
鸿仕达 — Investor Relations & Filings
Hongshida specializes in providing comprehensive Electronic Manufacturing Services (EMS), focusing on high-precision Printed Circuit Board (PCB) design, fabrication, and assembly (PCBA). The company offers end-to-end solutions including component procurement, Surface Mount Technology (SMT) processing, and final product testing. Serving diverse sectors such as consumer electronics, industrial automation, automotive systems, and telecommunications, Hongshida emphasizes advanced production technology and rigorous quality management systems. Its capabilities extend to rapid prototyping and large-scale manufacturing, ensuring technical reliability and supply chain efficiency for global clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 股票交易异常波动公告 | 2026-04-29 | Chinese | |
| 2026年一季度报告 | 2026-04-28 | Chinese | |
| 第二届董事会第十二次会议决议公告 | 2026-04-28 | Chinese | |
| 证券事务代表任命公告 | 2026-04-28 | Chinese | |
| 关于签署募集资金三方监管协议的公告 | 2026-04-26 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
5 filings
| |||||
| 40138988 | 股票交易异常波动公告 | 2026-04-29 | Chinese | ||
| 40138981 | 2026年一季度报告 | 2026-04-28 | Chinese | ||
| 40138968 | 第二届董事会第十二次会议决议公告 | 2026-04-28 | Chinese | ||
| 40138965 | 证券事务代表任命公告 | 2026-04-28 | Chinese | ||
| 40138952 | 关于签署募集资金三方监管协议的公告 | 2026-04-26 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
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|---|---|---|---|
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HiDeep Inc.
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Highbroad Advanced Material (Hefei) Co., Ltd.
Develops optical components and backlight modules for the g…
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301321 | CN | Manufacturing |
|
Highness Microelectronics Limited
Develops advanced display solutions and embedded systems fo…
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544741 | IN | Manufacturing |
|
Himax Technologies, Inc.
A fabless semiconductor provider of display imaging process…
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HIMX | KY | Manufacturing |
|
HIRAKAWA HEWTECH CORP.
Manufacturer of cables, assemblies, and electronic and medi…
|
5821 | JP | Manufacturing |
|
HIROSE ELECTRIC CO.,LTD.
A global manufacturer of high-performance electronic connec…
|
6806 | JP | Manufacturing |
|
HI-TREND TECHNOLOGY (SHANGHAI) CO.,LTD
Fabless semiconductor firm specializing in energy metering …
|
688391 | CN | Manufacturing |
鸿仕达 via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58737/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58737 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58737 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58737 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58737}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for 鸿仕达 (id: 58737)"
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