AP Memory Technology Corporation — Investor Relations & Filings
AP Memory Technology Corporation is a global fabless semiconductor company specializing in the research, development, and marketing of customized memory and IP solutions. The company focuses on low to mid-density RAM solutions, including a comprehensive range of IoT RAM such as low-pin-count and low-power QSPI, OPI, and HPI PSRAM. Its product portfolio features specialty technologies like Very High-bandwidth Memory (VHM) and Silicon Capacitors (S-SiCap) designed to enhance performance in AI and high-performance computing applications. AP Memory serves diverse markets including smart home devices, wearables, mobile electronics, and display interfaces. By leveraging a fabless business model, the company provides flexible, optimized memory architectures that meet the specific power and space constraints of modern IoT and edge computing ecosystems.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年4月營業收入 | 2026-05-05 | Chinese | |
| 115年04月內部人持股異動(事後) | 2026-05-05 | Chinese | |
| 115年04月董事會成員及持股 | 2026-05-05 | Chinese | |
| 115年05月法人說明會簡報 | 2026-04-28 | Chinese | |
| 公告本公司115年第1季財務報告董事會預計召開日期為115年 5月6日 | 2026-04-28 | Chinese | |
| 係因本公司有價證券於集中交易市場達公布注意交易資訊標準, 故公布相關財務業務等重大訊息,以利投資人區別瞭解。 | 2026-04-20 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 41461121 | 115年4月營業收入 | 2026-05-05 | Chinese | ||
| 41459591 | 115年04月內部人持股異動(事後) | 2026-05-05 | Chinese | ||
| 41457231 | 115年04月董事會成員及持股 | 2026-05-05 | Chinese | ||
| 38028085 | 115年05月法人說明會簡報 | 2026-04-28 | Chinese | ||
| 38028263 | 公告本公司115年第1季財務報告董事會預計召開日期為115年 5月6日 | 2026-04-28 | Chinese | ||
| 34689322 | 係因本公司有價證券於集中交易市場達公布注意交易資訊標準, 故公布相關財務業務等重大訊息,以利投資人區別瞭解。 | 2026-04-20 | Chinese | ||
| 34686660 | 114年第4季財務報告書 — 202504_6531_AIC.pdf | 2026-04-20 | English | ||
| 34686645 | 114年第4季財務報告書 — 202504_6531_AIA.pdf | 2026-04-20 | Chinese | ||
| 34686638 | 114年第4季財務報告書 — 202504_6531_AI3.pdf | 2026-04-20 | Chinese | ||
| 34686628 | 114年第4季財務報告書 — 202504_6531_AI1.pdf | 2026-04-20 | Chinese | ||
| 34686620 | 114年第4季財務報告書 — 202503_6531_AIA.pdf | 2026-04-20 | Chinese | ||
| 34686612 | 114年第4季財務報告書 — 202503_6531_AI1.pdf | 2026-04-20 | Chinese | ||
| 34686607 | 114年第4季財務報告書 — 202502_6531_AIA.pdf | 2026-04-20 | Chinese | ||
| 34686595 | 114年第4季財務報告書 — 202501_6531_AIA.pdf | 2026-04-20 | Chinese | ||
| 34686585 | 114年第4季財務報告書 — 202501_6531_AI1.pdf | 2026-04-20 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
Apex International Co., Ltd.
Produces multi-layer PCBs for consumer, computing, and auto…
|
4927 | TW | Manufacturing |
|
APT Electronics Co., Ltd.
Integrates advanced LED technology into intelligent vision …
|
2551 | HK | Manufacturing |
|
Arizon RFID Technology
Global designer and manufacturer of high-performance RFID i…
|
6863 | TW | Manufacturing |
|
Artificial Electronics Intelligent Material Limited
Develops advanced functional and intelligent materials for …
|
526443 | IN | Manufacturing |
|
ASE Technology Holding Co., Ltd.
Provider of semiconductor manufacturing services specializi…
|
ASX | TW | Manufacturing |
|
ASE Technology Holding Co., Ltd.
Global provider of semiconductor packaging, testing, and ma…
|
3711 | TW | Manufacturing |
|
Asia Vital Components Co., Ltd.
Global provider of thermal management solutions and cooling…
|
3017 | TW | Manufacturing |
|
ASMedia Technology Inc
Designs and develops high-speed interface ICs for computing…
|
5269 | TW | Manufacturing |
|
Aspocomp Group Oyj
Manufacturer of advanced Printed Circuit Boards for demandi…
|
ACG1V | FI | Manufacturing |
|
ASR MICROELECTRONICS CO., LTD.
Fabless designer of wireless communication chips and high-p…
|
688220 | CN | Manufacturing |
AP Memory Technology Corporation via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52578/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52578 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52578 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52578 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52578}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for AP Memory Technology Corporation (id: 52578)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.