Skip to main content

AI assistant

Sign in to chat with this filing

The assistant answers questions, extracts KPIs, and summarises risk factors directly from the filing text.

VPEC Investor Presentation 2022

Sep 5, 2022

52095_rns_2022-09-05_b6fcaa91-ffc8-4d1d-9268-fdcc6628040c.pdf

Investor Presentation

Open in viewer

Opens in your device viewer

==> picture [633 x 124] intentionally omitted <==

Company Profile

World-class leading edge with MOCVD

==> picture [142 x 146] intentionally omitted <==

1

==> picture [77 x 78] intentionally omitted <==

Core Technolo gy

MOCVD (有機金屬氣相沉積法)

  • Metal Organic Chemical Vapor Deposition

==> picture [460 x 261] intentionally omitted <==

2

==> picture [77 x 78] intentionally omitted <==

Core Technolo gy

Production MOCVD Metal Organic Chemical Vapor Deposition Reactor

Through the organic metal chemical vapor deposition method, the Way to semiconductor film is grown on the substrate, and the epitaxial Produce layer is accurately controlled through the real-time monitoring of the machine to complete the production of epitaxial wafers for 、 different products such as GaAs InP and GaN.

Production Principle

The epitaxial layer is heated by MOCVD in the cavity of the substrate, and an atomic layer is stacked layer by layer to form an epitaxial layer.

3

==> picture [77 x 78] intentionally omitted <==

Semiconductorb Materialy

Element Si Ge ,

Semiconductor

IV-IV SiC, SiGe

==> picture [699 x 309] intentionally omitted <==

----- Start of picture text -----

||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|III-V|
|GaAs,|InP, GaN, GaP, GaSb...|
|Compound|
|II-VI|
|ZnSe,|ZnS, CdS, etc.|
|Period|Column II|III|IV|V|VI|
|Be|鈹|B|硼|C|碳|N|氮|O|氧|
|2|
|Beryllium|Boron|Carbon|Nitrogen|Oxygen|二元化合物|Binary : GaAs, InP, GaP,GaN, etc.|
|Mg|鎂|Al|鋁|Si|矽|P|磷|S|硫|
|3|Magnesium|Aluminum|Silicon|Phosphorus|Sulfur|三元化合物|Ternary : InGaAs, InGaP, AlGaAs, etc.|
|4|Zn|鋅|Ga|鎵|Ge|鍺|As|砷|Se|硒|四元化合物|Quaternary : AlGaInP, InGaAsP, etc.|
|Zinc|Gallium|Germanium|Arsenic|Selenium|
|Cd|鎘|In|銦|Sn|錫|Sb|銻|Te|碲|五元化合物|Pentanary : AlGaInAsN, etc.|
|5|
|Cadmium|Indium|Tin|Antimony|Tellurium|
|Hg|汞|Tl|鉈|Pb|鉛|
|6|
|Mercury|Thallium|Lead|
|4|

----- End of picture text -----

4

==> picture [77 x 78] intentionally omitted <==

Chemical Reaction During Epitaxy

==> picture [274 x 97] intentionally omitted <==

化學反應式:

==> picture [76 x 67] intentionally omitted <==

==> picture [17 x 64] intentionally omitted <==

主要原物料 :

MO Source + Hydride + Carrier Gas : H2

==> picture [60 x 43] intentionally omitted <==

==> picture [13 x 36] intentionally omitted <==

AsH3 : Arsine PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga TMIn : Tri-Methyl-Indium ( CH3 )3In DETe : Di-ethyl-Tellurium ( C2H5 )2Te

DEZn : Di-ethyl-Zinc ( C2H5 )2Zn

CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

CH Al CH Al 3 3 TMAl Tri - Methyl - Aluminum ( CH3 )3 三 甲基 鋁 CH 3

5

==> picture [77 x 78] intentionally omitted <==

Advantages of Compoundsemiconductor

  1. High Electron Mobility 高電子移動速率 (5.7x higher than CM0S)

  2. High Frequency Response 高頻率響應

  3. Wide Band Width 寬幅之頻寬

  4. High Linearity 高線性度

  5. High Power 高功率

  6. Alternative Choice of Material 材料選擇多元性

  7. 抗輻射

適用於無線通訊、光通訊、雷射

6

==> picture [77 x 78] intentionally omitted <==

GaAs in Wireless Communication Supply Chain

IDM : Qorvo, Avago, Skyworks

Sumitomo, Freiberg, AXT

2~6 ”GaAs Substrate GaAs Epi- Wafer Microelectronics 磊晶片 IC Process Wireless Communication Substrate FoundryMOCVD Reactor WIN, AWSC, GCS IC Package & Testing

7

==> picture [77 x 78] intentionally omitted <==

2019-2022H1 Financial Result

==> picture [706 x 308] intentionally omitted <==

8

==> picture [77 x 78] intentionally omitted <==

2022 Outlook-Microelectronics

==> picture [152 x 12] intentionally omitted <==

----- Start of picture text -----

5G Mobile Penetration
----- End of picture text -----

IoT Smart Link

==> picture [700 x 379] intentionally omitted <==

----- Start of picture text -----

5G Mobile Penetration WiFi6 / 6E IoT Smart Link
Micro
Electron
ics
V2X PA LEO Satellite 5G Base Station Military
----- End of picture text -----

9

==> picture [77 x 78] intentionally omitted <==

2022 Outlook-Optoelectronics

==> picture [66 x 12] intentionally omitted <==

----- Start of picture text -----

Car LiDAR
----- End of picture text -----

==> picture [106 x 15] intentionally omitted <==

----- Start of picture text -----

AR / VR Sensing
----- End of picture text -----

==> picture [642 x 354] intentionally omitted <==

----- Start of picture text -----

Opto
electron
ics
Robot Vacuum Sense Special Heat/IR Imaging
CCD SWIR
----- End of picture text -----

10

==> picture [77 x 78] intentionally omitted <==

AR / VR

~~Detector: PD~~

Wireless

LiDAR Turnkey Solution

~~Detector: PD, APD~~

V2X

VPEC Proprietary and Confidential

==> picture [221 x 139] intentionally omitted <==

==> picture [223 x 139] intentionally omitted <==

THE ~~WALL STREET JOURNAL~~

11