Hana Materials Inc.
166090 | KO
Overview
Corporate Details
- ISIN(s):
- KR7166090001
- LEI:
- Country:
- South Korea
- Address:
- 충청남도 천안시 서북구 3공단3로 42, 천안시
- Website:
- https://en.hanamts.com/
- Sector:
- Manufacturing
- Industry:
- Manufacture of electronic components and boards
Description
No description available.
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Filings
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Bulk Actions:
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-09-08 00:00 |
Major Shareholding Notification
[기재정정]최대주주변경을수반하는주식담보제공계약체결
|
Korean | 39.1 KB | ||
| 2025-09-08 00:00 |
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
|
Korean | 127.3 KB | ||
| 2025-08-14 00:00 |
Interim / Quarterly Report
반기보고서 (2025.06)
|
Korean | 3.0 MB | ||
| 2025-08-06 00:00 |
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
|
Korean | 127.1 KB | ||
| 2025-08-05 00:00 |
Major Shareholding Notification
[기재정정]최대주주변경을수반하는주식담보제공계약체결
|
Korean | 39.1 KB | ||
| 2025-06-30 00:00 |
Major Shareholding Notification
[기재정정]최대주주변경을수반하는주식담보제공계약체결
|
Korean | 39.1 KB | ||
| 2025-06-30 00:00 |
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
|
Korean | 127.2 KB | ||
| 2025-06-23 00:00 |
Major Shareholding Notification
[기재정정]최대주주변경을수반하는주식담보제공계약체결
|
Korean | 39.1 KB | ||
| 2025-06-13 00:00 |
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
|
Korean | 127.2 KB | ||
| 2025-06-09 00:00 |
Major Shareholding Notification
[기재정정]최대주주변경을수반하는주식담보제공계약체결
|
Korean | 39.1 KB | ||
| 2025-05-26 00:00 |
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
|
Korean | 127.5 KB | ||
| 2025-05-19 00:00 |
Major Shareholding Notification
[기재정정]최대주주변경을수반하는주식담보제공계약체결
|
Korean | 39.1 KB | ||
| 2025-05-15 00:00 |
Quarterly Report
분기보고서 (2025.03)
|
Korean | 2.1 MB | ||
| 2025-05-08 00:00 |
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
|
Korean | 127.2 KB | ||
| 2025-05-07 00:00 |
Major Shareholding Notification
[기재정정]최대주주변경을수반하는주식담보제공계약체결
|
Korean | 39.1 KB |
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Market Data
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
Company
Country
Ticker
View
Designs & makes interconnect, sensor & antenna solutions for automotive, aerospace, IT & mobile markets.
United States of America
APH
United States of America
APH
Designs optical solutions like LEDs and sensors for automotive, medical, and industrial markets.
Austria
AMS
Austria
AMS
Designs high-performance analog and mixed-signal ICs for industrial, auto, and comms markets.
United States of America
ADI
United States of America
ADI
Fabless chip designer of TCONs and SoCs for the global high-resolution display market.
South Korea
123860
South Korea
123860
Provider of outsourced semiconductor packaging and testing (OSAT) for various electronic components.
Japan
6832
Japan
6832
Back-end semiconductor services, including packaging, testing, and inspection equipment.
South Korea
200470
South Korea
200470
Global provider of outsourced semiconductor assembly, testing (OSAT) & manufacturing services.
United States of America
ASX
United States of America
ASX
Supplies advanced high-tech PCBs and lifecycle services to the global electronics industry.
Finland
ACG1V
Finland
ACG1V
Manufactures sanitation products, complex molded parts, and protective semiconductor materials.
Japan
4241
Japan
4241
Manufactures high-end PCBs and IC substrates for mobile, auto, industrial, and medical devices.
Austria
ATS
Austria
ATS