PARPRO Corporation — Investor Relations & Filings
PARPRO Corporation is a global provider of full-service contract manufacturing and design solutions, specializing in high-reliability applications. The company offers a comprehensive suite of services, including Electronic Manufacturing Services (EMS), printed circuit board assembly (PCBA), precision machining, metal fabrication, and complex electro-mechanical assembly. PARPRO provides end-to-end support through Original Design Manufacturing (ODM) and Original Equipment Manufacturing (OEM) models, covering the entire product lifecycle from engineering and system design to global supply chain management. Its core expertise serves demanding sectors such as aerospace, defense, gaming, and industrial automation. Notably, the company is a key contributor to low earth orbit (LEO) satellite technology, operating advanced laboratories for next-generation antenna sub-systems. By integrating vertical manufacturing capabilities, PARPRO delivers specialized solutions for mission-critical environments.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年年報及股東會資料 — 2026_4916_20260529F17.pdf | 2026-04-28 | Chinese | |
| 115年年報及股東會資料 — 2026_4916_20260529FE5.pdf | 2026-04-28 | English | |
| 115年年報及股東會資料 — 2026_4916_20260529FE2.pdf | 2026-04-28 | Chinese | |
| 115年年報及股東會資料 — 2026_4916_20260529FE1.pdf | 2026-04-28 | English | |
| 115年年報及股東會資料 — 2026_4916_20260529F13.pdf | 2026-04-28 | Chinese | |
| 115年年報及股東會資料 — 2026_4916_20260529F02.pdf | 2026-04-28 | Chinese |
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
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|---|---|---|---|
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China Strategic Technology Group Limited
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1725 | HK | Manufacturing |
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CHINA WAFER LEVEL CSP CO.,LTD.
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603005 | CN | Manufacturing |
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CHINA ZHENHUA(GROUP) SCIENCE& TECHNOLOGY CO.,LTD
Develops high-reliability electronic components and ICs for…
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000733 | CN | Manufacturing |
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Chin-Poon Industrial Co., Ltd.
Manufactures printed circuit boards for automotive and cons…
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2355 | TW | Manufacturing |
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ChipMOS TECHNOLOGIES INC.
Global provider of semiconductor assembly and test services…
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8150 | TW | Manufacturing |
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CHIPMOS TECHNOLOGIES INC
Provider of outsourced semiconductor assembly and testing (…
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IMOS | US | Manufacturing |
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Chipsea Technologies (Shenzhen) Corp., Ltd.
Fabless designer of high-precision ADCs and MCUs for IoT an…
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688595 | CN | Manufacturing |
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CHIYODA INTEGRE CO.,LTD.
Global supplier of structural and functional parts for the …
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6915 | JP | Manufacturing |
PARPRO Corporation via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52437/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52437 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52437 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52437 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52437}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for PARPRO Corporation (id: 52437)"
Report missing filing
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