Honor Device Co. Ltd. — Investor Relations & Filings
Filings indexed
884
across all filing types
Latest filing
2026-04-21
Regulatory Filings
Country
CN
China
Listing
Shenzhen Stock Exchange
300870
Honor Device Co. Ltd. is a global provider of smart devices. Its product portfolio includes smartphones, laptops, tablets, and wearable technology. The company is focused on developing an interconnected ecosystem of AI-powered devices, aiming to revolutionize human-to-device interactions. Through significant investment in artificial intelligence, Honor seeks to create a seamless and intelligent user experience across its entire product range. The company's stated goal is to become an iconic global technology brand.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于公司开展外汇套期保值业务的公告 | 2026-04-21 | Chinese | |
| 2025年度董事会工作报告 | 2026-04-21 | Chinese | |
| 公司2025年度独立董事述职报告—李志伟 | 2026-04-21 | Chinese | |
| 天职业字[2026]17079-1号-内控审计报告 | 2026-04-21 | Chinese | |
| 关于召开2025年年度股东会的通知 | 2026-04-21 | Chinese | |
| 第三届董事会2026年第二次会议决议公告 | 2026-04-21 | Chinese |
Browse filings by year
7 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 39177885 | 关于公司开展外汇套期保值业务的公告 | 2026-04-21 | Chinese | ||
| 39177876 | 2025年度董事会工作报告 | 2026-04-21 | Chinese | ||
| 39177872 | 公司2025年度独立董事述职报告—李志伟 | 2026-04-21 | Chinese | ||
| 39177866 | 天职业字[2026]17079-1号-内控审计报告 | 2026-04-21 | Chinese | ||
| 39177830 | 关于召开2025年年度股东会的通知 | 2026-04-21 | Chinese | ||
| 39177829 | 第三届董事会2026年第二次会议决议公告 | 2026-04-21 | Chinese | ||
| 39177821 | 关于2025年度利润分配及资本公积转增股本预案的公告 | 2026-04-21 | Chinese | ||
| 39177820 | 天职业字[2026]17079-3号-2025年度募集资金年度存放、管理与使用情况鉴证报告 | 2026-04-21 | Chinese | ||
| 39177817 | 2025年年度报告 | 2026-04-21 | Chinese | ||
| 39177816 | 关于使用闲置募集资金和自有资金进行现金管理的公告 | 2026-04-21 | Chinese | ||
| 39177814 | 国金证券股份有限公司关于深圳欧陆通电子股份有限公司使用闲置募集资金和自有资金进行现金管理的核查意见 | 2026-04-21 | Chinese | ||
| 39177810 | 关于续聘会计师事务所的公告 | 2026-04-21 | Chinese | ||
| 39177808 | 国金证券股份有限公司关于深圳欧陆通电子股份有限公司2025年度募集资金存放与使用情况的核查意见 | 2026-04-21 | Chinese | ||
| 39177798 | 欧陆通2025年可持续发展报告 | 2026-04-21 | Chinese | ||
| 39177795 | 董事、高级管理人员薪酬管理制度 | 2026-04-21 | Chinese | ||
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Honor Device Co. Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/17834/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=17834 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=17834 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
Full reference: API reference · OpenAPI schema
cURL
$ curl https://api.financialreports.eu/api/filings/?company=17834 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 17834}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Honor Device Co. Ltd. (id: 17834)"
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