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Scientech — Investor Presentation 2014
Apr 25, 2014
52347_rns_2014-04-25_8663225a-1d82-4145-abf9-4c6cf21ed038.pdf
Investor Presentation
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辛耘企業 (3583) 2014 第一季法人說明會
2014 年 4 月 25 日
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營運概況
主要產品
未來展望
2
營運概況
綜合損益表
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科目 |
2011 | 2012 | 2013 | 1Q13 | 1Q14 |
|---|---|---|---|---|---|
營業收入 |
2,761,318 | 2,252,295 | 3,067,640 | 613,076 | 547,630 |
營業毛利 |
844,247 | 793,275 | 982,937 | 185,232 | 162,886 |
毛利率 |
30.6% | 35.2% | 32.0% | 30.2% | 29.7% |
營業費用 |
658,733 | 581,512 | 629,202 | 151,079 | 159,781 |
營業淨利(損) |
185,514 | 211,763 | 353,735 | 34,153 | 3,105 |
營業利益率 |
6.7% | 9.4% | 11.5% | 5.6% | 0.6% |
營業外收入及支出 |
(21,752) | (925) | (25,935) | 7,896 | 10,101 |
稅前損益 |
163,762 | 210,838 | 327,800 | 42,049 | 13,206 |
稅前淨利率 |
5.9% | 9.4% | 10.7% | 6.9% | 2.4% |
稅後純益(損) |
79,020 | 176,216 | 249,417 | 33,854 | 5,475 |
EPS(元) |
1.21 | 2.38 | 3.13 | 0.45 | 0.07 |
3
營運概況
資產負債表
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資產負債表項目( 新台幣仟元) |
1Q14 | 1Q14 | 4Q13 | 4Q13 | 1Q13 | 1Q13 |
|---|---|---|---|---|---|---|
金額 |
% | 金額 |
% | 金額 |
% | |
現金及約當現金 |
453,061 | 14.3% | 396,948 | 12.2% | 377,640 | 12.1% |
應收票據及帳款 |
388,390 | 12.3% | 556,301 | 17.1% | 312,734 | 10.0% |
存貨 |
380,110 | 12.0% | 381,777 | 11.8% | 497,024 | 15.9% |
不動產、廠房及設備 |
1,700,896 | 53.8% | 1,677,423 | 51.7% | 1,592,179 | 50.9% |
資產總計 |
3,163,963 | 100.0% | 3,246,212 | 100.0% | 3,129,015 | 100.0% |
流動負債 |
606,547 | 19.2% | 686,765 | 21.2% | 600,295 | 19.2% |
長期銀行借款 |
567,706 | 17.9% | 576,022 | 17.7% | 648,043 | 20.7% |
負債總計 |
1,218,737 | 38.5% | 1,308,250 | 40.3% | 1,286,820 | 41.1% |
股東權益總計 |
1,945,226 | 61.5% | 1,937,962 | 59.7% | 1,842,195 | 58.9% |
4
營運概況
現金流量表
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(新台幣仟元) |
1Q14 | 4Q13 | 1Q13 |
|---|---|---|---|
期初現金 |
396,948 | 356,106 | 255,691 |
營業活動之現金流入 |
163,967 | 86,727 | 101,696 |
資本支出 |
(105,424) | (45,860) | (52,726) |
長短期借款 |
6,580 | (8,307) | (183,363) |
現金增資 |
0 | 0 | 249,576 |
投資及其他 |
(9,010) | 8,282 | 6,766 |
期末現金 |
453,061 | 396,948 | 377,640 |
自由現金流量(*) |
58,543 | 40,867 | 48,970 |
*自由現金流量=營業活動之現金流入-資本支出
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營運概況營運概況
營收佔比與毛利率
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| 3,500,000 | 50.00% | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 43.48% | 43.75% | ||||||||||||||||||
| 3,000,000 | 40.91% | 45.00% | |||||||||||||||||
| 2,500,000 | 30.35% | 34.71% | 35.00% 40.00% |
||||||||||||||||
| 2,000,000 | 29.31% | 35.22% | 30.00% | ||||||||||||||||
| 1,500,000 | 27.86% | 23.86% | 30.57% | 32.04% | 29.74% | 25.00% | |||||||||||||
| 1,000,000 | 20.00% | ||||||||||||||||||
| 15.00% | |||||||||||||||||||
| 500,000 | |||||||||||||||||||
| 0 單位：仟元 (新台幣) |
5.00% 10.00% |
||||||||||||||||||
| -500,000 | 2009 | 2010 | 2011 | 2012 | 2013 | 1Q14 | 0.00% | ||||||||||||
營業收入 |
1,366,513 | 2,275,507 | 2,761,318 | 2,252,295 | 3,067,640 | 547,630 | |||||||||||||
毛利率 |
29% | 24% | 31% | 35% | 32% | 30% | |||||||||||||
稅後純益(損) |
(3,163) | (58,584) | 79,020 | 176,216 | 249,417 | 5,475 | |||||||||||||
| EPS | 營業收入 0.80 |
營業毛利 0.09 |
稅後純溢(損) 1.21 |
2.38 | 營業毛利率 3.13 |
製造事業營收% 0.07 |
6
營運概況營運概況
研發費用
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140,000 8.00%
130,970
129,427
7.35% 121,304
7.00%
120,000 113,564
6.56%
100,465 6.00%
100,000
5.39%
4.99% 5.00%
4.69%
80,000
4.27%
4.00%
60,000
3.00%
35,946
40,000
2.00%
20,000 1.00%
- 0.00%
2009 2010 2011 2012 2013 1Q14
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研發費用 研發費用佔營收 %
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主要產品
自製設備
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濕製程設備
單晶圓 / 批次濕式製程設備
-
12”/8”
先進封裝製程：Bumping / WLP / InFO/ CoWoS/ SiP / TSV / 2.5D IC / 3D IC -
6”/8”
半導體前段成熟特殊製程 、、 、 -
(FP sensor RF CMOS Touch
、 、 -
Controller
、電源管理IC MEMS IoT Sensor) -
III-V
族for無線通訊高頻IC (PA與射頻IC)
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- HBLED
全自動前段製程for背光 與照明
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主要產品
晶圓再生服務
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Advanced clean technology Complete particle inspection
20nm/16nm Particle (SP1-DLS & SP2)
Low trace metal ( < 5E9)
Cleaning
Etching
Full Process
12” Wafer Reclaim Optimization
月產能 : 120K
銅製程與非銅製程產線分離 Polishing Grinding
Complete polishing process Super flatness
Single side polish (GBIR < 0.5 m m)
Double side polish
Final Haze polish
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Complete particle inspection (SP1-DLS & SP2)
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主要產品
代理設備
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多領域
獨家代理
應用
長期伙伴
關係
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未來展望主要產品
半導體設備市場
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2014 年半導體設備市場規模與未來預測
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未來展望
自製設備
1.製程世代能力提升
2.以核心技術出發，持續掌握外部 機會
單雷
射
晶
技全
圓
術譜
濕應
質
製用
譜
程導
儀
設光
板
備
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晶圓技術
1.製程世代能力提升
2.投入非矽材料技術
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非矽材料晶圓技術
矽
SiC Ge
晶
( 碳化矽 ): ( 鍺 ): Glass
圓 高功率元件、 高聚
( 玻璃 ):
再 RF 、電動 焦型 3D IC 晶
汽車電子元
太陽
生 圓載板
件、高亮度
能
技 LED
術
20/16 nm
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未來展望
自製設備
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12 吋單晶圓 / 批次式濕製程設備
-
先進封裝製程 -
金屬蝕刻(UBM etch) -
晶圓清洗(Wafer clean) -
光阻去除(PR Strip) -
助焊劑清洗(Flux clean) -
金屬化鍍機(Electro-less plating)
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未來展望主要產品 質譜儀
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目前質譜儀的應用範疇
機場或港口的通關檢驗及法醫學方面 |
食品、毒品、爆裂物或酒精等物品分析 |
|---|---|
醫藥學方面 |
藥物代謝、雜質分析、天然產物分析等 |
臨床醫學方面 |
新生兒檢查、糖化血色素、血紅蛋白變異等 |
食品科學方面 |
香料、添加物、包裝物、蛋白質、致癌物等 |
研究機構 |
研究蛋白質、醣類、代謝物的測量、生物分子影像測量、蛋白質體學、修飾蛋白體學和代謝體學的研究、疾病生物標的物的尋找等 |
環境化學方面 |
農藥與農殘分析、有機污染物、土壤/食品/水中粒子分析等 |
合成與有機化學方面 |
有機金屬化合物、有機合成物、製造過程的控管及產品的品質管制、表面活性劑、染料等 |
材料的運用領域 |
材料不純物的分析，例如在半導體材料, 或生醫材料分析…等。 |
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未來展望主要產品 質譜儀
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-
質譜儀設備 -
利用專利的掃頻模式，可以偵測目前 市面上質譜儀無法偵測的範圍。 -
兼具兩個目前使用最多的離子源：雷 射&高電壓，可同時分析固態及液態 樣品。 -
新開發的應用，包含：-
巨大生物分子 -
奈米材料 -
環境粒子 -
特大分子
-
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未來展望
SiC: 應用
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Source: Yole Development
未來展望
SiC 晶圓再生
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簡報結束
謝謝！
Q&A
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