Compeq Manufacturing Co., Ltd. — Investor Relations & Filings
Compeq Manufacturing Co., Ltd. specializes in the professional manufacturing and design of advanced printed circuit boards (PCBs). Established in 1973, the company focuses on high-complexity solutions, including High-Density Interconnect (HDI) PCBs, Rigid-Flex Printed Circuit Boards (RFC), and multi-layer boards. Its product applications span a wide range of technological sectors, supporting the development of servers, workstations, notebook computers, and desktop systems. Compeq also provides specialized components for mobile communication devices, networking equipment, and high-current power supplies. By leveraging integrated design-for-manufacturing (DFM) capabilities and sophisticated production processes, the company delivers high-performance interconnect technologies that meet the rigorous specifications of global electronics hardware providers.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年2月背書保證與資金貸與 | 2026-03-05 | Chinese | |
| 115年2月營業收入 | 2026-03-05 | Chinese | |
| 公告本公司資金貸與他人之餘額符合公開發行公司資金貸與及背書 保證處理準則第二十二條第一項第一款 | 2026-03-05 | Chinese | |
| 公告本公司對單一企業背書保證餘額符合公開發行公司資金貸與及 背書保證處理準則第二十五條第一項第三款 | 2026-03-05 | Chinese | |
| 公告本公司新增背書保證金額達公開發行公司資金貸與及背書保證 處理準則第二十五條第一項第四款之標準 | 2026-03-05 | Chinese | |
| 公告本公司董事會決議除息基準日 | 2026-03-05 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 33617894 | 115年2月背書保證與資金貸與 | 2026-03-05 | Chinese | ||
| 33617893 | 115年2月營業收入 | 2026-03-05 | Chinese | ||
| 33617896 | 公告本公司資金貸與他人之餘額符合公開發行公司資金貸與及背書 保證處理準則第二十二條第一項第一款 | 2026-03-05 | Chinese | ||
| 33617898 | 公告本公司對單一企業背書保證餘額符合公開發行公司資金貸與及 背書保證處理準則第二十五條第一項第三款 | 2026-03-05 | Chinese | ||
| 33617901 | 公告本公司新增背書保證金額達公開發行公司資金貸與及背書保證 處理準則第二十五條第一項第四款之標準 | 2026-03-05 | Chinese | ||
| 33617903 | 公告本公司董事會決議除息基準日 | 2026-03-05 | Chinese | ||
| 33617905 | 公告本公司董事會決議股利分派情形 | 2026-03-05 | Chinese | ||
| 33617907 | 公告本公司董事會通過民國一一四年第四季合併財務報告 | 2026-03-05 | Chinese | ||
| 33617909 | 華通電腦董事會決議召開115年股東常會公告 | 2026-03-05 | Chinese | ||
| 33617911 | 114年度股利金額(董事會決議) | 2026-03-05 | Chinese | ||
| 33617912 | 公告本公司資金貸與他人之餘額符合公開發行公司資金貸與及背書 保證處理準則第二十二條第一項第一款 | 2026-03-03 | Chinese | ||
| 33617913 | 代子公司華通精密線路板(惠州)股份有限公司公告新增資金貸與 金額達公開發行公司資金貸與及背書保證處理準則第二十二條第 一項第三款 | 2026-03-03 | Chinese | ||
| 33617914 | 代子公司華通精密線路板(惠州)股份有限公司公告 董事會決議召開2025年度股東大會 | 2026-03-03 | Chinese | ||
| 33617916 | 代子公司華通精密線路板(惠州)股份有限公司公告 董事會決議不分配盈餘 | 2026-03-03 | Chinese | ||
| 33617918 | 115年02月董事會成員及持股 | 2026-03-02 | Chinese | ||
Market data
Market data not available
Price history
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Compeq Manufacturing Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52002/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52002 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52002 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52002 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52002}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Compeq Manufacturing Co., Ltd. (id: 52002)"
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