Test Research, Inc. www.tri.com.tw

May 2022

Test Research, Inc.

Establishment: April, 1989
Founder & CEO: Jason Chen
Capital: TWD 2362 million
( USD 78 million)

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Main Product Line

IT(Image Tester)

 SPI(Solder Paste Inspection)  Pre-reflow AOI / Post-reflow AOI  AXI(Automatic X-ray Inspection)

BT(In-Circuit Board Tester)
MDA
ICT

One Stop Solution Provider in PCBA Production

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Major Competitors

 Korea: Koh Young  Japan: Omron  China: Jutze/Sinic-Tek/Holly  Malaysia: Vitrox  USA: Keysight/Teradyne  Europe: Viscom/SPEA

Global Service Network

More than 3000 customers have been serviced through worldwide partners More than 50 distributors and Rep. worldwide.

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Electronic Industry/Revenue Movement

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4
8 Industrial/Defense
19
Automobile
25
12
Household/Game
12
7
Phone/Peripheral
13
25
6
Network
25 NB/Tablet/Peripheral
20
Semiconductor/IC
11 12
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202101-202104

202201-202204

10000

Annual Sales

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NTD Million
-
9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
Improved
Decline of PC/NB
Increase of smart product
application mobile devices competitiveness
7000
application
- -
Economic
Rush capacity
5870
6000 buy triggered by recovery
5607
economic recovery 5388 - Blue-ocean
4919 4951
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 3778 3894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 1553 1470
1000
569 [777 ] [902 ]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20 '21
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EPS

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7
6.43
6
5.34
5.03 5.02
4.87
5 4.67 4.63
4.48 4.51
4.23
4 4.45
3.97
3 3.41
3.19
2.53
2.52
2 2.17
1.82
1
1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20 '21
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CONFIDENTIAL

Red & Blue-ocean Market Movement in Revenue

NTD Million

Blue-ocean Red-ocean Gross margin %

8,000 80% Blue-ocean: - 3D AOI 7,000 - Dimensional metrology for electronic parts - 70% Semiconductor process 6,000 - AXI - BT 5,000 57% 54% 58% 60% 55% 55% 53% 1,825 4,000 53% 53% (~Q1) 1,856[1,453 1,689 ] 3,123 50% 3,000 46% 1,592 1,517 4,955 3,782 750 2,000 3,262 3,063 2,934 (67%) 40% (66%) (62%) 2,009 (67%) 1,000 1,631 1,583 1,710 (56%) 914 (34%) (51%) (70%) (16%) 0 30% 2014 2015 2016 2017 2018 2019 2020 2021 2022.1

TRI 3D AOI Product Roadmap

TR7700QB SII TR7700Q(L) SII (DL) - -12M/15um 12M/15um -12M/12um TR7500QE Plus - -12M/10, 12, 15um 12M/10um + 4 Sideview - 12M/5.5um TR7700(L) QE -12M/15,10um - TR7700QM SII 12M/5.5um TR7500(L) QE -12M/15,10um+4 Sideview • TR7700 QE-S -12M/5.5um,3.45um AOM & AI SW module • • 4x DLP + Omni color RGBW lighting Optional Laser module • • Optional DFF module Optional Laser module • Optional DFF module

2019 2020

2021

2022

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Confidential

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NEW
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TR7500QE Plus Highlight

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Multi-Angle 3D Side View Metrology-Grade Inspection

Industry-Leading Speed with High Accuracy Resolution

Confidential

TRI AOI Product Application

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SMT Components
0201 >> 15 um
01005 >> 10 um
TR7700Q(M) SII
Mini LED Application
2D TR7700 SIII Plus @ 5.5 um
3D TR7700Q(M) SII @ 5.5um
3D TR7700QE-S @ 5.5 / 3.45 um
SiP/Underfill + Laser @ 10/20 um
TR7700QE-S
Wafer
TR7700QE-S +IR
@ 3.45 um
TR7960A (DFF)
Die Bond
+ Laser @ 10/20 um
Inspection
Wire Bond
+ DFF @ 1.0 / 0.5 um
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TR7700QE-S 3D AOI Highlight

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Supports 3.45 / 5.5um Ultra High Resolution

Inspection Solutions for Semiconductor Packaging Level: SMD Bump Die / Wire Bonding Underfill

Confidential

Upgrade DFF 3D Technology

 Optimal focus position  Clearer 2D Images  Sharper images  Shadow-free 3D Image

0.5 µm 1 µm Ultra High Resolution

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Semiconductor -Wire bond

SMT –Solder joint

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Integration of Vision Technologies for the Demands `：` - Dimensional Metrology for Electronic Parts - Semiconductor Manufacturing/Packaging Process

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Calibration
校正技術
Laser Fringe DFF
TRI AOI
Metrology
Linear
共線性
Linearity
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TRI Integrated Total Solution

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Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
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TRI New Optical Measurement Functions (AOM)

 UI: New designed and friendly user interface

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 Features: More complete measurement functions will be available

Measure Feature Construction Method Measure Target Assign System

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 High Flexibility: Multi-Layer measurements

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TRI’s SPI Innovations

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Fast Inspection Precision Smart
Speed Inspection Factory
5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
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Confidential

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NEW
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TR7007D/Q Plus Series SPI

New Features

Improved Inspection Stability and Capability

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Enhanced 2D Light Improved Imaging

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Full Size Support Pin (Optional)

Easy Maintenance

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New Log Interface

Easy hardware Upgrading design

NEW Motion Controller

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NEW
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TR7007 SII Ultra Series SPI

Next Generation of the Award Winning TR7007 SII Plus

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Confidential
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New Mechanical Structure 13%[+ ] Minimal Vibration, More Rigid Frame Improved GR&R

New Motion Controller Flexible Communication Protocol Max. Solder Height Dual Fringe Pattern Projection 420 μm / 385 μm Higher Top Clearance 50mm * Compared to TR7007 SII Plus

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A Full Line of 3D In-Line AXI

NEW

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TR7600(LL/TL) SIII

NEW

TR7600F3D(LL) SII

A new generation of TRI’s hallmark inline PCBA inspection solutions. Designed for industry’s fastest high resolution imaging speed with greatly improved image quality in the advanced automatic X-ray inspection.

Faster inspection speed, ultra high resolution 3D CT X-ray inspection, highest image quality. maximize production yields on any production line.

* Linear Motion

* Circular Motion

(for Line Scan)

(for Area Scan)

TRI AXI - BGA Inspection Application

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ADAS, Radar Module, Product Type Examples Communication Module Inspection Criteria BGA Void, Open TRI AXI Application 3D CT Inspection

3D CT (Computer Tomography)

TR7600F3D SII Images

TRI’s ICT/BT Applications

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Automation Laptops

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White Goods

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Flex Boards

Automobile

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Smart Factory

Customized FCT

Confidential

TR5001 SII Series – The Smart ICT/BT Solution

Multi/Merge Core Parallel Testing
Improved Test Accuracy and Capability
New and Improved Test Modules
Intelligent Software Interface
QDI Fixture Interface
Inline and Manual Handler
In System LED Analyzer

Confidential

High Density Pin Count ICT TR8100H SII / TR8100HL SII

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Cable-less High Pin Count ATE NEW
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Original Test Points. New SII Model Model TR8100LV 3584 pins 7056 pins ~~SII~~ TR8100LLV 5632 pins 11088 pins

Confidential

TR8100H SII ICT

- Target Market Applications

• Server/Data Center/Networking main boards

Test pins range 3000~5000
5G Base Stations

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NEW
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Charging facility

Smart Factory Solutions

Big Data Ready

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Smart Monitoring

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TRI Supports Closed Loop Solutions

TRI SPI, AOI, AXI Inspection Integration IPC CFX(data)/ HERMES(M2M)

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Data & Image Skip board
Feedback Feedforward
Feedback data
SPI Pre-reflow AOI Post-reflow AOI AXI
TR7007Q Plus TR7710 TR7700Q SII TR7600 SIII
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YMS 4.0 Yield Management System

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•Improvement Monitoring
•Real-Time Inspection Status
•Support Quality Improvement
•SPC and Productivity Monitoring
•Output Reports to MES/SFCS
•Top 5 or 10 defects & Images
•PDCA improvement cycle
•Issue Drill Down line, station or process

Industry 4.0 Solution

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Confidential

TRI's AI Application Can be divided in Two Phases

AI Defect Detection / Character Recognition / Visual Inspection / Measurement assistance Inspection PhasePhase Advantage: Improve Inspection Quality and Reduce False Calls

RS Phase

Repair Station Defect Classification and Re-Inspection Advantage: Reduce the workload of manual Re-Inspection

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AOI
SPI
AXI
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TRI Inspection Solutions
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TRI AI Station
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Repair Station(s)

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TRI’s AI Solutions

1. AI Smart Programing

2. AI Station: Client-Server AI Inspection Fine-tuning

3. AI Verify Host: AI Repair Station

4. : AI Inspection

• AI OCV/OCR • AI Defect inspection • AI Cosmetic Inspection • AI Foreign Materials

TRI AI Roadmap

Short Term Mid-Term

Long Term

 Technical cultivation

 Expansion

 Vision

 Training Tool- Algorithms

 Faster and more accurate  Easier and quicker training  Enlarge the scale

Zero escape and false call
Unmanned AOI

 AI Station- Computation Power  Built-in AI Networks- Big Data

 AI Applications:

♦ Auto Programming ♦ OCR/Solder Joint/Cosmetic inspection/Alignment

♦ Smart Tuning ♦ Anomaly Detection ♦ 3D Reconstruction

♦ New SW Platform ♦ Internalized AI from designing

♦ RS review

♦ Semi: Wire bond

In-house RD Team

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.
•Optical Dept. • system S/W
• Mechanical Dept. YMS, R/S
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•PLC control •Lighting control

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IT
BT
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200[+] RD

Outside Support

Department of Computer science, National Taiwan Univ. - Image processing / Understanding

Department of Power Mechanical, Tsing Hua Univ., Taiwan - X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ CT algorithm Center of Measurement Standards, Industrial Technology Research Institute Taiwan

Recent Awards

 2016 Global Technology Award  2017 Circuits Assembly NPI Award  2017 EM Asia Innovation Award  2018 Circuits Assembly NPI Award  2018 EM Asia Best Supplier Award  2019 Global Technology Award  2019 EM Asia Outstanding Product Award  2020 Global Technology Award  2021 EM Asia Innovation Award  2021 Global Technology Award

TRI’s Company Milestones:

https://www.tri.com.tw/tw/about/about-21-1-2.html

Safe Harbor Notice

TRI’s statements of its current expectations are forward looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.

Better Testing Better Quality

THANK YOU! For more information about

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Test Research, Inc. Please visit:

www.tri.com.tw

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AI assistant

TRI — Investor Presentation 2022

52263_rns_2022-05-18_d7387521-023e-4f8a-a2c3-d38706690959.pdf

Test Research, Inc. www.tri.com.tw