SPEL Semiconductor Ltd. — Investor Relations & Filings

SPEL Semiconductor Ltd. provides comprehensive Outsourced Semiconductor Assembly and Test (OSAT) services. The company specializes in Integrated Circuit (IC) packaging and testing solutions for global semiconductor manufacturers, including Integrated Device Manufacturers (IDMs) and Fabless companies. Its core service portfolio encompasses wafer probing, assembly, and final testing across a wide range of package types such as Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), Plastic Dual In-line Package (PDIP), and Quad Flat No-lead (QFN). SPEL offers turnkey solutions that include wafer sort, assembly, and testing to ensure high reliability and performance for diverse applications in consumer electronics, automotive, and industrial sectors. The facility maintains advanced manufacturing capabilities to support both high-volume production and specialized low-volume requirements, focusing on quality management and technical precision.