UNITECH — Investor Presentation 2021

Nov 11, 2021

Unitech Printed Circuit Board Corp. 燿華電子股份有限公司 No. 3, Lane 4, Chung Shan Road Tucheng Dist.,New Taipei City, Taiwan R.O.C.

Tel ： +886-2-22685071 FAX ： +886-2-22687824 www.pcbut.com.tw Nov. 11[st] , 2021

Kanty Wu

Vice President / Spokesman

Tu-Cheng , New Taipei City, Taiwan TEL : +886-2-2268-5071 Email : kanty-wu@pcbut.com.tw

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Jason Chou

Vice President

Tu-Cheng , New Taipei City, Taiwan TEL : +886-2-2268-5071 Email : jason-chou@pcbut.com.tw

Disclaimer

• We assume no liability for the content or any action based on this presentation and do not give any warranty, guarantee or commitment, neither explicitly nor implicitly. Neither Unitech nor any of its employee assumes responsibility for the completeness or accuracy of the information contained or not in this presentation. The presentation does not include and does not constitute or form part of any offer whatsoever, nor does it constitute or form part of any kind of prospectus.

• This presentation contains certain forward-looking statements. Actual results may differ materially from those projected or implied in such forward-looking statements. Forward-looking information involves risks and uncertainties that could significantly affect expected results.

• Content of presentation are confidential and reserved by Unitech

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Factory Location

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China
Taipei
Nantong
Yilan
Taiwan
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Profile

Taiwan Nantong

• Capital (2021 3Q) TWD 6,194 M TWD 3,562 M

• Total Assets (2021 3Q) TWD 22,598 M TWD 8,206 M

• • Founded 1984 2018

• Capacity (SF/Mon.) 1300K 800K

• • Employees (2021 3Q) 5013 1800

1. Capital & Assets are expressed in Millions of New Taiwan Dollars.

2. 4.305 TWD/RMB exchange rate is applied.

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Product Mix-by Technologies applied

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Product Mix–By applications

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Core Products/ Global Ranking

• Automotive: 10[th ] (Radar PCB top 3)

• Rigid Flex : Top 6

• Any Layer : Top 10

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Core Products

		Product & Application	Product & Application	Product & Application	2020 A	2021 1H
By Application		Automobile			33%	45%
		Smart Handhelds		Phone	42%	20%
				IOT	6%	10%
				IT	12%	14%
		Others			7%	11%
By Technology		Rigid-Flex			39%	18%
		Anylayer			4%	5%
		HDI			27%	34%
		Conventional			22%	33%
		High-Frequency			8%	10%

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Core Products

		Product & Application	Product & Application	Product & Application	2021 1H	2021 2H
By Application		Automobile			45%	40%
		Smart Handhelds		Phone	20%	15%
				IOT	10%	10%
				IT	14%	26%
		Others			11%	9%
By Technology		Rigid-Flex			18%	22%
		Anylayer			5%	5%
		HDI			34%	36%
		Conventional			33%	30%
		High-Frequency			10%	7%

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Core Products

		Product & Application	Product & Application	Product & Application	2020 A	2021 F
By Application		Automobile			33%	43%
		Smart Handhelds		Phone	42%	17%
				IOT	6%	10%
				IT	12%	21%
		Others			7%	9%
By Technology		Rigid-Flex			39%	21%
		Anylayer			4%	5%
		HDI			27%	35%
		Conventional			22%	31%
		High-Frequency			8%	8%

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近5年度合併營收 Consolidated Revenues, annually

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Thousand NTD

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Thousand NTD

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Market Outlook

• The increasing demand for high-speed computing has led to the continuous growth of diversified product design portfolios incorporating high-end HDI.

• The O-RAN alliance intends to promote the open architecture of 5G mm WAVE, but due to problems such as epidemic interference and deployment costs, the deployment speed is not as expected. It is expected that there will be more obvious results after 2022.

• The continuous advancement of self-driving assistance levels has gradually shifted from the past radar sensing to auxiliary lenses and LiDAR. The proportion and difficulty of automotive electronic components have also increased, and the high-end applications of automotive panels have continued to be promoted.

• In response to the arrival of 5G, the intelligent cockpit integration system has also brought the demand for high-speed computing in vehicles, and applications in this area will see the light.

• The application of high-frequency and high-speed computing boards is expanding year by year, and the demand will increase and expand year by year in the foreseeable future.

• At present, the application level of rigid-flex board is wide, but the technical level is high and the process is complicated. However, the high cost factor currently exists mainly in high-end portable 13

• products.

Supply vs. Demand

• Driven by the 5G penetration, servers and electric vehicles, international copper prices are rising fiercely. It is expected that copper prices will not fall back in a short period of time. The PCB demand for the above-mentioned industries will not decrease next year, and the supply is expected to continue to be tight.

• In response to the rising demand for millimeter waves, the demand for highfrequency application materials is increasing. The market originally controlled by a few suppliers has added different options in recent years. Several large domestic suppliers are gradually supplying Low Loss highfrequency materials.

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Driving force of Revenue and Profit

• Rigid and flexible boards have been applied in new product lines, and the demand for next year is expected to grow compared to this year.

• The design trend of high-end NB is clear for high-end HDI design. It is expected that a certain proportion of high-end NB will be driven by HDI design and application every year.

• With the growth of the application demand of mm Wave millimeter wave, the high-frequency hybrid board will have a stable contribution to the revenue, and in the future, as the penetration rate will increase, there will be explosive growth.

• The automobile market is expected to resume growth next year, especially when the advanced automated driving system is highly automated and continue to advance to the next generation, thus boosting the demand for various sensing systems and high-speed computing units of ADAS.

• The application of MR (Mixed Reality) at industrial level and telemedicine has advanced another process due to the epidemic problem. In addition, the application in Metaverse is expected in the future, and products such as VR/AR/MR that have been in business for many years have begun to be shipped in small quantities.

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GREEN UNITECH & Enviroment Iternity

• Unitech takes "greenness, friendliness, and innovation" as its three main axes, deepens the implementation of ESG regulations, and is striding forward in the direction of green energy sustainability.

• Unitech will continue to improve our green and value chain management capabilities through R&D and innovation.

• On the basis of fulfilling social responsibilities, actively use corporate resources and develop high-end and niche products through innovative green thinking to achieve the company's vision and mission.

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Thank You !!!

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