UNION SEMICONDUCTOR (HEFEI) CO., LTD. — Investor Relations & Filings
Union Semiconductor (Hefei) Co., Ltd. is an integrated circuit design enterprise specializing in high-performance analog and mixed-signal solutions. The company focuses on the research, development, and distribution of power management integrated circuits (PMICs), including DC-DC converters, linear regulators (LDOs), and battery management systems. Its product portfolio also encompasses signal chain components, interface ICs, and specialized drivers. These products are engineered for applications across consumer electronics, industrial automation, telecommunications, and automotive electronics. By prioritizing technical innovation and high-efficiency design, the company provides reliable semiconductor components characterized by low power consumption and compact form factors, supporting the requirements of advanced electronic systems and power-sensitive applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 海通证券股份有限公司关于合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券之上市保荐书 | 2024-01-11 | Chinese | |
| 关于向不特定对象发行可转换公司债券募集资金使用可行性分析报告修订情况说明的公告 | 2024-01-10 | Chinese | |
| 第一届董事会第二十四次会议决议公告 | 2024-01-10 | Chinese | |
| 合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券募集资金使用可行性分析报告(二次修订稿) | 2024-01-10 | Chinese | |
| 海通证券股份有限公司关于合肥新汇成微电子股份有限公司首次公开发行部分限售股上市流通的核查意见 | 2024-01-10 | Chinese | |
| 首次公开发行部分限售股上市流通公告 | 2024-01-10 | Chinese |
Browse filings by year
5 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
12 filings
| |||||
| 39538792 | 海通证券股份有限公司关于合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券之上市保荐书 | 2024-01-11 | Chinese | ||
| 39538772 | 关于向不特定对象发行可转换公司债券募集资金使用可行性分析报告修订情况说明的公告 | 2024-01-10 | Chinese | ||
| 39538762 | 第一届董事会第二十四次会议决议公告 | 2024-01-10 | Chinese | ||
| 39538753 | 合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券募集资金使用可行性分析报告(二次修订稿) | 2024-01-10 | Chinese | ||
| 39538744 | 海通证券股份有限公司关于合肥新汇成微电子股份有限公司首次公开发行部分限售股上市流通的核查意见 | 2024-01-10 | Chinese | ||
| 39538734 | 首次公开发行部分限售股上市流通公告 | 2024-01-10 | Chinese | ||
| 39538717 | 第一届监事会第十八次会议决议公告 | 2024-01-10 | Chinese | ||
| 39538695 | 关于为全资子公司提供担保的进展公告 | 2024-01-08 | Chinese | ||
| 39538676 | 关于收到上海证券交易所《关于合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券的审核中心意见落实函》的公告 | 2024-01-05 | Chinese | ||
| 39538666 | 关于合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券的审核中心意见落实函 | 2024-01-05 | Chinese | ||
| 39538647 | 关于以集中竞价交易方式回购公司股份的回购报告书 | 2024-01-04 | Chinese | ||
| 39538639 | 关于以集中竞价交易方式回购公司股份的进展公告 | 2024-01-03 | Chinese | ||
|
2023
3 filings
| |||||
| 39538628 | 关于竞得国有建设用地使用权并签署成交确认书暨投资项目进展的公告 | 2023-12-29 | Chinese | ||
| 39538624 | 关于回购股份事项前十大股东和前十大无限售条件股东持股信息的公告 | 2023-12-27 | Chinese | ||
| 39538616 | 海通证券股份有限公司关于合肥新汇成微电子股份有限公司2023年度持续督导现场检查报告 | 2023-12-27 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
Acbel
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
|
ACTIONS TECHNOLOGY CO., LTD.
Designs low-power wireless and multimedia SoCs for audio an…
|
688049 | CN | Manufacturing |
UNION SEMICONDUCTOR (HEFEI) CO., LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58403/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58403 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58403 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58403 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58403}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for UNION SEMICONDUCTOR (HEFEI) CO., LTD. (id: 58403)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.