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Sunshine Global Circuits Co., Ltd. — Investor Relations & Filings

Ticker · 300739 ISIN · CNE1000035Y6 Shenzhen Stock Exchange Manufacturing
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Filings indexed 1,645 across all filing types
Latest filing 2023-06-28 Capital/Financing Update
Country CN China
Listing Shenzhen Stock Exchange 300739

About Sunshine Global Circuits Co., Ltd.

https://www.sunshinepcb.com

Sunshine Global Circuits Co., Ltd. specializes in the research, development, production, and sale of high-precision printed circuit boards (PCBs). The company's product portfolio includes high-density interconnect (HDI) boards, multilayer rigid PCBs, flexible circuits, and rigid-flex boards. These products are engineered to meet the stringent requirements of sectors such as automotive electronics, industrial automation, medical devices, and telecommunications infrastructure. Sunshine Global Circuits emphasizes advanced manufacturing processes and technical innovation to support high-frequency and high-speed applications. The company maintains a global service network, providing comprehensive technical support and supply chain solutions to international original equipment manufacturers (OEMs) and electronic manufacturing services (EMS) providers.

Recent filings

Filing Released Lang Actions
深圳明阳电路科技股份有限公司向不特定对象发行可转换公司债券网上路演公告
Capital/Financing Update Classification · 95% confidence The document is an announcement regarding an online roadshow for a convertible bond issuance by Shenzhen Mingyang Circuit Technology Co., Ltd. It includes details about the bond issuance, regulatory approval, and the schedule for the online roadshow. The document is short (1459 characters) and serves as a notice to investors about the event and related information, rather than containing detailed financial data or the bond issuance report itself. Therefore, it is an announcement related to capital raising activities but not the actual financing report. According to the filing definitions, this fits best under Capital/Financing Update (CAP).
2023-06-28 Chinese
3-4 深圳明阳电路科技股份有限公司创业板向不特定对象发行可转换公司债券募集说明书摘要
Capital/Financing Update Classification · 95% confidence The document is a detailed summary of a convertible bond issuance prospectus by Shenzhen Mingyang Circuit Technology Co., Ltd. It includes extensive risk disclosures, project investment details, financial data, credit ratings, profit distribution policies, and recent quarterly performance data. The document is not a full annual or quarterly report but a comprehensive offering document related to capital raising through convertible bonds. It contains detailed financial and operational information specific to the bond issuance and investment project risks, which aligns with the category of Capital/Financing Update (CAP). The length and detail confirm it is not a mere announcement or a short notice but a substantive financing document.
2023-06-28 Chinese
3-3 深圳明阳电路科技股份有限公司创业板向不特定对象发行可转换公司债券募集说明书
Capital/Financing Update Classification · 95% confidence The document is a detailed prospectus for a convertible bond issuance by Shenzhen Mingyang Circuit Technology Co., Ltd. It includes extensive information about the bond issuance, risk factors, financial data, credit ratings, profit distribution policies, and recent quarterly performance data. The document is titled as a "募集说明书" which translates to "Offering Prospectus" or "Offering Circular" for convertible bonds. It is not an annual or quarterly report, earnings release, or management discussion. It is a capital raising document specifically related to a convertible bond issuance, which fits the category of Capital/Financing Update (CAP). The length and detail confirm it is the actual document, not just an announcement or summary. Therefore, the correct classification is CAP with high confidence.
2023-06-28 Chinese
北京市中伦律师事务所关于深圳明阳电路科技股份有限公司2023 年度向不特定对象发行可转换公司债券的法律意见书及历次补充法律意见书
Regulatory Filings
2023-06-28 Chinese
第三届监事会第十八次会议决议公告
Capital/Financing Update Classification · 95% confidence The document is a formal announcement of resolutions passed at the 18th meeting of the third Supervisory Board of Shenzhen Mingyang Circuit Technology Co., Ltd. It details decisions related to the issuance of convertible bonds, including approval of the issuance plan, terms, subscription arrangements, and related authorizations. The document includes voting results and procedural compliance statements. It is not a full financial report, earnings release, or management discussion, but rather a regulatory announcement about financing activities and corporate governance decisions. Given the detailed update on the company's convertible bond issuance and related approvals, this fits best under Capital/Financing Update (CAP). The document length is 3219 characters, which is consistent with an announcement rather than a full report. Therefore, the classification is CAP with high confidence.
2023-06-28 Chinese
关于公司高级管理人员减持股份的预披露公告
Director's Dealing Classification · 100% confidence The document is a public announcement regarding the planned reduction of shares held by a senior management member (vice general manager and board secretary) of the company. It details the shareholder's identity, shareholding percentage, planned reduction amount, reasons for reduction, and compliance with relevant securities laws and regulations. The document does not contain financial statements, earnings data, or detailed financial analysis. It is a disclosure about a director's personal share transactions (share reduction). Therefore, it fits the category of Director's Dealing (DIRS). The document length is short and focused solely on this insider share transaction disclosure, confirming the classification.
2023-06-27 Chinese

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