Bomin Electronics Co.,Ltd. — Investor Relations & Filings
About Bomin Electronics Co.,Ltd.
Bomin Electronics Co., Ltd. focuses on the design, manufacture, and distribution of high-precision printed circuit boards (PCBs). Its core product range encompasses high-density interconnect (HDI) boards, multilayer PCBs, flexible circuits, rigid-flex boards, and specialized substrates including high-frequency, high-speed, and metal-core designs. The company provides interconnect solutions for various applications such as automotive systems, communication infrastructure, industrial control, medical devices, and consumer electronics. By leveraging advanced manufacturing technologies and research capabilities, the company delivers high-reliability components tailored for complex electronic architectures and high-performance hardware requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 博敏电子关于2026年度对外担保额度预计的公告 | 2026-04-27 | Chinese | |
| 博敏电子2026年第一季度报告 | 2026-04-27 | Chinese | |
| 博敏电子2025年度董事会审计委员会履职情况报告 | 2026-04-27 | Chinese | |
| 博敏电子关于2025年度募集资金存放、管理与实际使用情况的专项报告 | 2026-04-27 | Chinese | |
| 博敏电子关于召开2025年年度股东会的通知 | 2026-04-27 | Chinese | |
| 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2026-04-24 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 37534074 | 博敏电子关于2026年度对外担保额度预计的公告 | 2026-04-27 | Chinese | ||
| 37534071 | 博敏电子2026年第一季度报告 | 2026-04-27 | Chinese | ||
| 37534053 | 博敏电子2025年度董事会审计委员会履职情况报告 | 2026-04-27 | Chinese | ||
| 37534045 | 博敏电子关于2025年度募集资金存放、管理与实际使用情况的专项报告 | 2026-04-27 | Chinese | ||
| 37534033 | 博敏电子关于召开2025年年度股东会的通知 | 2026-04-27 | Chinese | ||
| 37534021 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2026-04-24 | Chinese | ||
| 37534015 | 博敏电子2025年度业绩预告更正公告 | 2026-04-23 | Chinese | ||
| 37534014 | 博敏电子关于为子公司申请银行授信提供担保的公告 | 2026-04-07 | Chinese | ||
| 37534007 | 财通证券股份有限公司关于博敏电子股份有限公司2026年限制性股票与股票期权激励计划调整及首次授予相关事项之独立财务顾问报告 | 2026-04-03 | Chinese | ||
| 37534005 | 博敏电子第五届董事会薪酬与考核委员会关于公司2026年限制性股票与股票期权激励计划首次授予的激励对象(首次授予日)的核查意见 | 2026-04-03 | Chinese | ||
| 37534000 | 博敏电子关于向2026年限制性股票与股票期权激励计划首次授予的激励对象授予限制性股票与股票期权的公告 | 2026-04-03 | Chinese | ||
| 37533999 | 博敏电子关于调整2026年限制性股票与股票期权激励计划相关事项的公告 | 2026-04-03 | Chinese | ||
| 37533996 | 博敏电子2026年限制性股票与股票期权激励计划激励对象名单(授予日) | 2026-04-03 | Chinese | ||
| 37533995 | 广东信达律师事务所关于博敏电子股份有限公司2026年限制性股票与股票期权激励计划调整及首次授予相关事项的法律意见书 | 2026-04-03 | Chinese | ||
| 37533994 | 博敏电子第五届董事会第二十九次会议决议公告 | 2026-04-03 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
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CHENGDU SPACEON ELECTRONICS CO., LTD.
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CHENGDU TIANJIAN TECHNOLOGY CO., LTD.
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Bomin Electronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Bomin Electronics Co.,Ltd. (id: 57911)"
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