Bomin Electronics Co.,Ltd. — Investor Relations & Filings
About Bomin Electronics Co.,Ltd.
Bomin Electronics Co., Ltd. focuses on the design, manufacture, and distribution of high-precision printed circuit boards (PCBs). Its core product range encompasses high-density interconnect (HDI) boards, multilayer PCBs, flexible circuits, rigid-flex boards, and specialized substrates including high-frequency, high-speed, and metal-core designs. The company provides interconnect solutions for various applications such as automotive systems, communication infrastructure, industrial control, medical devices, and consumer electronics. By leveraging advanced manufacturing technologies and research capabilities, the company delivers high-reliability components tailored for complex electronic architectures and high-performance hardware requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 博敏电子2025年半年度报告摘要 | 2025-08-22 | Chinese | |
| 博敏电子2025年半年度报告 | 2025-08-22 | Chinese | |
| 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2025-07-18 | Chinese | |
| 博敏电子为子公司申请银行授信提供担保的公告 | 2025-07-17 | Chinese | |
| 博敏电子关于终止股权收购框架协议的公告 | 2025-07-11 | Chinese | |
| 博敏电子股东减持股份计划公告 | 2025-07-11 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 37532868 | 博敏电子2025年半年度报告摘要 | 2025-08-22 | Chinese | ||
| 37532855 | 博敏电子2025年半年度报告 | 2025-08-22 | Chinese | ||
| 37532823 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2025-07-18 | Chinese | ||
| 37532813 | 博敏电子为子公司申请银行授信提供担保的公告 | 2025-07-17 | Chinese | ||
| 37532804 | 博敏电子关于终止股权收购框架协议的公告 | 2025-07-11 | Chinese | ||
| 37532793 | 博敏电子股东减持股份计划公告 | 2025-07-11 | Chinese | ||
| 37532786 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2025-07-07 | Chinese | ||
| 37532780 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2025-07-01 | Chinese | ||
| 37532756 | 博敏电子2024年员工持股计划第二次持有人会议决议公告 | 2025-07-01 | Chinese | ||
| 37532749 | 博敏电子关于2024年员工持股计划股票清算完毕暨提前终止的公告 | 2025-07-01 | Chinese | ||
| 37532738 | 博敏电子为子公司申请银行授信提供担保的公告 | 2025-06-27 | Chinese | ||
| 37532733 | 博敏电子关于2024年员工持股计划股票出售完毕的公告 | 2025-06-26 | Chinese | ||
| 37532729 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2025-06-25 | Chinese | ||
| 37532717 | 博敏电子为子公司申请银行授信提供担保的公告 | 2025-06-23 | Chinese | ||
| 37532709 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2025-06-23 | Chinese | ||
Market data
Market data not available
Price history
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Bomin Electronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Bomin Electronics Co.,Ltd. (id: 57911)"
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