
Transcom, Inc. — Investor Relations & Filings
Transcom, Inc. specializes in the research, development, and manufacturing of Radio Frequency (RF) microwave communication chips and modules. Operating as an Integrated Device Manufacturer (IDM), the company manages the entire production lifecycle, including semiconductor wafer design, fabrication, packaging, and RF testing. Its core expertise lies in Gallium Arsenide (GaAs) and Gallium Nitride (GaN) technologies, producing high-performance Monolithic Microwave Integrated Circuits (MMIC), Power Amplifiers (PA), Low Noise Amplifiers (LNA), and Solid State Power Amplifiers (SSPA). These products support a broad frequency spectrum from DC to 40 GHz. Transcom’s solutions are primarily utilized in defense, aerospace, satellite communications (SATCOM), and 5G/B5G infrastructure. Key offerings include high-reliability microwave sub-systems for radar, UAV platforms, and advanced telecommunications, often serving as solid-state alternatives to traditional tube amplifiers.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公司基本資料 | 2026-05-20 | Chinese | |
| 115年5月變更登記 | 2026-05-20 | Chinese | |
| 115年第1季財務報告書 — 202601_5222_AI2.pdf | 2026-05-14 | Chinese | |
| 公告本公司115年第一季財務報告董事會召開日期 | 2026-04-28 | Chinese | |
| 115年04月法人說明會簡報 — 522220260408E001.pdf | 2026-04-17 | English | |
| 115年04月法人說明會簡報 — 522220260408M001.pdf | 2026-04-17 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 46580654 | 公司基本資料 | 2026-05-20 | Chinese | ||
| 46580760 | 115年5月變更登記 | 2026-05-20 | Chinese | ||
| 46370112 | 115年第1季財務報告書 — 202601_5222_AI2.pdf | 2026-05-14 | Chinese | ||
| 37962597 | 公告本公司115年第一季財務報告董事會召開日期 | 2026-04-28 | Chinese | ||
| 34653987 | 115年04月法人說明會簡報 — 522220260408E001.pdf | 2026-04-17 | English | ||
| 34653982 | 115年04月法人說明會簡報 — 522220260408M001.pdf | 2026-04-17 | Chinese | ||
| 34653980 | 115年04月法人說明會簡報 | 2026-04-17 | Chinese | ||
| 34646151 | 本公司受邀參加群益證券舉辦之法人說明會 | 2026-04-16 | Chinese | ||
| 34646154 | 115年04月法人說明會簡報 — 522220260408E001.pdf | 2026-04-16 | English | ||
| 34646153 | 115年04月法人說明會簡報 — 522220260408M001.pdf | 2026-04-16 | Chinese | ||
| 34646152 | 115年04月法人說明會簡報 | 2026-04-16 | Chinese | ||
| 34401296 | 補充說明本公司於民國115年4月8日法說會之內容 | 2026-04-13 | Chinese | ||
| 33799744 | 115年04月法人說明會簡報 — 522220260408E001.pdf | 2026-04-08 | English | ||
| 33799739 | 115年04月法人說明會簡報 — 522220260408M001.pdf | 2026-04-08 | Chinese | ||
| 33799732 | 115年04月法人說明會簡報 | 2026-04-08 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
Aimtron Electronics Limited
Provides high-precision EMS, PCBA, and box-build solutions …
|
AIMTRON | IN | Manufacturing |
|
Airoha Technology Corp.
Fabless IC designer of fixed broadband, AIoT, Bluetooth, an…
|
6526 | TW | Manufacturing |
|
AJIN ELECTRONIC COMPONENTS CO.,LTD
Manufacturer of electronic components for electric and hydr…
|
009320 | KR | Manufacturing |
|
Alchip Technologies, Limited
Global provider of silicon design and production services f…
|
3661 | KY | Manufacturing |
|
ALi Corporation
Global provider of digital multimedia SoC solutions for set…
|
3041 | TW | Manufacturing |
|
ALLEGRO MICROSYSTEMS, INC.
Designs and manufactures semiconductor ICs for sensing and …
|
ALGM | US | Manufacturing |
|
Allwinner Technology Co., Ltd.
Fabless semiconductor firm designing high-performance SoCs …
|
300458 | CN | Manufacturing |
|
Alphachips, Inc.
A fabless semiconductor firm providing design services and …
|
117670 | KR | Manufacturing |
|
ALPHA & OMEGA SEMICONDUCTOR Ltd
Designer, developer, and global supplier of a broad range o…
|
AOSL | BM | Manufacturing |
|
Alphawave IP Group PLC
Semiconductor company specializing in high-speed connectivi…
|
AWE | GB | Manufacturing |
Transcom, Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52462/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52462 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52462 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52462 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52462}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Transcom, Inc. (id: 52462)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.