Ingenic Semiconductor Co., Ltd — Investor Relations & Filings
Ingenic Semiconductor Co., Ltd. is a fabless semiconductor company specializing in the development of high-performance, low-power System-on-Chip (SoC) solutions and advanced memory products. The company leverages its proprietary XBurst CPU technology, based on the MIPS architecture, to deliver energy-efficient processing for a wide range of applications. Its product portfolio includes video processors, AIoT controllers, and high-reliability memory solutions such as DRAM, SRAM, and Flash memory, following the strategic acquisition of Integrated Silicon Solution, Inc. (ISSI). Ingenic serves diverse global markets, including automotive electronics, industrial automation, medical devices, smart home systems, and wearable technology. The company is recognized for its ability to integrate sophisticated processing capabilities with specialized memory, providing robust hardware platforms for mission-critical and battery-operated devices.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于计提资产减值准备及核销资产的公告 | 2026-03-27 | Chinese | |
| 关于对部分募集资金投资项目进行调整的公告 | 2026-03-27 | Chinese | |
| 中德证券有限责任公司关于北京君正集成电路股份有限公司以募集资金置换使用自有资金支付的募投项目部分款项的核查意见 | 2026-03-27 | Chinese | |
| 第六届董事会第十次会议决议公告 | 2026-03-27 | Chinese | |
| 关于2025年度利润分配方案的公告 | 2026-03-27 | Chinese | |
| 2025年度募集资金存放、管理与使用情况的专项报告 | 2026-03-27 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 36088225 | 关于计提资产减值准备及核销资产的公告 | 2026-03-27 | Chinese | ||
| 36088223 | 关于对部分募集资金投资项目进行调整的公告 | 2026-03-27 | Chinese | ||
| 36088219 | 中德证券有限责任公司关于北京君正集成电路股份有限公司以募集资金置换使用自有资金支付的募投项目部分款项的核查意见 | 2026-03-27 | Chinese | ||
| 36088118 | 第六届董事会第十次会议决议公告 | 2026-03-27 | Chinese | ||
| 36088116 | 关于2025年度利润分配方案的公告 | 2026-03-27 | Chinese | ||
| 36088114 | 2025年度募集资金存放、管理与使用情况的专项报告 | 2026-03-27 | Chinese | ||
| 36088110 | 关于会计师事务所履职情况的评估报告 | 2026-03-27 | Chinese | ||
| 36088105 | 2025年度非经营性资金占用及其他关联资金往来情况汇总表 | 2026-03-27 | Chinese | ||
| 36088101 | 2025年年度报告摘要 | 2026-03-27 | Chinese | ||
| 36088100 | 北京君正集成电路股份有限公司2025年度募集资金年度存放、管理与使用情况鉴证报告 | 2026-03-27 | Chinese | ||
| 36088087 | 关于续聘公司2026年度审计机构的公告 | 2026-03-27 | Chinese | ||
| 36088082 | 关于调整董事、高级管理人员薪酬方案的公告 | 2026-03-27 | Chinese | ||
| 36088080 | 公司章程修订对照表 | 2026-03-27 | Chinese | ||
| 36088078 | 公司章程(2026年3月) | 2026-03-27 | Chinese | ||
| 36088077 | 公司章程(草案)(H 股上市后适用) | 2026-03-27 | Chinese | ||
Market data
Market data not available
Price history
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Ingenic Semiconductor Co., Ltd via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55229/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55229 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55229 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55229 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55229}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Ingenic Semiconductor Co., Ltd (id: 55229)"
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