ||
| 36907810 | 晶方科技2023年年度股东大会决议公告 | 2024-05-10 | Chinese | ||
| 36907797 | 晶方科技关于回购注销限制性股票通知债权人的公告 | 2024-05-10 | Chinese | ||
| 36907790 | 晶方科技2023年年度股东大会法律意见书 | 2024-05-10 | Chinese | ||
Market data
Market data not available
Price history
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CHINA WAFER LEVEL CSP CO.,LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57340/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57340 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57340 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57340 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57340}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for CHINA WAFER LEVEL CSP CO.,LTD. (id: 57340)"
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