Scientech — Interim / Quarterly Report 2014

Nov 3, 2014

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辛耘企業 (3583)

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2014 年 10 月 30 日

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營運概況

主要產品

未來展望

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營運概況

簡明損益表

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科目	2013	3Q13	3Q14	1-3Q13	1-3Q14
營業收入	3,067,640	775,875	680,904	2,156,560	1,878,498
營業毛利	982,937	268,409	282,968	681,732	647,694
毛利率	32.00%	35%	42%	32%	34%
營業費用	629,202	146,684	183,200	454,171	499,708
營業淨利(損)	353,735	121,725	99,768	227,561	147,986
營業利益率	11.50%	16%	15%	11%	8%
營業外收入及支出	-25,935	-20,976	-5,373	-14,627	3,479
稅前淨利	327,800	100,749	94,395	212,934	151,465
稅前淨利率	10.70%	13%	14%	10%	8%
本期淨利	249,417	78,057	77,859	162,441	115,757
EPS	3.13	0.96	0.96	2.05	1.43

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營運概況營運概況營運概況

合併營收與毛利率

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3,500,000 70.00%
57.68%
3,000,000 60.00%
2,500,000 43.75% 44.28% 50.00%
40.91%
2,000,000 35.22% 40.00%
43.48%
32.04%
41.56%
1,500,000 30.00%
31.05%
29.74%
1,000,000 20.00%
500,000 10.00%
0 0.00%
2012 2013 1Q2014 2Q2014 3Q2014
營業收入 2,252,295 3,067,640 547,630 649,964 680,904
毛利率 35.22% 32.04% 29.74% 31.05% 41.56%
製造事業營收 % 43.48% 40.91% 43.75% 44.28% 57.68%
營收 毛利 稅後純益 毛利率 製造比率
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營運概況營運概況

研發費用

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- 20,000 40,000 60,000 80,000 100,000 120,000 140,000	100,465 113,564 129,427 121,304 130,970 117,768 7.35% 4.99% 4.69% 5.39% 4.27% 6.27% 0.00% 1.00% 2.00% 3.00% 4.00% 5.00% 6.00% 7.00% 8.00% 2009 2010 2011 2012 2013 3Q14 研發費用 研發費用佔營收%

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主要產品

自製
設備
設備再生
代理晶圓

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半導體暨光電
製程及量測設備

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半導體暨光電
前段、先進封裝
濕製程設備

12 吋再生晶圓

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主要產品

自製設備

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 濕製程設備

 單晶圓 / 批次濕式製程設備

 12”/8” 先進封裝製程： InFo/RDL/ Bumping / WLP/ CoWoS/ TSV / 2.5D IC / 3D IC

 6”/8”/12” 半導體前段成熟特殊 、 、 、 製程 (FP sensor RF CMOS 、 、 、 Touch Controller Power MEMS IoT Sensor)

• III-V 族 for 無線通訊高頻 IC

• (PA 與射頻 IC)

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• HBLED 全自動前段製程 for 背光 與照明

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主要產品

自製設備

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2014 Mid-Year Equipment Forecast by Market Region

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Resource : July 2014 ; Semi

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主要產品
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晶圓再生服務

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Advanced clean technology Complete particle inspection
20nm/16nm Particle (SP1-DLS & SP2)
Low trace metal ( < 5E9)
Cleaning
Etching
Full Process
12” Wafer Reclaim Optimization
月產能 : 120K
銅製程與非銅製程產線分離 Polishing Grinding
Complete polishing process Super flatness
Single side polish (GBIR < 0.5 m m)
Double side polish
Final Haze polish
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主要產品

晶圓再生服務

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Global market for Silicon Reclaim Wafers is projected to reach US$747.9 million by 2020

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Resource : February 2014 ; Global Industry Analysts

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主要產品

晶圓再生服務

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主要晶圓製造大廠的製程微縮趨勢

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主要產品

代理設備

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多領域
獨家代理
應用
長期伙伴
關係

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未來展望

自製設備

1.製程世代能力提升

• 2.以核心技術出發，持續掌握外部 機會

雷 單 射 晶

技 全 圓

術 譜 應 濕 質

用 製 譜 導 程 儀

光 設 板 備

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晶圓技術

1.製程世代能力提升

2.投入非矽材料技術

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非矽材料晶圓技術
矽
SiC Ge
晶 ( 碳化矽 ): ( 鍺 ): Glass
圓 高功率元 高聚
( 玻璃 ):
再 件、 RF 、 焦型 3D IC 晶
電動汽車電
太陽
生 圓載板
子元件、高
能
技 亮度 LED
術
13
20/16 nm
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未來展望

自製設備

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 12 吋單晶圓 / 批次式 濕製程設備

• 先進封裝製程

、 、 、 、 (InFo RDL Copper pillow Bumping TSV)

• 金屬蝕刻 (UBM etch)

• 晶圓清洗 (Wafer clean)

• 光阻顯影 (PR develop)

• 光阻去除 (PR Strip)

• 助焊劑清洗 (Flux clean)

• 凸塊清洗 (bump scrubbing)

• 金屬化鍍機 (Electro-less plating)

• 6”/8”/12” 半導體前段成熟特殊製程

、 、 、 、 (FP sensor RF CMOS Touch Controller 、 、 Power IC MEMS IoT Sensor)

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未來展望

SiC: 應用

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Source: Yole Development

SiC/GaN 未來展望 功率半導體市場

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SiC Wafer Reclaim Roadmap 未來展望

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未來展望主要產品

質譜儀

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 質譜儀設備

• 利用專利的掃頻模式，可以偵測目前市面上質 譜儀無法偵測的大分子質譜檢測的領域

• 兼具兩個離子源：雷射 & 高電壓，可同時分析 固態及液態樣品。

• 輕量化、模組化、客製化，

• 未來亦將投入研發具有 現場檢測與快速篩選的 質譜系統，將有助於環境污染與食品生產過程 的檢驗與稽核，加強檢驗的嚇阻能力

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• 應用：

• 食品安全方面

• 農藥與農殘分析

• 環境污染

• 醫藥學方面

• 生醫領域

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未來展望

質譜儀

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• 依據Instrument Business Outlook January 15, 2011的推估，質譜儀 市場從2013年到2017年，複合年增長率達到 8.8 %，預計到2017年達到 48.4 億美元

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5,000
4,000 3,544 3,827
3,282
3,039 譜光的機會
3,000
現有市場 ┼ 利基型
2,000
大分子質譜量測
1,000 ( >100000Da)
0
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(US$ B)
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2012 2013 2014 2015 (西元)

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簡報結束
  謝謝！

Q&A

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