
CHINA WAFER LEVEL CSP CO.,LTD. — Investor Relations & Filings
China Wafer Level CSP Co., Ltd. specializes in advanced semiconductor packaging and testing services, focusing on Wafer Level Chip Scale Packaging (WLCSP), Fan-out Wafer Level Packaging (FOWLP), and System-in-Package (SiP) solutions. The company provides a comprehensive suite of services including bumping, redistribution layer (RDL) fabrication, and integrated circuit testing. These technologies facilitate the miniaturization and performance enhancement of semiconductor devices across diverse sectors such as mobile communications, consumer electronics, automotive electronics, and the Internet of Things (IoT). By utilizing high-density integration and advanced thermal management, the company delivers high-reliability solutions for image sensors, biometric sensors, and power management ICs. Its technical capabilities support the production of compact, high-speed, and energy-efficient electronic components for a global client base.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶方科技关于会计师事务所2024年度履职情况评估报告 | 2025-04-18 | Chinese | |
| 晶方科技对外投资进展暨关联交易的公告 | 2025-04-18 | Chinese | |
| 晶方科技关于使用闲置自有资金购买理财产品的公告 | 2025-04-18 | Chinese | |
| 晶方科技审计委员会对会计师事务所2024年度履行监督职责的情况报告 | 2025-04-18 | Chinese | |
| 晶方科技2024年度非经营性资金占用及其他关联资金往来情况说明的专项审核报告 | 2025-04-18 | Chinese | |
| 晶方科技董事会关于独立董事独立性自查情况的专项报告 | 2025-04-18 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
12 filings
| |||||
| 36908481 | 晶方科技关于会计师事务所2024年度履职情况评估报告 | 2025-04-18 | Chinese | ||
| 36908480 | 晶方科技对外投资进展暨关联交易的公告 | 2025-04-18 | Chinese | ||
| 36908469 | 晶方科技关于使用闲置自有资金购买理财产品的公告 | 2025-04-18 | Chinese | ||
| 36908462 | 晶方科技审计委员会对会计师事务所2024年度履行监督职责的情况报告 | 2025-04-18 | Chinese | ||
| 36908449 | 晶方科技2024年度非经营性资金占用及其他关联资金往来情况说明的专项审核报告 | 2025-04-18 | Chinese | ||
| 36908425 | 晶方科技董事会关于独立董事独立性自查情况的专项报告 | 2025-04-18 | Chinese | ||
| 36908416 | 晶方科技独立董事2024年度述职报告 (鞠伟宏) | 2025-04-18 | Chinese | ||
| 36908403 | 晶方科技2024年年度报告 | 2025-04-18 | Chinese | ||
| 36908380 | 晶方科技2024年度审计报告 | 2025-04-18 | Chinese | ||
| 36908237 | 晶方科技2024年年度报告 | 2025-04-18 | Chinese | ||
| 36908235 | 晶方科技独立董事2024年度述职报告 (钱跃竑) | 2025-04-18 | Chinese | ||
| 36908226 | 晶方科技2024年年度业绩预告 | 2025-01-20 | Chinese | ||
|
2024
3 filings
| |||||
| 36908217 | 晶方科技关于持股5%以上股东权益变动超过1%的提示性公告 | 2024-11-14 | Chinese | ||
| 36908205 | 晶方科技关于股东大宗交易减持计划实施期限届满暨实施情况的公告 | 2024-11-14 | Chinese | ||
| 36908193 | 晶方科技股票交易异常波动公告 | 2024-11-12 | Chinese | ||
Market data
Market data not available
Price history
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CHINA WAFER LEVEL CSP CO.,LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57340/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57340 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57340 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57340 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57340}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for CHINA WAFER LEVEL CSP CO.,LTD. (id: 57340)"
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