LB SEMICON, INC. Logo

LB SEMICON, INC.

OSAT company specializing in wafer bumping, packaging, and testing solutions.

061970 | KO

Overview

Corporate Details

ISIN(s):
KR7061970000
LEI:
Country:
South Korea
Address:
경기도 평택시 청북면 청북산단로 138, 평택시

Description

LB SEMICON, INC. is an outsourced semiconductor assembly and test (OSAT) company specializing in the back-end processes of semiconductor manufacturing. The company's core services include flip-chip wafer bumping, wafer-level packaging (WLP), and testing solutions for semiconductor chips. A key area of focus is providing components for display equipment, such as gold bumping for TFT-LCD and OLED display driver integrated circuits (ICs). LB SEMICON was a pioneer in the commercialization of flip-chip wafer bumping technology in its domestic market and continues to advance its capabilities in areas like fan-out wafer-level packaging (FO-WLP).

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Date Filing Language Size Actions
2022-03-03 00:00
주주총회소집결의
Korean 10.4 KB
2022-03-03 00:00
현금ㆍ현물배당결정
Korean 8.4 KB
2022-03-03 00:00
연결재무제표기준영업(잠정)실적(공정공시)
Korean 16.3 KB
2022-02-28 00:00
주식등의대량보유상황보고서(일반)
Korean 142.6 KB
2021-12-15 00:00
주주명부폐쇄기간또는기준일설정
Korean 4.1 KB
2021-11-15 00:00
분기보고서 (2021.09)
Korean 890.6 KB
2021-10-28 00:00
연결재무제표기준영업(잠정)실적(공정공시)
Korean 16.3 KB
2021-09-28 00:00
신규시설투자등
Korean 7.3 KB
2021-08-17 00:00
반기보고서 (2021.06)
Korean 893.0 KB
2021-07-29 00:00
연결재무제표기준영업(잠정)실적(공정공시)
Korean 16.3 KB
2021-06-29 00:00
주식등의대량보유상황보고서(약식)
Korean 93.7 KB
2021-06-07 00:00
[기재정정]타법인주식및출자증권처분결정
Korean 13.9 KB
2021-06-07 00:00
[기재정정]유상증자결정(종속회사의주요경영사항)
Korean 23.1 KB
2021-05-17 00:00
분기보고서 (2021.03)
Korean 835.8 KB
2021-04-28 00:00
연결재무제표기준영업(잠정)실적(공정공시)
Korean 16.3 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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