
WinWay — Investor Relations & Filings
WinWay Technology Co., Ltd. is a global leader in semiconductor test interface solutions, specializing in the design and manufacture of high-performance integrated circuit (IC) testing interfaces. The company provides a comprehensive portfolio of products, including logic test sockets, wafer probing solutions, probe cards, and advanced temperature control systems. WinWay serves a diverse international clientele, including a significant majority of the world's top semiconductor manufacturers. Its technical expertise focuses on high-growth applications such as High-Performance Computing (HPC), Artificial Intelligence (AI), and cloud computing. By integrating precision machining with advanced research and development, WinWay delivers highly customized and innovative testing solutions. The company is dedicated to providing reliable, high-quality interfaces that facilitate the validation and production of complex semiconductor devices.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年06月僑外投資持股 | 2026-06-01 | Chinese | |
| 本公司受邀參加高盛證券Goldman Sachs Taiwan Computex & Corporate Day | 2026-05-27 | Chinese | |
| 115年06月法人說明會簡報 — 651520260526E001.pdf | 2026-05-27 | English | |
| 115年06月法人說明會簡報 — 651520260526M001.pdf | 2026-05-27 | Chinese | |
| 115年06月法人說明會簡報 | 2026-05-27 | Chinese | |
| 本公司受邀參加大和國泰證券Daiwa Taiwan Corporate Day | 2026-05-27 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 47913272 | 115年06月僑外投資持股 | 2026-06-01 | Chinese | ||
| 47805777 | 本公司受邀參加高盛證券Goldman Sachs Taiwan Computex & Corporate Day | 2026-05-27 | Chinese | ||
| 47805722 | 115年06月法人說明會簡報 — 651520260526E001.pdf | 2026-05-27 | English | ||
| 47805592 | 115年06月法人說明會簡報 — 651520260526M001.pdf | 2026-05-27 | Chinese | ||
| 47805499 | 115年06月法人說明會簡報 | 2026-05-27 | Chinese | ||
| 47805249 | 本公司受邀參加大和國泰證券Daiwa Taiwan Corporate Day | 2026-05-27 | Chinese | ||
| 47805082 | 本公司受邀參加摩根士丹利證券Morgan Stanley Asia AI Summit 2026 | 2026-05-27 | Chinese | ||
| 47787904 | 115年05月法人說明會簡報 — 651520260526E001.pdf | 2026-05-27 | English | ||
| 47787763 | 115年05月法人說明會簡報 — 651520260526M001.pdf | 2026-05-27 | Chinese | ||
| 47787657 | 115年05月法人說明會簡報 — 651520260514E001.pdf | 2026-05-27 | English | ||
| 47787541 | 115年05月法人說明會簡報 — 651520260514M001.pdf | 2026-05-27 | English | ||
| 47787335 | 115年05月法人說明會簡報 | 2026-05-27 | Chinese | ||
| 46373918 | 115年05月法人說明會簡報 — 651520260514E001.pdf | 2026-05-14 | English | ||
| 46373916 | 115年05月法人說明會簡報 | 2026-05-14 | Chinese | ||
| 46125808 | 115年第1季海外子公司投資 | 2026-05-12 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
PARTRONCO.,LTD
Manufactures electronic components, camera modules, and Ele…
|
091700 | KR | Manufacturing |
|
p-ban.com Corp.
E-commerce platform offering a one-stop solution for PCB de…
|
3559 | JP | Manufacturing |
|
P.C.B. Technologies Ltd.
Provider of high-reliability PCB fabrication, assembly, and…
|
PCBT | IL | Manufacturing |
|
PCL
Develops and manufactures optical transceivers for data cen…
|
4977 | TW | Manufacturing |
|
Pentastone Electronics, Inc.
Manufactures wireless communication parts for mobile, autom…
|
332570 | KR | Manufacturing |
|
Peraso Inc.
Fabless semiconductor company developing high-performance m…
|
PRSO | US | Manufacturing |
|
Phoenitron Holdings Limited
Contract manufacturing and sale of smart cards and plastic …
|
8066 | HK | Manufacturing |
|
PHOTON CO., LTD
Manufacturer of components for smartphone camera modules, i…
|
208710 | KR | Manufacturing |
|
PHOTRONICS INC
Global manufacturer of photomasks for the semiconductor and…
|
PLAB | US | Manufacturing |
|
PI
Global EMS provider of electronic components, system assemb…
|
2328 | TW | Manufacturing |
WinWay via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52575/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52575 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52575 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52575 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52575}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for WinWay (id: 52575)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.