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UNITECH Investor Presentation 2017
52034_rns_2017-10-23_439a4914-6352-45e3-928d-e5b638f5f36c.pdf
Investor Presentation
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Unitech Printed Circuit Board Corp. 燿華電子股份有限公司
No. 3, Lane 4, Chung Shan Road Tucheng Dist.,New Taipei City, Taiwan R.O.C.
Tel:+886-2-22685071 FAX:+886-2-22687824 www.pcbut.com.tw
Oct. 23rd, 2017
Kanty Wu
Vice President
Tu-Cheng , New Taipei City, Taiwan TEL : +886-2-2268-5071 EXT 21006 Email : [email protected]
Ruby Lee
Vice President / Spokeswoman
Tu-Cheng , New Taipei City, Taiwan TEL : +886-2-2268-5071 EXT 22170 Email : [email protected]
Disclaimer
- We assume no liability for the content or any action based on this presentation and do not give any warranty, guarantee or commitment, neither explicitly nor implicitly. Neither Unitech nor any of its employee assumes responsibility for the completeness or accuracy of the information contained or not in this presentation. The presentation does not include and does not constitute or form part of any offer whatsoever, nor does it constitute or form part of any kind of prospectus.
- This presentation contains certain forward-looking statements. Actual results may differ materially from those projected or implied in such forward-looking statements. Forward-looking information involves risks and uncertainties that could significantly affect expected results.
- Content of presentation are confidential and reserved by Unitech
Factory Location
Profile
| Taiwan | Shanghai | |||||
|---|---|---|---|---|---|---|
| • | Capital | TWD | 5,437,472 | TWD | 2,577,455 | |
| • | Total Assets | TWD 20,614,206 | TWD | 4,410,539 | ||
| • | Founded | 1984 | 1997 | |||
| • | Capacity (SF/Mon.) | 1300K | 600K | |||
| • | Facility Area (SF) | 1250K | 700K | |||
| • | Employees | 5800 | 2000 |
1. Capital & Assets are expressed in Thousands of New Taiwan Dollars.
2. 4.486 TWD/RMB exchange rate is applied.
Sales Breakdown by Technology
Sales Breakdown by Application
Core Products/ Global Ranking
- Automotive: 12th (Radar PCB top 3)
- Rigid Flex : Top 6
• Any Layer : Top 10
Hit a record high in Q3 2017
In Thousands of New Taiwan Dollars
| 2017 H1 | 2016 | 2015 | ||||
|---|---|---|---|---|---|---|
| Net Sale | 7,587,955 | 12,649,827 | 13,788,912 | |||
| CoGS | 6,935,525 | 91% | 11,862,776 | 94% | 11,662,360 | 85% |
| Gross Profit | 652,430 | 9% | 787,051 | 6% | 2,126,552 | 15% |
| Operating Revenues | (150,866) | (2%) | (748,618) | (6%) | 548,117 | 4% |
| Net profit b/f Tax |
(270,750) | (3%) | (836,400) | (7%) | 622,140 | 5% |
| Net Profit | (214,888) | (3%) | (715,680) | (6%) | 525,579 | 4% |
| Basic EPS | (0.38) | (1.27) | 0.97 |
Expressed in Thousands of New Taiwan Dollars.
Market Outlook
- Global Smart phone in low growth
- IOT, VR/AR and wearable is taking a slow step of developing, it might take one or two years to boom.
- Automotive is having a big change on the technology using in car such as high frequent material, heavy copper, rigid flex and HDI.
Supply vs Demand
- Copper consumption in PCB is getting higher and higher due to the additional layer count and electric vehicle. There is a possible cost increase in long term.
- Supply demand keep at a balance situation, seasonality still the main factor create short or over supply.
Driving force of Revenue and Profit
- After a high growth of revenue in 2017, 2018 is forecasted to grow.
- Annual price reduction rate will be limited due to supply demand balance.
- By increasing the share of niche product, the GP is expected to grow.
- Capex in 2017 is approx. 2 billion TWD
Driving force of Revenue and profit
Automotive: Automotive is now 30% of total rev. And will stay the same rev. but focus on changing the product mix to be more profitable niche products like ADAS Radar, HDI for smart cars and heavy copper for electric vehicle.
• Rigid Flex: Following the significant growth on 2017, Rigid Flex is going to keep grow on both Taiwan and China plant.
• AnyLayer: Although not seeing a growth on smartphone , but our NB/Tablet customers are increasing the anylayer design,so 2018 will see a growth from NB/Tablet
High Frequency PCB
5 Layer Rigid Board
Stack-Up
Micro Section Application
- Stack up: 5 Layer Tradition
- Board thickness : 0.9mm
- Surface finish : IT
- Line width / Space : 100/100 (um)
- High Frequency Material
Advance Driving Assistance System
Heavy Copper PCB
10 Layer Rigid Board Stack-Up
Application
Micro Section
- Stack up:10 Layer Tradition
- Board thickness : 3 mm (max.)
- Surface finish : ENIG
- Copper Thickness : Inner 6 oz (max.)
-
Line width / Space(um) : 305/305 for 3oz, 508/406 for 6oz.
-
• DC/DC inverter
- • Powertrain system
- • Any part which combine logic layers and power layers.
Stack-up Rigid Flex Stack Up 8 Layer HDI Rigid Flex Board
Application Micro Section
- Stack up : 1+6+1 2 level HDI
- Board thickness : 0.45mm
- Surface finish : ENIG 18
Rigid Flex Stack Up 9 Layer HDI Rigid Flex Board
Stack-up
Application Micro Section
- Stack up : 3+3+3 anylayer
- Board thickness : 0.83mm
- Surface finish : ENIG
Stack-up 12 Layer Anylayer with board thickness 0.53 mm
Micro Section
- Stack up : 12 Layer Anylayer
- Board thickness : 0.53 (mm)
- Dielectric thickness : 25 (um)
- Surface finish : OSP
- Line width / Space : 40 / 50 (um)
Cavity Technology PCB
Stack-Up
Micro Section Application
- Stack up : 4 Layer Anylayer (Cavity Design)
- Board Thickness : 0.36 (mm)
- Dielectric Thickness : 70 (um)
- Cavity Height:0.12 (mm)
- Surface Finish : ENIG
- Line Width / Space:150 / 100 (um)
- Micro Via Size / Capture Pad:100 / 250 (um)
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