Fiti — Investor Presentation 2024

Jun 14, 2024

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Investor Presentation

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Safe Harbor Notice

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 Foxsemicon′s statements of its current expectations are forward looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements.  Except as required by law, we undertake no obligation to update any forwardlooking statements, whether as a result of new information, future events, or otherwise.  No material from these slides may be copied, modified, re-edited, transmitted or used for commercial purposes in any way, except with Foxsemicon’s permission.

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FOXSEMICON INTEGRATED TECHNOLOGY INC.

Agenda

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 Company Profile

 Financial Overview

 Business Outlook

 Q&A

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FOXSEMICON INTEGRATED TECHNOLOGY INC.

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Business Performance

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16% 14,843
CAGR CY19” - CY23” 13,051
12,246
9,942 24.64
20.48
7,306
17.01
14.91
3,322
7.85
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NPI (New Product Introduction)

HVM (High Volume Manufacturing)

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Chunan #1,TW(HQ) Chunan #2, TW Songjiang, CN Kunshan, CN
China - Kunshan
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Silicon Valley,USA US – Union City, CA

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China+1
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Thailand
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SCM & IPO CA/TX,USA US – San Jose, CA

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Expansion in THL
Rayong , THL
：MFG Center-Taiwan/China
：MFG Center(Expansion)-Thailand
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Upstream Mid-stream Downstream
IC Manufacturing
IC Packaging & Testing IC
(Foundry/Memory)
IP Design
/IC Design IC Design
OEM Manufacturing
Equipment Mask Chemicals Inspection & Substrate Frame Lead IC
equipment Channel
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Level 5
Enterprise
Flexibility Service
Level 4
Factory
Level 3 Speed Cost
Production Line
Level 2 Equipment
Level 1 Component
Provide integrated solutions
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Critical Component/ Engineering/ High Level system vertical Integration Technology Designing  Critical Components/Spare Module System  R&D Engineering Parts

System  R&D Engineering

 Thin Film

 Thin Film  Semi/Solar/Medical  High Purity/Vacuum (CVD/PVD/ALD) Equip. System Integration Components  ETCH & EPI & RTP  System Virtual  Wafer Process Kits Equip. Integration & Testing  Process Vacuum Chambers  Transfer Vacuum Chambers  CMP Equip.  Merge-in-Transit to  Power Distribution Consolidation Hub Unit

 Concurrent Design  ODM/JDM Design Virtual Factory

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 DFx Collaboration  EC Control & Management  Equipment Installation

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Customization
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Module
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Intelligence
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Critical Component Provider

High Level System Integrator

NPI Partner

Business Units & Plans

 Wafer process equipment manufacturing (ETCH, ThinFilm, CMP)

Semi-conductor process related product manufacturing service.

 Solar/Panel/LED Equipment Manufacturing

 Critical components and spare parts Manufacturing

Fab automation design and manufacturing

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 Non-process equipment development

 Micro Contamination Control solution

 Wafer AOI inspection equipment

• Wafer handling automation

 Equipment / Parts

refurbishing, repairing, and recycling services

 Technology application at re-circular services

Equipment and components circular economy

Medical equipment OEM and manufacturing

• Medical image diagnostic equipment

• Critical components OEM

 Equipment contract manufacturing

• Radiotherapy equipment manufacturing

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FOXSEMICON INTEGRATED TECHNOLOGY INC.

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Profit performance
Unit: NT$Million Stable profitability %
16,000 35%
4%
14,000
30%
29.9% 3%
12,000 4%
25%
26.2%
25.6% 25.3%
25.2%
10,000 19.9%
8%
20%
16.5%
8,000 16.2% 15.6%
14.5%
96%
15%
97%
6,000 96%
92% 10%
4,000
5%
2,000
98%
0 0%
2020 2021 2022 2023 2024Q1
Manufacturing Services Self-Development Gross Margin Operating Margin
FOXSEMICON INTEGRATED TECHNOLOGY INC. 8
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Stable & Upward Payout Ratio
58.6%
24.64
55.8%
51.0%
56.0%
46.9% 20.48
17.01
14.91
13.8
12.0
9.50
7.85
7.00
4.00
6.7%
5.0%
4.3%
2.9%
2.3%
2019 2020 2021 2022 2023
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CY2030 Semi industry revenue>$1T

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WFE($B) 2023 2024(E) 2025(F) 2026(F) 2027(F)
Semi (2024/03) 103 103 125
YoY 2% - 21%
Gartner (2024/04) 103 105 112 121 118
YoY 2% 2% 7% 8% -2%
TechInsights
99 102 120 140 132
(2024/03)
YoY 1% 3% 18% 17% -6%
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Summary

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