Scientech — Investor Presentation 2020

Jun 19, 2020

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(3583)

2020/6/24

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Safe Harbor Statement

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• This Presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

• Except as required by law, we undertake no obligation to update any forward –looking statements, whether as a result of new information, future events or otherwise.

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Scientech Corp (3583: TT)

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|---|---|
|Company|
|Establishment|1979/10/17|
|IPO|2013/3/12|
|Capital|NT$ 811 Million|
|Chairman|H.L. Hsieh|
|President|M.T. Hus|
|、|、|
|Equipment Manufacturing|Wafer Reclaim|
|Products|
|Trading(Agent/Distributor)|

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Business Overvies Products

Future Prospect

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Business Overview

Income Statement

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Units：NT $ M	2015	2016	2017	2018	2019	1Q20
Revenues	2,942	3,495	3,539	3,988	3,949	630
Gross Profit	903	1,178	1,251	1,448	1,384	242
Operating Expenses	779	835	829	935	997	221
Operating Income	124	343	423	514	387	21
Other Income and Expenses	(6)	21	(8)	26	16	(16)
Income Before Tax	119	363	415	540	403	5
Net Income	86	292	328	418	323	3
EPS	1.06	3.60	4.05	5.16	4.02	0.03
Gross Margin	30.69%	33.71%	35.36%	36.32%	35.05%	38.47%
Operating Margin	4.23%	9.80%	11.95%	12.88%	9.81%	3.35%
Income Before Tax margin	4.03%	10.40%	11.72%	13.54%	10.22%	0.77%

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Business Overview

Products Mix

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Units：%	2015	2016	2017	2018	2019	Gross Margin
Trading	59	51	54	57	59	Below Average
Manufacturing	41	49	46	43	41	Above Average

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Business Overview

R&D Expenses

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Units：NT $ M	2015	2016	2017	2018	2019
R&D Expenses	196	226	228	246	246
Expenses as % of Revenue	6.66%	6.48%	6.44%	6.18%	6.24%

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Products

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Wet Process
Equipment
Equipment
Manufacturing
Trading
Wafer
(Agent/Distr
Reclaim
ibutor)
Semiconductor and 12” Wafer
Optoelectronics
Reclaim
Process Equipment
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Products

Equipment Manufacturing

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Wet process equipment  Single wafer/ Batch type

• 8”/12’ Advanced packaging

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、
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、 、 (Fan-out Solder Bump 、 、 Copper Pillow Bumping 、 、 Gold Bump RDL TSV …ect)

• 6”/ 8”/12” Front-end special 、 、

• process (IoT Sensor Power IC 、 、 、

• FP sensor RF CMOS Touch 、

• Controller MEMS)

• HB LED fully-automatic process

• MEMS

• III-V

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Products Si Wafer Reclaim

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Advanced clean technology
Complete particle inspection
20nm/ 16nm Particle
• (SP1-DLS & SP2)
Low trace metal (<5E9)
•
 12” Wafer Reclaim
Cleaning Etching

Capacity: 120K / month

Separated Cu & Non Cu
Line
Full Process
Optimization
Polishing Grinding
Complete polishing process Super flatness
Single side polish • (GBIR<0.5 m m)
Double side polish
•
Final Haze polish 10
•
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Products

Trading (Agent/Distributor)

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Multi
Exclusive
applicati
Agency
on
Supply Chain
Partnership
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Future Product-based Extension Prospect

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Equipment Manufacturing

Wet Process Equipment

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Front-end Wet Process Equipment Wafer Support System Mass Spectrometer Wafer Reclaim

Semiconductor and Optoelectronics Process Equipment

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AMOLED Advanced Process Miniaturization

Trading Wafer (Agent/Distr Reclaim ibutor) 12” Wafer Reclaim ------------------- SiC Wafer Reclaim

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Q & A

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Thank You!

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