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Shanghai Fudan Microelectronics Group Co.,Ltd. — Investor Relations & Filings

Ticker · 688385 LEI · 300300MN0B6IF027O317 Shanghai Stock Exchange Manufacturing
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Filings indexed 666 across all filing types
Latest filing 2024-09-09 Interim / Quarterly Rep…
Country CN China
Listing Shanghai Stock Exchange 688385

About Shanghai Fudan Microelectronics Group Co.,Ltd.

https://eng.fmsh.com/

Shanghai Fudan Microelectronics Group Co., Ltd. specializes in the design, development, and testing of Application Specific Integrated Circuits (ASICs). The company offers a diverse product portfolio including security and identification chips, non-volatile memory, smart meter integrated circuits, and Field Programmable Gate Arrays (FPGAs). Its security and identification solutions cover contactless smart cards, RFID tags, and security processors used in finance, transportation, and public services. The memory segment includes high-performance EEPROM and Flash products. Additionally, the company provides solutions for smart power management and automotive electronics. By leveraging advanced semiconductor technologies, it serves global markets in telecommunications, industrial control, and consumer electronics, focusing on high-reliability and high-security applications.

Recent filings

Filing Released Lang Actions
中信建投证券股份有限公司关于上海复旦微电子集团股份有限公司2024年半年度持续督导跟踪报告
Interim / Quarterly Report Classification · 95% confidence The document is titled as a '2024年半年度持续督导跟踪报告' which translates to '2024 Half-Year Continuous Supervision Tracking Report' issued by the sponsor (中信建投证券股份有限公司) for the company 上海复旦微电子集团股份有限公司. It contains detailed information about the continuous supervision work done by the sponsor, summaries of compliance, risk factors, financial data for the first half of 2024, and other operational and governance details. The document includes substantive financial data and analysis for the half-year period (2024 1-6 months), such as revenue, net profit, cash flow, and R&D expenses. It is not merely an announcement or a certification but a comprehensive report covering the half-year period. This matches the definition of an Interim / Quarterly Report (IR). H1 2024
2024-09-09 Chinese
关于更新向不特定对象发行可转换公司债券募集说明书（注册稿）等相关文件的提示性公告
Capital/Financing Update Classification · 95% confidence The document is an announcement from Shanghai Fudan Microelectronics Group Co., Ltd. regarding the update of the prospectus for a convertible bond issuance to unspecified investors. It references regulatory approvals from the China Securities Regulatory Commission and the Shanghai Stock Exchange. The document mentions updates to financial data in the prospectus in line with the company's 2024 half-year report but does not contain the financial report itself. The document is short (899 characters) and serves as a notice about updated offering documents rather than the offering documents themselves. This fits the category of a Capital/Financing Update (CAP), as it relates to fundraising activities and capital structure changes.
2024-09-09 Chinese
发行人最近三年的财务报告及其审计报告以及最近一期的财务报告
Annual Report Classification · 100% confidence The document is titled as audited financial statements for the year 2021 of Shanghai Fudan Microelectronics Group Co., Ltd. It includes an audit report by Ernst & Young Hua Ming, detailed consolidated and company balance sheets, profit and loss statements, cash flow statements, shareholders' equity changes, and extensive notes to the financial statements. The presence of an auditor's opinion, detailed financial statements, notes, and management responsibilities indicates this is a full annual financial report. The document length is substantial (15,000 characters), and it contains actual financial data and analysis, not just an announcement or certification. Therefore, it fits the definition of an Annual Report (10-K). FY 2021
2024-09-09 Chinese
中信建投证券股份有限公司关于上海复旦微电子集团股份有限公司向不特定对象发行可转换公司债券之发行保荐书（2024年半年度财务数据更新版）
Capital/Financing Update Classification · 95% confidence The document is titled as a "发行保荐书" (Securities Issuance Sponsorship Letter) issued by 中信建投证券股份有限公司 regarding 上海复旦微电子集团股份有限公司's issuance of A-share convertible bonds to unspecified investors. It contains detailed information about the issuance, the sponsors, the issuer's background, financial data, shareholding structure, and compliance with relevant laws and regulations. The document is lengthy (15,000 characters) and includes substantive financial data and detailed descriptions of the issuance process, sponsor responsibilities, and financial metrics. This type of document is a formal sponsorship letter related to a capital raising event, specifically a convertible bond issuance. According to the filing definitions, updates on company fundraising or financing activities fall under Capital/Financing Update (CAP). This document is not an annual report, audit report, earnings release, or other categories. It is a detailed sponsorship letter for a securities issuance, which aligns with Capital/Financing Update (CAP).
2024-09-09 Chinese
关于参加2024年半年度芯片设计专场集体业绩说明会公告
Investor Presentation Classification · 90% confidence The document is an announcement about the company's participation in a 2024 semi-annual chip design collective performance explanation meeting. It references the company's 2024 semi-annual report already disclosed on August 29, 2024, and provides details about the upcoming investor meeting including date, time, location, and participation instructions. The document does not contain actual financial statements or detailed financial analysis but rather informs investors about the meeting where such information will be discussed. The document length is short (1429 characters) and it serves as a notice for an investor presentation event rather than the presentation or report itself. Therefore, it fits best as an Investor Presentation (IP) announcement or a Regulatory Filing (RNS). However, since it is specifically about an investor meeting focused on financial results and interaction, the best classification is Investor Presentation (IP).
2024-09-03 Chinese
关于使用暂时闲置募集资金进行现金管理的公告
Capital/Financing Update Classification · 95% confidence The document is an announcement by Shanghai Fudan Microelectronics Group Co., Ltd. regarding the use of temporarily idle raised funds for cash management. It details the board and supervisory committee approvals, the amount and purpose of the cash management, risk controls, and compliance with regulatory requirements. The document does not contain financial statements or detailed financial performance data but rather describes a specific financing-related operational update about the use of raised funds. It is not a full annual or interim report, audit report, or earnings release. It is not a regulatory filing in the sense of certifications or legal proceedings. The document is a formal announcement about capital management activities related to raised funds, which fits best under the category of Capital/Financing Update (CAP). The document length is under 5,000 characters, but it is not merely announcing the publication of a report; it is itself the announcement of a financing-related activity. Therefore, the appropriate classification is CAP with high confidence.
2024-08-28 Chinese

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