Scientech — Investor Presentation 2025

Jun 16, 2025

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辛耘

許明棋 2025/06/17

SCIENTECH Confidential

免責聲明

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• ⚫ 本簡報可能包含對於未來展望的表述。該類表述是基於對現況 的預期，但同時又受限於已知或未知的風險與不確定性的影響。 因此實際結果將可能不同於表述內容。

• ⚫ 除法令要求外，公司並無義務因應新資訊的產生或未來事件的 發生，主動更新對未來展望的表述。

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簡報大綱

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公司簡介 產品與服務 公司治理 營運概況 未來展望
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公司簡介

Overview | Milestones | Location | Certificate | Competence

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ABOUT US PRODUCTS CONTACT US

基本資料

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Product and Technology

• Equipment Design and Manufacturing

• Wafer Reclaim

• Representative

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Industries We Serve

• Semiconductor (Front-End and Advanced Packaging)

• Compound Semiconductor

• LED / Mini LED / Micro LED

• Flat Panel Display (TFT-LCD, AMOLED, Touch Panel)

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Capital: US$ 27 Million TWSE:3583

Established:

Employees: >1020 (Worldwide)

19791979 年成立 Taipei, Taiwan於台灣台北

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ABOUT US PRODUCTS CONTACT US

Staffs

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Over 1020 Staffs

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Representative

• 140 in Taiwan

• 130 in China

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Equipment Design and Maf’g

• 350 in Total

• 100+ in R&D, Process and Design

• 70% in Service and Process Support

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Wafer Reclaim

• 315 in Total

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Administration

• 85 in Total

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公司歷程

ABOUT US PRODUCTS CONTACT US

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1985 1995 2001 Branch Office Subsidiary Subsidiary in Hsinchu, Taiwan in CA, USA in Shanghai, China

2002 2003 Singapore

Equipment Manufacture Department Established

1979

2021 2019 2013 2007 2006 2004 Subsidiary Over 500 Equipment Publicly Listed in New Factory Wafer Reclaim New Hsinchu in Villach, Austria Sales Achievement Taiwan Stock Market in Hukou Opened Business Launched Office Opened

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ABOUT US PRODUCTS CONTACT US

台灣據點

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HsinChu Office

Taipei Headquarter

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HuKou Factory

• Equipment Design and Manufacturing

• Equipped With Class 10/1,000/10,000 Clean Room

• Wafer Reclaim

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Taichung Office Kaohsiung Office Tainan Office

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國外據點

• Europe Villach, Austria (2020) ◼ Sales and Service Office to support European customers

• ◼ Interface with our factory and European Customers

• ◼ New Product / PRODUCTS Development

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ABOUT US PRODUCTS CONTACT US

China

• Beijing office (2004)

• ◼ Dalian office (2012)

• ◼ Xian (2013)

• Chongqing office (2010)

• ◼ Changzhou (2012)

• Wuxi office (2003)

• ◼ Shanghai Office (2001)

• ◼ Wuhu office (2013)

• ◼ Xiamen office (2011)

• ◼ Huizhou office (2013)

• ◼ Qunming Office (2002)

• USA Santa Clara, CA (1994) ◼ Sales and Service Office ◼ Interface with Principals and U.S. Customers

• ◼ New Product / PRODUCTS Development

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辛耘公司組織架構

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Scientech
General Admin. Equipment M’fg
Wafer Reclaim
New Projects Semi / Opto Rep.
Taiwan China USA Europe Japan Korea S’pore
Offices Offices Office Office Agent Agent Agent
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產品與服務

Wafer Reclaim | Equipment Manufacturing and Design | Representative

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研發費用

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發費用	發費用
單位：百萬		2020	2021	2022	2023	2024	2025Q1
研發費用		248	280	320	341	378	113
研發費用佔 營業收入比重		6.9%	6.0%	5.7%	4.9%	3.9%	4.0%
研發費用佔 製造比重			14.9%	15.3%	15.7%	11.3%	10.8%
	0 50 100 150 200 250 300 350 400	R&D Expenses
		2020 2021 2022 2023 2024 2025Q1

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研發專利累積數

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⚫ The cumulative number of patents on file is 197, and 52 applications are pending.

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250
197
200
182
170
154
150
136
109
100
74
50 44
33
28
25
0
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 May-25
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產品與服務

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• Equipment Design and Manufacturing

• • Advanced Package

• • FEOL

• Mask

• Compound

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Wafer Reclaim
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• 12” Si Wafer

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ABOUT US PRODUCTS

CONTACT US

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• Representative

• • Equipment/Metrology

• • Sub-System

• • Material

• Repair and Refurbish

• etc...

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ABOUT US PRODUCTS CONTACT US

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晶圓再生服務

Advanced Clean Technology

Advanced Defect Inspection (SP1/SP2/SP5/SP7)

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• 19nm Particle

• Low Trace Metal (<1E9)

Cleaning Etching Full Process Optimization Polishing Grinding

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12”Si Wafer

Capacity Expansion

◼ Capacity: 160K / Month

• Additional 50K / Month by end of 2025

◼ Cu and Non-Cu Process

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Complete Polishing Process

Super Flatness m (GBIR < 0.5 m)

• Single/Double Side Polish

• • Final Haze Polish

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ABOUT US PRODUCTS

CONTACT US

設備研發及生產

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Wet Bench

Single Wafer

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TBDB
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Baking

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ABOUT US PRODUCTS

CONTACT US

設備研發及生產

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批次式濕式製程設備

Application

◼ Semiconductor: FEOL, BEOL, Compound ◼ Advanced Packaging/Bumping…

Features

• Cassette type or Cassette-less type

• Adopted by big international companies

• Leading-edge technologies

Process

• Etch: Metal/Oxide/Nitride remove

• Stripper: PR/PI strip, Polymer remove

• Clean: Pre/Post/Flux clean

• Electro-less Plating: Zn/Ni/Pd/Au

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ABOUT US PRODUCTS

CONTACT US

設備研發及生產

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單晶圓濕式製程設備

Application

• Semiconductor: BEOL, FEOL, Compound

◼ Advanced Packaging/Bumping

Features

• Soak/Immersion + Single

• Adopted by big international companies

• Leading-edge technologies

Process

• UBM / Metal Etch

• Flux Clean (Hot DIW)

• PR Strip

• Wafer Clean (APC, Soft spray)

• Final Clean/Mask Clean/Frame Clean

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ABOUT US PRODUCTS CONTACT US

設備研發及生產

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暫時性貼合及剝離設備(TBDB)

Application

Features

• IGBT & SiC Power Device

• User-friendly graphical user interface

• Advanced Packaging for Semiconductor

• Adopted by big international companies

• Leading-edge technologies

Process

• Temporary Bonding

• Temporary De-bonding

• Release Layer Coating

• Carrier (Glass) Recycling

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ABOUT US PRODUCTS

CONTACT US

設備研發及生產

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水氣烘烤設備

Application

• Semiconductor: BEOL

• Advanced Packaging for Semiconductor

Process

• Pre-underfill baking

• Pre-mold baking

• DFR Hard Bake

Features

• Availability for horizontal or vertical process

• High precision temperature control

• ◼ Weight handling capacity up to 23kg per lot

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代理事業

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Multiple
Exclusivity
Apps
Long Term
Partnership
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ˋˋ

ABOUT US PRODUCTS CONTACT US

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Lithography Etch

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Thin Film

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Diffusion

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ABOUT US PRODUCTS

CONTACT US

代理產品

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Package
Metrology Sub-Systems
& Material
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Robot Repair
and Refurbish
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公司治理

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ABOUT US PRODUCTS CONTACT US

國際標準認證

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ISO 9001 TIPS ISO 27001 RBA
Taiwan Intellectual Information Security Responsible Business
Quality Management
Property Management Management Alliance Online Member
9001 27001
2007 2010 2016 2018 2019 2021 2022 2024
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14001
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45001
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22301
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50001
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Environmental Occupational Health Management and Safety Management

Business Continuity Management

Energy Management

ISO 14001

ISO 45001

ISO 22301

ISO 50001

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ESG永續發展

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發行永續報告書

永續 ~~發展~~

~~E~~ S ~~G~~

環境友善 溫馨職場 回饋社會 誠信經營

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ABOUT US PRODUCTS CONTACT US

Exhibition

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Semicon China Semicon TW Semicon West Semicon Europa
Mar. 26-28, 2025 Sep. 10-12, 2025 Oct. 07–09, 2025 Nov. 18-21, 2025
Shanghai Taipei Phoenix Munich
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ABOUT US PRODUCTS

CONTACT US

Exhibition

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ISES ECTC
May 13-14, 2025 May 27-30, 2025
Taipei Dallas, Texas
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營運概況

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簡明損益表

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Units：NT $ M	2020	2020	2021	2021	2022	2022	2023	2023	2024	2025Q1	2025Q1
Revenues	3,580		4,684		5,650		6,911		9,688	2,812
Gross Profit	1,456		1,667		2,084		2,201		2,906		893
Operating Expenses		991	1,112		1,374		1,483		1,790		545
Operating Income		465		555		710		718	1116		349
Income Before Tax		389		524		736		860	1277		367
Net Income		305		420		568		650	927		257
EPS		3.80		5.23		7.08		8.10	11.54		3.20
Gross Margin		41%		36%		37%		32%	30%		32%
Operating Margin		13%		12%		13%		10%	12%		12%
Income Before Tax Margin		11%		11%		13%		12%	13%		13%

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歷年營收

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	Units NT $ M	Units NT $ M	2015	2016	2017	2018	2019	2020	2021	2022	2023	2024		2025Q1	2025Q1
Revenue			2,942	3,495	3,539	3,988	3,949	3,580	4,684	5,650	6,911	9,688			2,813

12,000 10,000 8,000 6,000 4,000 2,000 0 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

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歷年 EPS

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		2015	2016	2017	2018	2019	2020	2021	2022	2023	2024	2025Q1
EPS		1.06	3.6	4.05	5.16	4.02	3.8	5.23	7.08	8.1	11.54	3.20
	2015 2016 2017 2018 2019 2020 2021 2022 2023 2024
0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00	2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

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未來展望

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總體市場方向

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• ⚫ The CAGR of the Semi. market size over the next 10 years is approximately 8%

• ⚫ In 2025, the global Semi. market is expected to grow 11%

• ⚫ Driven by demand in artificial intelligence (AI) and high-performance computing applications, the semi. market in Taiwan:

Year	Market Size (Billion US$)	Groth Rate (%)
2024	165	22
2025	187	16.5

• ⚫ 12-inch semi. advanced process continues to thrive

• 、 、 、

• Front-End: 5nm 3nm 2nm 1nm

• 、 、

• Advanced Package: Fan-Out 2.5D (CoWoS) 3D (SoIC)…etc

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總體市場方向– 2

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• ⚫ The CAGR of Advanced Packaging over the next 10 years is estimated at 11%.

• ⚫ CoWoS production capacity is expanding substantially to meet the rising demand for AI chip applications

• ⚫ AI applications are expanding from data centers to personal devices

• ⚫ China's semi. production capacity is expanding, intensifying price competition in mature process nodes.

• ⚫ : Compound Semi

• Investment in electric vehicles (EVs) and 5G is stagnant

• Mobile phone demand is saturating, leading to reduced GaAs production

• ◼ SiC demand gradually increases, with new capacities slowing down

• ◼ Micro LED adoption is progressing slowly

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擴產計畫

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• ⚫ 2023: New equipment production base in Hukou (off-site)

• ⚫ 2024: Expansion of existing equipment production at Hukou Plant

• ⚫ 2025 Q4: Wafer Reclaim Capacity 50K/Month at Hukou Plant

• ⚫ 2026 Q4: 9,000 M-Square new building (Plant II) for equipment manufacturing, and warehouse next to Hukou Plant (Plant I)

• ⚫ 2026 Q4: Wafer Reclaim Capacity 30K/Month at Hukou Plant

• ⚫ 2027 Q1: 20,000 M-Square new building for equipment manufacturing, and warehouse in Tainan (southern Taiwan)

• ⚫ 2027: Wafer Reclaim Capacity 50K/Month at Hukou Plant

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Thank You!

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https://www.scientech.com.tw

SCIENTECH Confidential