HanWool Semiconductor, Inc.
320000 | KO
Overview
Corporate Details
- ISIN(s):
- KR7320000003
- LEI:
- Country:
- South Korea
- Address:
- 경기도 군포시 고산로 166 104동 1001호, 군포시
- Sector:
- Manufacturing
- Industry:
- Manufacture of electronic components and boards
Description
No description available.
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Filings
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Bulk Actions:
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-09-09 00:00 |
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
|
Korean | 99.9 KB | ||
| 2025-08-19 00:00 |
Capital/Financing Update
주권관련사채권의취득결정
|
Korean | 27.0 KB | ||
| 2025-08-14 00:00 |
Interim / Quarterly Report
반기보고서 (2025.06)
|
Korean | 1.1 MB | ||
| 2025-06-24 00:00 |
Capital/Financing Update
[기재정정]주권관련사채권의취득결정
|
Korean | 33.8 KB | ||
| 2025-05-15 00:00 |
Quarterly Report
분기보고서 (2025.03)
|
Korean | 1.0 MB | ||
| 2025-05-12 00:00 |
Share Issue/Capital Change
전환청구권행사 (제2회차)
|
Korean | 14.9 KB | ||
| 2025-04-18 00:00 |
Capital/Financing Update
[기재정정]주요사항보고서(자기전환사채매도결정)
|
Korean | 69.1 KB | ||
| 2025-04-03 00:00 |
Capital/Financing Update
주요사항보고서(자기전환사채매도결정)
|
Korean | 62.4 KB | ||
| 2025-03-31 00:00 |
AGM Information
정기주주총회결과
|
Korean | 24.6 KB | ||
| 2025-03-31 00:00 |
Board/Management Information
대표이사변경
|
Korean | 9.8 KB | ||
| 2025-03-31 00:00 |
Board/Management Information
사외이사의선임ㆍ해임또는중도퇴임에관한신고
|
Korean | 9.7 KB | ||
| 2025-03-26 00:00 |
Interim / Quarterly Report
[기재정정]반기보고서 (2024.06)
|
Korean | 979.9 KB | ||
| 2025-03-26 00:00 |
Quarterly Report
[기재정정]분기보고서 (2024.09)
|
Korean | 1007.4 KB | ||
| 2025-03-26 00:00 |
Annual Report
[기재정정]사업보고서 (2024.12)
|
Korean | 1.3 MB | ||
| 2025-03-20 00:00 |
Annual Report
사업보고서 (2024.12)
|
Korean | 1.3 MB |
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
Company
Country
Ticker
View
Designs & makes interconnect, sensor & antenna solutions for automotive, aerospace, IT & mobile markets.
United States of America
APH
United States of America
APH
Designs optical solutions like LEDs and sensors for automotive, medical, and industrial markets.
Austria
AMS
Austria
AMS
Designs high-performance analog and mixed-signal ICs for industrial, auto, and comms markets.
United States of America
ADI
United States of America
ADI
Fabless chip designer of TCONs and SoCs for the global high-resolution display market.
South Korea
123860
South Korea
123860
Provider of outsourced semiconductor packaging and testing (OSAT) for various electronic components.
Japan
6832
Japan
6832
Back-end semiconductor services, including packaging, testing, and inspection equipment.
South Korea
200470
South Korea
200470
Global provider of outsourced semiconductor assembly, testing (OSAT) & manufacturing services.
United States of America
ASX
United States of America
ASX
Supplies advanced high-tech PCBs and lifecycle services to the global electronics industry.
Finland
ACG1V
Finland
ACG1V
Manufactures sanitation products, complex molded parts, and protective semiconductor materials.
Japan
4241
Japan
4241
Manufactures high-end PCBs and IC substrates for mobile, auto, industrial, and medical devices.
Austria
ATS
Austria
ATS