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Shanghai Fudan Microelectronics Group Co.,Ltd. — Investor Relations & Filings

Ticker · 688385 LEI · 300300MN0B6IF027O317 Shanghai Stock Exchange Manufacturing
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Filings indexed 666 across all filing types
Latest filing 2024-01-12 Regulatory Filings
Country CN China
Listing Shanghai Stock Exchange 688385

About Shanghai Fudan Microelectronics Group Co.,Ltd.

https://eng.fmsh.com/

Shanghai Fudan Microelectronics Group Co., Ltd. specializes in the design, development, and testing of Application Specific Integrated Circuits (ASICs). The company offers a diverse product portfolio including security and identification chips, non-volatile memory, smart meter integrated circuits, and Field Programmable Gate Arrays (FPGAs). Its security and identification solutions cover contactless smart cards, RFID tags, and security processors used in finance, transportation, and public services. The memory segment includes high-performance EEPROM and Flash products. Additionally, the company provides solutions for smart power management and automotive electronics. By leveraging advanced semiconductor technologies, it serves global markets in telecommunications, industrial control, and consumer electronics, focusing on high-reliability and high-security applications.

Recent filings

Filing Released Lang Actions
中信建投证券股份有限公司关于上海复旦微电子集团股份有限公司向不特定对象发行可转换公司债券之上市保荐书（上会稿）
Regulatory Filings Classification · 95% confidence The document is titled as a "上市保荐书" which translates to a "Listing Sponsorship Letter" or "Sponsorship Document" related to the issuance of A-share convertible bonds by Shanghai Fudan Microelectronics Group Co., Ltd. It is issued by CITIC Securities Co., Ltd. The content includes detailed company information, definitions, core technologies, financial data, and the sponsor's declarations and commitments. The document is a formal sponsorship letter required for the listing of securities, which is a regulatory filing related to the issuance and listing process but is not itself a financial report like an annual or interim report. It is not an earnings release, call transcript, or management report. It is a detailed regulatory document supporting the issuance and listing of convertible bonds, which fits best under the category of Regulatory Filings (RNS) as it does not match other more specific categories such as Capital/Financing Update (CAP) which would be more about announcements of financing events rather than the full sponsorship document. The document length is substantial and contains detailed disclosures, but it is not a financial report per se. Therefore, the best classification is Regulatory Filings (RNS).
2024-01-12 Chinese
上海复旦微电子集团股份有限公司向不特定对象发行可转换公司债券募集说明书（上会稿）
Capital/Financing Update Classification · 95% confidence The document is titled as a "募集说明书" which translates to a "Prospectus" or "Offering Circular" for the issuance of A-share convertible bonds by Shanghai Fudan Microelectronics Group Co., Ltd. It contains detailed information about the bond issuance, including risk factors, company background, financial data, use of proceeds, and legal statements. The document is lengthy (15,000 characters) and includes comprehensive financial and operational details related to the capital raising activity. This matches the definition of a Capital/Financing Update (CAP), which covers updates on company fundraising and financing activities. It is not an annual or interim report, nor an earnings release or regulatory filing. Therefore, the correct classification is CAP with high confidence.
2024-01-12 Chinese
会计师关于审核问询函的回复（二次修订稿）
Audit Report / Information Classification · 95% confidence The document is a detailed response to an inquiry letter from the Shanghai Stock Exchange regarding the issuance of A-share convertible bonds by Shanghai Fudan Microelectronics Group Co., Ltd. It includes extensive financial and project investment details, audit opinions from Ernst & Young Hua Ming, and verification of the use of previously raised funds. The document discusses capital expenditures, project progress, and financial metrics related to the bond issuance. It is not a full annual or interim report but rather a regulatory response with audit confirmations and detailed financial and project disclosures related to a financing activity. The presence of audit reports and detailed financial verification related to a bond issuance indicates this is an Audit Report / Information filing rather than a full Annual Report or a simple announcement. The document length and content confirm it is not a brief announcement or a certification letter but a substantive audit and verification report related to financing. Therefore, the most appropriate classification is Audit Report / Information (AR). H1 2023
2024-01-12 Chinese
上海市锦天城律师事务所关于上海复旦微电子集团股份有限公司向不特定对象发行可转换公司债券的法律意见书
Capital/Financing Update Classification · 95% confidence The document is a detailed legal opinion letter issued by a law firm regarding Shanghai Fudan Microelectronics Group Co., Ltd.'s issuance of A-share convertible corporate bonds to unspecified investors. It references relevant laws and regulations such as the Securities Law, Company Law, and Convertible Corporate Bond Management Measures. The document includes extensive legal analysis on the company's qualifications, approval processes, compliance with laws, and details about the bond issuance. It is not a financial report, earnings release, or management discussion, but a legal opinion related to a capital raising activity. Therefore, it fits best under the category of Capital/Financing Update (CAP). The document length (15,000 characters) and content confirm it is a substantive legal opinion, not a brief announcement or certification, so it is not Regulatory Filings (RNS) or Report Publication Announcement (RPA).
2024-01-12 Chinese
中信建投证券股份有限公司关于上海复旦微电子集团股份有限公司向不特定对象发行可转换公司债券之发行保荐书（上会稿）
Capital/Financing Update Classification · 95% confidence The document is titled as a "发行保荐书" (Securities Issuance Sponsorship Letter) issued by 中信建投证券股份有限公司 (CITIC Securities) regarding 上海复旦微电子集团股份有限公司's issuance of A-share convertible corporate bonds to unspecified investors. It contains detailed information about the issuance, the sponsors, legal compliance, financial data, shareholder structure, and internal review procedures. The document is a formal sponsorship letter related to a securities issuance, which is a type of capital market transaction and financing activity. It is not an annual report, audit report, earnings release, or other types of filings. The document is lengthy (15,000 characters) and contains substantive content about the financing issuance. Therefore, it fits best under the category of Capital/Financing Update (CAP).
2024-01-12 Chinese
H股市场公告-發佈企業通訊之新安排
Regulatory Filings Classification · 95% confidence The document is a notification from Shanghai Fudan Microelectronics Group Company Limited to its H shareholders regarding new arrangements for the distribution of corporate communications in electronic form. It references compliance with the Hong Kong Stock Exchange Listing Rules, specifically Rule 2.07A, and details how shareholders can receive corporate communications electronically or request printed copies. The document does not contain any financial data, financial statements, or detailed reports. Instead, it is an announcement about the method and process of distributing corporate communications going forward. The document length is 2085 characters, which is relatively short and consistent with an announcement rather than a full report. Therefore, this document fits the category of a Regulatory Filing (RNS) as it is a general regulatory announcement about communication procedures and does not fit into other specific categories such as Annual Report, Interim Report, or Proxy Solicitation.
2024-01-12 Chinese

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