VPEC — Investor Presentation 2021

May 3, 2021

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公司簡介 MOCVD 創造世界級之競爭力

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核心技術

MOCVD （有機金屬氣相沉積法） - Metal Organic Chemical Vapor Deposition

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核心技術

生產 MOCVD 有機金屬化學氣相沉積法 機台 Metal Organic Chemical Vapor Deposition

透過有機金屬化學氣相沉積法，在基板上生 生產 長半導體薄膜的方式，同時透過機台即時監 、 方式 控，精確控制磊晶層，完成砷化鎵 磷化 、 銦 氮化鎵等不同產品磊晶片生產。 生產 MOCVD 磊晶層是由 在腔體中加熱基板，一 原理 個原子層，層層堆疊，行成磊晶層。

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半導體分類（依使用材料）

Element Si Ge ,

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,
Semiconductor	IV-IV
SiC,	SiGe
III-V
GaAs,	InP, GaN, GaP, GaSb...
Com	ound
p
II-VI
ZnSe,	ZnS, CdS, etc.
Period	Column II	III	IV	V	VI
Be	鈹	B	硼	C	碳	N	氮	O	氧
2
Beryllium	Boron	Carbon	Nitrogen	Oxygen	二元化合物	Binary : GaAs, InP, GaP,GaN, etc.
Mg	鎂	Al	鋁	Si	矽	P	磷	S	硫
3	Magnesium	Aluminum	Silicon	Phosphorus	Sulfur	三元化合物	Ternary : InGaAs, InGaP, AlGaAs, etc.
4	Zn	鋅	Ga	鎵	Ge	鍺	As	砷	Se	硒	四元化合物	Quaternary : AlGaInP, InGaAsP, etc.
Zinc	Gallium	Germanium	Arsenic	Selenium
Cd	鎘	In	銦	Sn	錫	Sb	銻	Te	碲	五元化合物	Pentanary : AlGaInAsN, etc.
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Cadmium	Indium	Tin	Antimony	Tellurium
Hg	汞	Tl	鉈	Pb	鉛
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Mercury	Thallium	Lead
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Semiconductor

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磊晶過程中之化學反應

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化學反應式：

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主要原物料:

MO Source + Hydride + Carrier Gas： H2

A s H 3[: rs ne] A i PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH TMIn : Tri-Methyl-Indium ( CH3 )3In Si H 2 DETe : Di-ethyl-Tellurium ( C2H5 )2Te DEZn : Di-ethyl-Zinc ( C2H5 )2Zn CBr CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

CH Al CH Al 3 3 TMAl Tri - Methyl - Aluminum ( CH3 )3 三 甲基 鋁 CH 5 3

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化合物半導體材料特性

1. High Electron Mobility 高電子移動速率 (5.7x higher than CM0S)

2. High Frequency Response 高頻率響應 3. Wide Band Width 寬幅之頻寬

• 4 . High Linearity 高線性度

• 1. High Power 高功率

1. Alternative Choice of Material 材料選擇多元性 7. 抗輻射 適用於無線通訊、光通訊、雷射

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產業供應鏈

Sumitomo, Freiberg, AXT 4~6 ”GaAs Substrate GaAs Epi- Wafer 磊晶片

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MOCVD Reactor

IDM ：Qorvo, Avago, Skyworks

Microelectronics IC Process Wireless Communication Substrate Foundry ： WIN, AWSC, GCS IC Package & Testing

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2018 年 -2021 年 Q1 損益情形

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2021 年展望

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----- Start of picture text ----- 5G 手機滲透率 WiFi6 & WiFi6E IoT Smart Link微電子產品車聯網 PA 5G 毫米波基站 國防工業 低軌道 LEO 衛星----- End of picture text -----

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2021 年展望

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----- Start of picture text ----- 5G 基站基礎建設 3D Sensing光電子車用光達 LiDAR 產品 智慧機器視覺----- End of picture text -----