Scientech — Interim / Quarterly Report 2013

Nov 13, 2013

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辛耘企業 (3583) 2013 年第三季法人說明會

Nov 13, 2013

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營運概況

簡明損益表

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科目 2011 2012 2013/1Q 2013/2Q 2013/3Q 2013/1Q~3 Q 營業收入 2,761,318 2,252,295 613,076 767,609 775,875 2,156,560 營業毛利 844,247 793,275 185,232 228,091 268,409 681,732 毛利率 30.57% 35.22% 30.21% 29.71% 34.59% 31.61% ~~2~~ 營業費用 658,733 581,512 151,079 156,408 146,684 454,171 營業淨利(損) 185,514 211,763 34,153 71,683 121,725 227,561 營業利益率 7% 9% 6% 9% 16% 11% 稅前損益 163,762 210,838 42,049 70,136 100,749 212,934 稅前淨利率 6% 9% 7% 9% 13% 10% 稅後純益(損) 79,020 176,216 33,854 50,530 78,057 162,441 EPS(元) 1.21 2.38 0.45 0.62 0.96 2.05

營運概況 2013 及 2012 1-9M

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2013及2012 1-9M 營運概況	2013及2012 1-9M 營運概況	2013及2012 1-9M 營運概況	2013及2012 1-9M 營運概況	2013及2012 1-9M 營運概況	2013及2012 1-9M 營運概況
科目 2012 1-9M % 2013 1-9M % YoY 營業收入 1,642,550 100% 2,156,560 100% 31% 營業毛利 560,733 34% 681,732 32% 22% 營業費用 427,900 26% 454,171 21% 6% 營業淨利(損) 132,833 8% 227,561 11% 71% 稅前損益 124,414 8% 212,934 10% 71% 稅後純益(損) 100,610 6% 162,441 8% 61% EPS(元) 1.36 2.05
科目	2012 1-9M	%	2013 1-9M	%	YoY
營業收入	1,642,550	100%	2,156,560	100%	31%
營業毛利	560,733	34%	681,732	32%	22%
營業費用	427,900	26%	454,171	21%	6%
營業淨利(損)	132,833	8%	227,561	11%	71%
稅前損益	124,414	8%	212,934	10%	71%
稅後純益(損)	100,610	6%	162,441	8%	61%
EPS(元)	1.36		2.05

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主要產品

自製設備

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• 濕製程設備

• 單晶圓 / 批次濕式製程設備

  • 8”/12” : 先進封裝製程

  • Bumping/TSV/3D

  • 6”/8” 半導體前段成熟特 、 、

  • 殊製程 (RF CMOS Touch Controller 、電源 、

  • 管理 IC MEMS)

  • III V 族

  • LED 全自動前段製程

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主要產品 自製設備

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�
Taiwan semi equipment
supply estimated
� 2013: 16%
� 2014: 18%
� 2015: 22%
�
High growth of local supply
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主要產品

晶圓再生服務

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• 12” Wafer Reclaim

• 月產能 : 120K

• � 銅製程與非銅製程產 線分離。

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主要產品 代理設備

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多領域
獨家代理
應用
完整供應練
管理
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未來展望

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自製設備

• 國內半導體設備本土化趨勢明確，設備商具長期未來成長優勢。

• 、

• 高階凸塊封裝製程、矽穿孔、 SiP 2.5D IC 濕製程設備需求快速成長。

• 半導體前段成熟特殊製程、砷化鎵及 LED 先進製程全自動化需求確立。

晶圓再生

• 台灣 12 吋再生晶圓需求持續成長。

• 在週轉率及成本最佳化的需求條件下，本土化有其優勢。

• 晶圓再生技術及良率繼續提昇，降低成本，持續開發國外半導體廠訂單。

• 代理設備

• 2014 年， 28/20 奈米產品線將成為台積電新的營收主力。

• 中國市場需求強勁。

• 、

• 優質新代理產品的持續加入，如 Plasma-Therm AE 等等。

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研發創新

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自製設備

晶圓技術

1.製程世代能力提升

2.以核心技術出發，持續 掌握外部機會

1.製程世代能力提升 2.投入非矽材料技術

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非矽材料晶圓技術
SiC (
矽 ):
Ge ( ):
RF Glass (
): 3D IC
�能
晶圓��
LED
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雷 18
單 射
晶 技 吋
全 20/16 nm
圓 術 晶
譜
濕 應 晶 圓
質
製 用 圓 再
譜
程 再 生
導 儀
設 生 技
光
備 技 術
板
術
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簡報結束 謝謝！ Q&A

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