Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于高级管理人员减持计划实施完毕的公告 | 2023-05-12 | Chinese | |
| 第四届董事会第三十五次会议决议公告 | 2023-05-11 | Chinese | |
| 关于全资子公司对外投资设立合伙企业的公告 | 2023-05-11 | Chinese | |
| 关于控股子公司完成工商变更登记的公告 | 2023-05-05 | Chinese | |
| 2022年年度股东大会的法律意见书 | 2023-04-26 | Chinese | |
| 2023年一季度报告 | 2023-04-26 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 37281336 | 关于高级管理人员减持计划实施完毕的公告 | 2023-05-12 | Chinese | ||
| 37281324 | 第四届董事会第三十五次会议决议公告 | 2023-05-11 | Chinese | ||
| 37281315 | 关于全资子公司对外投资设立合伙企业的公告 | 2023-05-11 | Chinese | ||
| 37281307 | 关于控股子公司完成工商变更登记的公告 | 2023-05-05 | Chinese | ||
| 37281302 | 2022年年度股东大会的法律意见书 | 2023-04-26 | Chinese | ||
| 37281291 | 2023年一季度报告 | 2023-04-26 | Chinese | ||
| 37281276 | 关于瑞典子公司完成收购半导体生产制造园区的公告 | 2023-04-26 | Chinese | ||
| 37281269 | 关于回购注销部分限制性股票的减资公告 | 2023-04-26 | Chinese | ||
| 37281267 | 第四届监事会第二十六次会议决议公告 | 2023-04-26 | Chinese | ||
| 37281259 | 第四届董事会第三十四次会议决议公告 | 2023-04-26 | Chinese | ||
| 37281252 | 2023年第一季度报告披露提示性公告 | 2023-04-26 | Chinese | ||
| 37281245 | 2022年年度股东大会决议公告 | 2023-04-26 | Chinese | ||
| 37281237 | 关于控股股东、实际控制人减持计划提前终止的公告 | 2023-04-25 | Chinese | ||
| 37281228 | 关于控股股东股票质押式回购交易提前购回的公告 | 2023-04-25 | Chinese | ||
| 37281226 | 关于召开2022年年度股东大会的提示性公告 | 2023-04-23 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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