DBG Technology Co., Ltd. — Investor Relations & Filings
DBG Technology Co., Ltd. is a global provider of manufacturing and assembly services for high-precision electronic products. The company specializes in end-to-end solutions encompassing design, engineering, supply chain management, and full-scale production. Its core expertise lies in the assembly of smartphones, tablets, smart wearables, automotive electronics, and network communication equipment. By leveraging advanced automated production lines and integrated testing systems, the company delivers high-volume manufacturing capabilities for global technology brands. Key operations include Printed Circuit Board Assembly (PCBA) and the integration of complex Internet of Things (IoT) devices, supported by a focus on smart manufacturing and technical innovation to meet the requirements of the consumer electronics and telecommunications markets.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2024年度独立董事述职报告（汤新联） | 2025-04-28 | Chinese | |
| 2024年度独立董事述职报告（王文利） | 2025-04-28 | Chinese | |
| 关于收购All Circuits S.A.S.100%股权和TIS Circuits SARL0.003%股权的公告 | 2025-04-28 | Chinese | |
| 2024年度募集资金存放与使用情况的专项报告 | 2025-04-28 | Chinese | |
| 2025年度财务预算报告 | 2025-04-28 | Chinese | |
| 2024年年度报告摘要 | 2025-04-28 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 38796743 | 2024年度独立董事述职报告（汤新联） | 2025-04-28 | Chinese | ||
| 38796727 | 2024年度独立董事述职报告（王文利） | 2025-04-28 | Chinese | ||
| 38796709 | 关于收购All Circuits S.A.S.100%股权和TIS Circuits SARL0.003%股权的公告 | 2025-04-28 | Chinese | ||
| 38796687 | 2024年度募集资金存放与使用情况的专项报告 | 2025-04-28 | Chinese | ||
| 38796664 | 2025年度财务预算报告 | 2025-04-28 | Chinese | ||
| 38796638 | 2024年年度报告摘要 | 2025-04-28 | Chinese | ||
| 38796618 | 关于美国关税对公司影响的自愿性信息披露公告 | 2025-04-09 | Chinese | ||
| 38796598 | 关于变更持续督导保荐代表人的公告 | 2025-04-03 | Chinese | ||
| 38796580 | 关于筹划重大资产重组的进展公告 | 2025-04-03 | Chinese | ||
| 38796562 | 光弘科技：关于公司独立董事收到广东证监局警示函的公告 | 2025-03-21 | Chinese | ||
| 38796549 | 2025年第一次临时股东大会决议公告 | 2025-03-21 | Chinese | ||
| 38796533 | 北京市中伦（深圳）律师事务所关于惠州光弘科技股份有限公司2025年第一次临时股东大会的法律意见书 | 2025-03-21 | Chinese | ||
| 38796499 | 关于重大资产购买的一般风险提示公告 | 2025-03-04 | Chinese | ||
| 38796485 | 关于向All Circuits S.A.S.及GDL Circuits S.A. de C.V.提供借款的公告 | 2025-03-04 | Chinese | ||
| 38796464 | 关于本次交易不构成《上市公司重大资产重组管理办法》第十三条规定的重组上市情形的说明 | 2025-03-04 | Chinese | ||
Market data
Market data not available
Price history
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DBG Technology Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55711/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55711 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55711 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55711 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55711}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for DBG Technology Co., Ltd. (id: 55711)"
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