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Para Light — Investor Relations & Filings

Ticker · 6226 ISIN · TW0006226004 TW Manufacturing
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Filings indexed 49 across all filing types
Latest filing 2026-05-25 Regulatory Filings
Country TW Taiwan
Listing TW 6226

About Para Light

https://www.para.com.tw

Para Light Electronics Co., Ltd. is a global provider of optoelectronic components and lighting solutions. Established in 1987, the company specializes in the design and manufacturing of a broad range of LED products. Its portfolio includes power semiconductors, surface-mount device (SMD) LEDs, PLCC components, digital displays, and full-color light strips. Additionally, the company provides specialized automotive LEDs and integrated lighting modules. With multiple international manufacturing facilities and over 20 global offices, Para Light serves diverse markets worldwide. The company maintains a strong focus on research and development, supported by a dedicated optical laboratory and engineering teams. Its operations are certified under international standards, including ISO 9001, ISO 14001, and IATF 16949, ensuring high-quality production for industrial and commercial applications.

Recent filings

Filing Released Lang Actions
115年5月公開說明書 — 200212_R163_B08.wdl
Regulatory Filings
2026-05-25 Chinese
115年5月公開說明書 — 202605_6226_B021.pdf
Capital/Financing Update Classification · 95% confidence The document is a detailed public prospectus (“公開說明書”) for the issuance of secured corporate bonds (115年度第一次有擔保普通公司債) by Para Light Electronics, outlining bond terms, amounts, interest rates, use of proceeds, underwriting arrangements, and detailed financing plans. This is a primary financing activity and fundraising disclosure, fitting the Capital/Financing Update category rather than a report, share issue, or management change.
2026-05-25 Chinese
115年5月公開說明書 — 202306_6226_B05.pdf
Capital/Financing Update Classification · 92% confidence The document is a detailed public prospectus (“公開說明書”) for the issuance of the company’s secured corporate bonds (ordinary corporate bonds). It provides the terms of the bond issue (amount, interest rate, maturity, use of proceeds, underwriting arrangements, trustee details, etc.), which clearly constitutes a financing activity announcement. This matches the “Capital/Financing Update” category (CAP), as it is about a new fundraising through bond issuance, rather than a mere regulatory announcement or an equity share issue.
2026-05-25 Chinese
115年5月公開說明書 — 201712_6226_B1c.pdf
Share Issue/Capital Change Classification · 90% confidence The document is a full “公開說明書” (public offering prospectus) detailing the issuance of employee stock subscription rights (認股權憑證), including offering size, terms, capital structure before and after, risk disclosures, financial statements, governance, and use of proceeds. This is not a simple announcement or regulatory attestation but the actual prospectus for a new share issuance. Therefore it falls under Share Issue/Capital Change (SHA).
2026-05-25 Chinese
115年5月公開說明書 — 202305_6226_B021.pdf
Capital/Financing Update Classification · 90% confidence The document is a full “公開說明書” (prospectus) detailing the issuance of secured corporate bonds: bond type, amount, interest rate, issuance terms, use of proceeds, underwriting, repayment plan, and detailed financial tables. It represents a company’s fundraising activity and capital structure change (debt issuance), not merely an announcement or a routine regulatory form. This falls squarely under Capital/Financing Update.
2026-05-25 Chinese
115年5月公開說明書 — 202006_6226_B05.pdf
Capital/Financing Update Classification · 85% confidence The document is a detailed public prospectus (“公開說明書”) for Para Light Electronics Co., Ltd.’s first secured corporate bond issuance of the 109th year. It specifies bond terms (size, interest rate, maturity), underwriting, trustee arrangements, use of proceeds, and related financing details. This is clearly a corporate debt fundraising/financing activity, matching the “Capital/Financing Update” category.
2026-05-25 Chinese

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